公开(公告)号：US20140185778A1

公开(公告)日：2014-07-03

申请号：US13730303

申请日：2012-12-28

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Susanne Madeline Lee ,  Raj Bahadur ,  Sudeep Mandal

IPC: H01J35/12

CPC classification number: G21K1/06 ,  H01J5/18 ,  H01J35/12 ,  H01J2235/086 ,  H01J2235/087 ,  H01J2235/088

Abstract: In one embodiment, an X-ray source is provided that includes one or more electron emitters configured to emit one or more electron beams and one or more source targets configured to receive the one or more electron beams emitted by the one or more electron emitters and, as a result of receiving the one or more electron beams, to emit X-rays. Each source target of the X-ray source includes a first layer having one or more first materials; and a second layer in thermal communication with the first layer and having one or more second materials. The first layer is positioned closer to the one or more emitters than the second layer, the first material has a higher overall thermal conductivity than the second layer, and the second layer produces the majority of the X-rays emitted by the source target.

Abstract translation: 在一个实施例中，提供了一种X射线源，其包括被配置为发射一个或多个电子束的一个或多个电子发射器和被配置为接收由一个或多个电子发射器发射的一个或多个电子束的一个或多个源极，以及 作为接收一个或多个电子束的结果，发射X射线。 X射线源的每个源目标包括具有一个或多个第一材料的第一层; 以及与第一层热连通并具有一个或多个第二材料的第二层。 第一层被定位成比第二层更靠近一个或多个发射体，第一材料具有比第二层更高的整体热导率，第二层产生由源靶发射的大部分X射线。

公开(公告)号：US08912643B2

公开(公告)日：2014-12-16

申请号：US13709469

申请日：2012-12-10

Applicant: General Electric Company

Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Raj Bahadur ,  Eric Ayres Browne ,  Gary Dwayne Mandrusiak

IPC: H01L23/34 ,  F28F13/18 ,  H01L23/473

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。

公开(公告)号：US09008278B2

公开(公告)日：2015-04-14

申请号：US13730303

申请日：2012-12-28

Applicant: General Electric Company

Inventor： Susanne Madeline Lee ,  Raj Bahadur ,  Sudeep Mandal

IPC: H01J35/06 ,  B82Y99/00 ,  H01J5/18 ,  G21K1/06 ,  H01J35/12

CPC classification number: G21K1/06 ,  H01J5/18 ,  H01J35/12 ,  H01J2235/086 ,  H01J2235/087 ,  H01J2235/088

Abstract: In one embodiment, an X-ray source is provided that includes one or more electron emitters configured to emit one or more electron beams and one or more source targets configured to receive the one or more electron beams emitted by the one or more electron emitters and, as a result of receiving the one or more electron beams, to emit X-rays. Each source target of the X-ray source includes a first layer having one or more first materials; and a second layer in thermal communication with the first layer and having one or more second materials. The first layer is positioned closer to the one or more emitters than the second layer, the first material has a higher overall thermal conductivity than the second layer, and the second layer produces the majority of the X-rays emitted by the source target.

Abstract translation: 在一个实施例中，提供了一种X射线源，其包括被配置为发射一个或多个电子束的一个或多个电子发射器和被配置为接收由一个或多个电子发射器发射的一个或多个电子束的一个或多个源极，以及 作为接收一个或多个电子束的结果，发射X射线。 X射线源的每个源目标包括具有一个或多个第一材料的第一层; 以及与第一层热连通并具有一个或多个第二材料的第二层。 第一层被定位成比第二层更靠近一个或多个发射体，第一材料具有比第二层更高的整体热导率，第二层产生由源靶发射的大部分X射线。

公开(公告)号：US20140160677A1

公开(公告)日：2014-06-12

申请号：US13709469

申请日：2012-12-10

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Raj Bahadur ,  Eric Ayres Browne ,  Gary Dwayne Mandrusiak

IPC: F28F13/18 ,  H01L23/46 ,  H05K7/20 ,  H01L21/50

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。

公开(公告)号：US20140151009A1

公开(公告)日：2014-06-05

申请号：US13691138

申请日：2012-11-30

Applicant: General Electric Company

Inventor： Raj Bahadur ,  David Mulford Shaddock

IPC: F28F21/08

CPC classification number: F28F21/089 ,  C23C14/16 ,  C23C14/225 ,  F28F13/00 ,  F28F21/00 ,  F28F2013/005 ,  Y10T29/4935

Abstract: An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate.

Abstract translation: 公开了一种组装制品的制品和方法。 组装方法包括在热源和散热器之间定位预制的热界面元件。 预制的热界面元件包括铟衬底和设置在铟衬底上的多个纳米脉冲。