公开(公告)号：US10078183B2

公开(公告)日：2018-09-18

申请号：US14966781

申请日：2015-12-11

Applicant: GLOBALFOUNDRIES INC.

Inventor： Shawn A. Adderly ,  Samantha D. DiStefano ,  Jeffrey P. Gambino ,  Prakash Periasamy ,  Donald R. Letourneau

IPC: G02B6/13 ,  G02B6/12 ,  G02B6/30 ,  G02B6/136 ,  G02B6/122

CPC classification number: G02B6/30 ,  G02B6/122 ,  G02B6/13 ,  G02B6/136 ,  G02B6/4243 ,  G02B6/4274

Abstract: The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and comprising CMOS logic functions; and an optical fiber optically coupled to the waveguide structure and positioned within a cavity formed in the second die.

公开(公告)号：US09508578B2

公开(公告)日：2016-11-29

申请号：US14171874

申请日：2014-02-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Shawn A. Adderly ,  Samantha D. DiStefano ,  Jeffrey P. Gambino ,  Max G. Levy ,  Max L. Lifson ,  Jed H. Rankin ,  Timothy D. Sullivan

IPC: H01L21/67 ,  H01L21/00 ,  G01F1/76

CPC classification number: H01L21/67288 ,  G01F1/76 ,  H01L21/00 ,  H01L21/67109

Abstract: An apparatus and method for leak detection of coolant gas from a chuck. The apparatus includes a chuck having a top surface and configured to clamp a substrate to the top surface, the chuck having one or more recessed regions in the top surface, the recessed regions configured to allow a cooling gas to contact a backside of the substrate; a cooling gas inlet and a cooling gas outlet connected to the one or more recessed regions; a first measurement device connected to the cooling gas inlet and configured to measure a first amount of cooling gas entering the cooling gas inlet and a second measurement device connected to the cooling gas outlet and configured to measure a second amount of cooling gas exiting from the cooling gas outlet; and a controller configured to determine a difference between the first amount of cooling gas and the second amount of cooling gas.

Abstract translation: 一种用于从卡盘泄漏检测冷却剂气体的装置和方法。 该装置包括具有顶表面并被配置为将基板夹持到顶表面的卡盘，卡盘在顶表面中具有一个或多个凹陷区域，凹陷区域被配置为允许冷却气体接触基板的背面; 连接到所述一个或多个凹陷区域的冷却气体入口和冷却气体出口; 连接到冷却气体入口并被配置成测量进入冷却气体入口的第一量的冷却气体的第一测量装置和连接到冷却气体出口的第二测量装置，其被配置成测量从冷却出口排出的第二量的冷却气体 气体出口; 以及控制器，被配置为确定所述第一冷却气体量与所述第二冷却气体量之间的差。

公开(公告)号：US20170168242A1

公开(公告)日：2017-06-15

申请号：US14966781

申请日：2015-12-11

Applicant: GLOBALFOUNDRIES INC.

Inventor： Shawn A. Adderly ,  Samantha D. DiStefano ,  Jeffrey P. Gambino ,  Prakash Periasamy ,  Donald R. Letourneau

IPC: G02B6/30 ,  G02B6/122 ,  G02B6/13 ,  G02B6/136

CPC classification number: G02B6/30 ,  G02B6/122 ,  G02B6/13 ,  G02B6/136

Abstract: The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and comprising CMOS logic functions; and an optical fiber optically coupled to the waveguide structure and positioned within a cavity formed in the second die.

公开(公告)号：US09543219B2

公开(公告)日：2017-01-10

申请号：US14557819

申请日：2014-12-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Shawn A. Adderly ,  Samantha D. DiStefano ,  Mark J. Esposito ,  Jeffrey P. Gambino ,  Prakash Periasamy

IPC: H01L21/66 ,  H01L21/768 ,  H01L23/528

CPC classification number: H01L22/10 ,  H01L21/67248 ,  H01L21/768 ,  H01L22/30 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of monitoring a temperature of a plurality of regions in a substrate during a deposition process, the monitoring of the temperature including: forming, in the monitored plurality of regions, a plurality of metal structures each with a different metal pattern density, where each metal pattern density corresponds to a threshold temperature at or above which metal voids and surface roughness are formed in the plurality of metal structures, and detecting metal voids and surface roughness in the plurality of metal structures to determine the temperature of the monitored plurality of regions.

Abstract translation: 一种在沉积过程中监测衬底中的多个区域的温度的方法，所述温度的监测包括：在所监视的多个区域中形成多个金属结构，每个金属结构具有不同的金属图案密度，其中每个 金属图案密度对应于多个金属结构中形成金属空隙和表面粗糙度的阈值温度，并且检测多个金属结构中的金属空隙和表面粗糙度，以确定被监测的多个区域的温度。