公开(公告)号：US11828983B2

公开(公告)日：2023-11-28

申请号：US17577162

申请日：2022-01-17

Applicant: GlobalFoundries U.S. Inc.

Inventor： Ian Melville ,  Nicholas Polomoff ,  Thomas Houghton ,  Koushik Ramachandran ,  Pallabi Das

IPC: G02B6/12 ,  G02B6/10 ,  G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12061

Abstract: Structures for a cavity included in a photonics chip and methods of fabricating a structure for a cavity included in a photonics chip. The structure includes a substrate, a back-end-of-line stack having interlayer dielectric layers on the substrate, and a cavity penetrating through the back-end-of-line stack and into the substrate. The cavity includes first sidewalls and second sidewalls, and the second sidewalls have an alternating arrangement with the first sidewalls to define non-right-angle corners.

公开(公告)号：US11075453B1

公开(公告)日：2021-07-27

申请号：US16804126

申请日：2020-02-28

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Selaka B. Bulumulla ,  Koushik Ramachandran ,  Benjamin V. Fasano

IPC: H01Q1/42 ,  H01Q1/50 ,  H01Q21/06

Abstract: Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

公开(公告)号：US20240348005A1

公开(公告)日：2024-10-17

申请号：US18134068

申请日：2023-04-13

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yusheng Bian ,  Koushik Ramachandran

IPC: H01S5/024 ,  G02B6/42 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0237 ,  H01S5/183

CPC classification number: H01S5/02469 ,  G02B6/4215 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0237 ,  H01S5/18305

Abstract: Structures including a photonics chip and a surface-mounted laser chip, and methods of forming same. The structure comprises a photonics chip including a surface, a laser chip including a light output and a body that are spaced from the surface of the photonics chip, a first adhesive between the body of the laser chip and the surface of the photonics chip, and a second adhesive between the body of the laser chip and the surface of the photonics chip. The light output is oriented toward the surface of the photonics chip, the first adhesive has a first thermal conductivity, the second adhesive has a second thermal conductivity that is less than the first thermal conductivity of the first adhesive, and the second adhesive is disposed in a light path between the light output of the laser chip and the surface of the photonics chip.

公开(公告)号：US20240154384A1

公开(公告)日：2024-05-09

申请号：US17982606

申请日：2022-11-08

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Koushik Ramachandran ,  Yusheng Bian

IPC: H01S5/0236 ,  H01S5/02251 ,  H01S5/024

CPC classification number: H01S5/0236 ,  H01S5/02251 ,  H01S5/024

Abstract: Structures for a cavity-mounted chip and methods of fabricating a structure for a cavity-mounted chip. The structure comprises a laser chip including a body attached to a substrate. The laser chip has an output, and the body of the laser chip has a bottom surface spaced from the substrate by a gap. The structure further comprises a first adhesive in the first gap and a second adhesive positioned in the first gap between the first adhesive and the output of the laser chip. The first adhesive has a first thermal conductivity, the second adhesive has a second thermal conductivity, and the first thermal conductivity of the first adhesive is greater than the second thermal conductivity of the second adhesive.

公开(公告)号：US20240356302A1

公开(公告)日：2024-10-24

申请号：US18136404

申请日：2023-04-19

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Koushik Ramachandran ,  Yunyao Jiang

IPC: H01S5/0237 ,  G02B6/12

CPC classification number: H01S5/0237 ,  G02B6/12 ,  G02B2006/12121

Abstract: Structures including a photonics chip and a cavity-mounted laser chip, and methods of forming such structures. The structure comprises a photonics chip including a substrate and a cavity in the substrate, a laser chip including a body inside the cavity, a first anchor disposed inside the cavity adjacent to a first corner of the body of the laser chip, and a second anchor disposed inside the cavity adjacent to a second corner of the body of the laser chip. The first and second anchors are configured to attach the laser chip to the photonics chip.

公开(公告)号：US11502106B2

公开(公告)日：2022-11-15

申请号：US16788276

申请日：2020-02-11

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Benjamin Vito Fasano ,  Koushik Ramachandran ,  Ian Douglas Walter Melville ,  Sarah Huffsmith Knickerbocker ,  Jorge Lubguban

IPC: H01L29/78 ,  H01L27/12 ,  H01L29/06 ,  H01L21/762 ,  H01L29/161

Abstract: A semiconductor device is provided, which includes a multi-layered substrate having an interposed polymeric film and a device layer arranged over the multi-layered substrate.

公开(公告)号：US20250085491A1

公开(公告)日：2025-03-13

申请号：US18243701

申请日：2023-09-08

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Theodore Letavic ,  Kenneth J. Giewont ,  Kevin Dezfulian ,  Koushik Ramachandran

IPC: G02B6/42 ,  G02B6/02

Abstract: Photonic structures including multiple input/output optical couplers and methods of forming such photonic structures. The photonic structure comprises a light source and a photonics chip including a semiconductor substrate. The photonic structure further comprises a first mirror disposed at a first height relative to a top surface of the semiconductor substrate and a second mirror disposed at a second height relative to the top surface of the semiconductor substrate. The first mirror is configured to reflect first light from the light source to the photonics chip, and the second mirror is configured to reflect second light from the light source to the photonics chip. The first mirror is disposed between the second mirror and the light source, and the second height is different from the first height.

公开(公告)号：US20240219636A1

公开(公告)日：2024-07-04

申请号：US18093039

申请日：2023-01-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Bartlomiej Jan Pawlak ,  Oscar D. Restrepo ,  Koushik Ramachandran ,  Yusheng Bian ,  Eduardo Cruz Silva

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12121

Abstract: Structures including an edge coupler and methods of forming such structures. The structure comprises a dielectric layer on a semiconductor substrate. The dielectric layer includes a cavity and an edge defining a boundary of the cavity. The structure further comprises an edge coupler including a waveguide core. The waveguide core includes a portion that extends past the edge of the dielectric layer and overhangs the cavity. The structure further comprises a heater positioned adjacent to the portion of the waveguide core. The heater is spaced by a gap from the portion of the waveguide core.

公开(公告)号：US20230417991A1

公开(公告)日：2023-12-28

申请号：US17850128

申请日：2022-06-27

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Koushik Ramachandran ,  Karen Nummy

IPC: G02B6/122 ,  G02B6/136

CPC classification number: G02B6/1228 ,  G02B6/136 ,  G02B2006/12121

Abstract: Structures for a waveguide core and methods of fabricating such structures. The structure comprises a waveguide core including a section having a first trapezoidal portion and a second trapezoidal portion stacked with the first trapezoidal portion. The first trapezoidal portion has a first trapezoidal shape, and the second trapezoidal portion has a second trapezoidal shape different from the first trapezoidal shape.

公开(公告)号：US12135456B2

公开(公告)日：2024-11-05

申请号：US17850128

申请日：2022-06-27

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Koushik Ramachandran ,  Karen Nummy

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/14 ,  G02B6/30 ,  G02B6/12

Abstract: Structures for a waveguide core and methods of fabricating such structures. The structure comprises a waveguide core including a section having a first trapezoidal portion and a second trapezoidal portion stacked with the first trapezoidal portion. The first trapezoidal portion has a first trapezoidal shape, and the second trapezoidal portion has a second trapezoidal shape different from the first trapezoidal shape.