公开(公告)号：US09760673B2

公开(公告)日：2017-09-12

申请号：US15012331

申请日：2016-02-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Eric D. Hunt-Schroeder ,  John R. Goss ,  Igor Arsovski ,  Paul J. Grzymkowski

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F2217/64

Abstract: Various embodiments include approaches for analyzing a customer design for an application specific integrated circuit (ASIC). In some cases, an approach includes: determining performance requirements of the customer design; querying a test screen database for the performance requirements of the customer design, the test screen database having failure thresholds and associated test screens for detecting the failure thresholds for a set of ASIC devices; generating a filter database including select failure thresholds and associated test screens for the performance requirements of the customer design; and selecting a set of test screens from the filter database based upon a yield cost criteria in forming the ASIC.

公开(公告)号：US20170276726A1

公开(公告)日：2017-09-28

申请号：US15621529

申请日：2017-06-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Igor Arsovski ,  Jeanne P. Bickford ,  Paul J. Grzymkowski ,  Susan K. Lichtensteiger ,  Robert J. McMahon ,  Troy J. Perry ,  David M. Picozzi ,  Thomas G. Sopchak

IPC: G01R31/28 ,  G01R21/133 ,  G01R31/317 ,  G06F17/50

CPC classification number: G01R31/2894 ,  G01R21/133 ,  G01R31/31718 ,  G06F17/5045 ,  G06F2217/78

Abstract: Disclosed is a method wherein selective voltage binning and leakage power screening of integrated circuit (IC) chips are performed. Additionally, pre-test power-optimized bin reassignments are made on a chip-by-chip basis. Specifically, a leakage power measurement of an IC chip selected from a voltage bin can is compared to a bin-specific leakage power screen value of the next slower voltage bin. If the leakage power measurement is higher, the IC chip will be left in the voltage bin to which it is currently assigned. If the leakage power measurement is lower, the IC chip will be reassigned to that next slower voltage bin. These processes can be iteratively repeated until no slower voltage bins are available or the IC chip cannot be reassigned. IC chips can subsequently be tested according to testing parameters, including the minimum test voltages, associated with the voltage bins to which they are finally assigned.

公开(公告)号：US10295592B2

公开(公告)日：2019-05-21

申请号：US15621529

申请日：2017-06-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Igor Arsovski ,  Jeanne P. Bickford ,  Paul J. Grzymkowski ,  Susan K. Lichtensteiger ,  Robert J. McMahon ,  Troy J. Perry ,  David M. Picozzi ,  Thomas G. Sopchak

IPC: G01R31/28 ,  G01R21/133 ,  G06F17/50 ,  G01R31/317

Abstract: Disclosed is a method wherein selective voltage binning and leakage power screening of integrated circuit (IC) chips are performed. Additionally, pre-test power-optimized bin reassignments are made on a chip-by-chip basis. Specifically, a leakage power measurement of an IC chip selected from a voltage bin can is compared to a bin-specific leakage power screen value of the next slower voltage bin. If the leakage power measurement is higher, the IC chip will be left in the voltage bin to which it is currently assigned. If the leakage power measurement is lower, the IC chip will be reassigned to that next slower voltage bin. These processes can be iteratively repeated until no slower voltage bins are available or the IC chip cannot be reassigned. IC chips can subsequently be tested according to testing parameters, including the minimum test voltages, associated with the voltage bins to which they are finally assigned.

公开(公告)号：US09759767B2

公开(公告)日：2017-09-12

申请号：US14695112

申请日：2015-04-24

Applicant: GLOBALFOUNDRIES INC.

Inventor： Igor Arsovski ,  Jeanne P. Bickford ,  Paul J. Grzymkowski ,  Susan K. Lichtensteiger ,  Robert J. McMahon ,  Troy J. Perry ,  David M. Picozzi ,  Thomas G. Sopchak

IPC: G01R31/00 ,  G01R31/28 ,  G01R21/133 ,  G06F17/50 ,  G01R31/317

CPC classification number: G01R31/2894 ,  G01R21/133 ,  G01R31/31718 ,  G06F17/5045 ,  G06F2217/78

Abstract: Disclosed is a method wherein selective voltage binning and leakage power screening of integrated circuit (IC) chips are performed. Additionally, pre-test power-optimized bin reassignments are made on a chip-by-chip basis. Specifically, a leakage power measurement of an IC chip selected from a voltage bin can is compared to a bin-specific leakage power screen value of the next slower voltage bin. If the leakage power measurement is higher, the IC chip will be left in the voltage bin to which it is currently assigned. If the leakage power measurement is lower, the IC chip will be reassigned to that next slower voltage bin. These processes can be iteratively repeated until no slower voltage bins are available or the IC chip cannot be reassigned. IC chips can subsequently be tested according to testing parameters, including the minimum test voltages, associated with the voltage bins to which they are finally assigned.

公开(公告)号：US20170220727A1

公开(公告)日：2017-08-03

申请号：US15012331

申请日：2016-02-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Eric D. Hunt-Schroeder ,  John R. Goss ,  Igor Arsovski ,  Paul J. Grzymkowski

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F2217/64

Abstract: Various embodiments include approaches for analyzing a customer design for an application specific integrated circuit (ASIC). In some cases, an approach includes: determining performance requirements of the customer design; querying a test screen database for the performance requirements of the customer design, the test screen database having failure thresholds and associated test screens for detecting the failure thresholds for a set of ASIC devices; generating a filter database including select failure thresholds and associated test screens for the performance requirements of the customer design; and selecting a set of test screens from the filter database based upon a yield cost criteria in forming the ASIC.