-
公开(公告)号：US10667429B2
公开(公告)日：2020-05-26
申请号：US15699713
申请日：2017-09-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Shakti Singh Chauhan , Hendrik Pieter Jacobus De Bock , Graham Charles Kirk , Stanton Earl Weaver, Jr. , David Shannon Slaton , Tao Deng , Pramod Chamarthy
Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.
-
公开(公告)号：US09333599B2
公开(公告)日：2016-05-10
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
-
Patent Agency Ranking
公开(公告)号：US20150173243A1
公开(公告)日：2015-06-18
申请号：US14106207
申请日：2013-12-13
Applicant: General Electric Company
Inventor： Shakti Singh Chauhan , Hendrik Pieter Jacobus de Bock , Graham Charles Kirk , Stanton Earl Weaver, JR. , David Shannon Slaton , Tao Deng , Pramod Chamarthy
CPC classification number: H05K7/20336 , F28D15/0275 , F28D15/04 , H01L21/4882 , H01L23/36 , H01L23/40 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure having a first support end, a second support end, and a support portion extending between the first support end and the second support end. The support structure further includes a plurality of first projections protruding from a portion of a surface of the support structure, corresponding to the support portion. Further, the heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is coupled to a surface of the support structure.
Abstract translation: 公开了一种用于从电路卡的热部件散热的热交换组件。 热交换组件包括支撑结构，其具有第一支撑端，第二支撑端和在第一支撑端和第二支撑端之间延伸的支撑部分。 支撑结构还包括从支撑结构的表面的一部分突出的多个第一突起，其对应于支撑部分。 此外，热交换组件包括具有设置在壳体内的壳体和芯的蒸气室。 蒸气室耦合到支撑结构的表面。
-
公开(公告)号：US20140273796A1
公开(公告)日：2014-09-18
申请号：US13871353
申请日：2013-04-26
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Mark Howard Giammattei , Stanton Earl Weaver , Pramod Chamarthy
IPC: F24F7/007
CPC classification number: F24F7/007 , F04B23/10 , F04B43/046 , F04F5/16 , H01L23/467 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
Abstract: A synthetic jet driven cooling device includes at least one synthetic jet actuator to generate and project a series of fluid vortices. A manifold coupled to the synthetic jet actuator(s) receives the fluid vortices and generates a primary air stream. An air amplifier connected to the manifold by a connecting pipe receives the primary air stream. The air amplifier includes an air intake oriented perpendicular to the connecting pipe and an air outlet positioned opposite the air intake, with a venturi section positioned between the air intake and air outlet that has a diameter smaller than the air intake diameter. A low pressure region in a center of the venturi section entrains a surrounding air in through the air intake to generate a secondary air stream that combines with the primary air stream to generate a combined air flow that flows through the venturi and exits the air outlet.
Abstract translation: 合成喷射驱动冷却装置包括至少一个合成射流致动器，以产生和投影一系列流体旋涡。 耦合到合成射流致动器的歧管接收流体涡流并产生一次空气流。 通过连接管连接到歧管的空气放大器接收一次空气流。 空气放大器包括垂直于连接管定向的进气口和与进气口相对定位的空气出口，文丘里管部分位于进气口和空气出口之间，其直径小于进气口直径。 文丘里管部分中心的一个低压区域将通过进气口的周围空气带入，以产生与一次空气流相结合的二次空气流，以产生流经文丘里管并离开出气口的组合气流。
-
公开(公告)号：US09976762B2
公开(公告)日：2018-05-22
申请号：US13871353
申请日：2013-04-26
Applicant: General Electric Company
Inventor： Mark Howard Giammattei , Stanton Earl Weaver , Pramod Chamarthy
IPC: F24F7/007 , F04B43/04 , F04F5/16 , H01L23/467 , F04B23/10
CPC classification number: F24F7/007 , F04B23/10 , F04B43/046 , F04F5/16 , H01L23/467 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
Abstract: A synthetic jet driven cooling device includes at least one synthetic jet actuator to generate and project a series of fluid vortices. A manifold coupled to the synthetic jet actuator(s) receives the fluid vortices and generates a primary air stream. An air amplifier connected to the manifold by a connecting pipe receives the primary air stream. The air amplifier includes an air intake oriented perpendicular to the connecting pipe and an air outlet positioned opposite the air intake, with a venturi section positioned between the air intake and air outlet that has a diameter smaller than the air intake diameter. A low pressure region in a center of the venturi section entrains a surrounding air in through the air intake to generate a secondary air stream that combines with the primary air stream to generate a combined air flow that flows through the venturi and exits the air outlet.
-
公开(公告)号：US20150181763A1
公开(公告)日：2015-06-25
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, JR. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
-
7.发明申请HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCIATED METHOD OF FABRICATION 审中-公开具有三维投影的热传递装置和相关的制造方法公开(公告)号：US20150090428A1
公开(公告)日：2015-04-02
申请号：US14041276
申请日：2013-09-30
Applicant: General Electric Company
Inventor： Shakti Singh Chauhan , Joo Han Kim , William Harold King , Pramod Chamarthy , Tao Deng
CPC classification number: F28D15/046 , Y10T29/49353
Abstract: A heat transfer device filled with a working fluid, includes a casing and a wick disposed within the casing. The wick includes a first sintered layer, a second sintered layer, and a third sintered layer. The first sintered layer is disposed proximate to an inner surface of the casing and the second sintered layer is disposed on the first sintered layer. The second sintered layer includes a first set of 3-dimensional sintered projections and a second set of 3-dimensional sintered projections disposed along a portion of the wick. Further, the third sintered layer is disposed on at least a portion of the second sintered layer. The heat transfer device includes at least one first sintered particle of the first sintered layer, which is smaller in size than at least one second pore of the second sintered layer.
Abstract translation: 填充有工作流体的传热装置包括壳体和设置在壳体内的芯。 芯包括第一烧结层，第二烧结层和第三烧结层。 第一烧结层设置在壳体的内表面附近，第二烧结层设置在第一烧结层上。 第二烧结层包括第一组三维烧结突起和沿着芯的一部分设置的第二组三维烧结突起。 此外，第三烧结层设置在第二烧结层的至少一部分上。 传热装置包括至少一个第一烧结层的第一烧结颗粒，其尺寸小于第二烧结层的至少一个第二孔。
-
-
-
-
-
-
Search Results
7
records
(took 0.02 seconds)
