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公开(公告)号：US20210141171A1
公开(公告)日：2021-05-13
申请号：US16677357
申请日：2019-11-07
Applicant: Hewlett Packard Enterprise Development LP
Abstract: Examples herein relate to optical modules. In particular, implementations herein relate to optical modules that include top-emitting VCSELs and/or top-entry photodetectors. The optical modules include a first interposer having opposing first and second sides and a second interposer having opposing first and second sides. The optical modules include a plurality of top-emitting vertical-cavity surface-emitting lasers (VCSELs) coupled to the second interposer and a plurality of electrical conductors forming electrical paths between electrical contacts of the top-emitting VCSELs and the second side of the second interposer. The VCSELs are configured to emit optical signals having different wavelengths. The optical signals are configured to be combined and transmitted over a single optical fiber.
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公开(公告)号：US10985531B2
公开(公告)日：2021-04-20
申请号：US16258616
申请日：2019-01-27
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Binhao Wang , Wayne Sorin , Michael Renne Ty Tan , Sagi Varghese Mathai , Stanley Cheung
Abstract: A VCSEL device includes a substrate and a first DBR structure disposed on the substrate. The VCSEL device further includes a cathode contact disposed on a top surface of the first DBR structure. In addition, the VCSEL device includes a VCSEL mesa that is disposed on the top surface of the first DBR structure. The VCSEL mesa includes a quantum well, a non-circularly-shaped oxide aperture region disposed above the quantum well, and a second DBR structure disposed above the non-circularly-shaped oxide aperture region. In addition, the VCSEL mesa includes a selective polarization structure disposed above the second DBR structure and an anode contact disposed above the selective polarization structure.
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公开(公告)号：US20200057212A1
公开(公告)日：2020-02-20
申请号：US16665995
申请日：2019-10-28
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Sagi Varghese Mathai , Georgios Panotopoulos , Michael Renne Ty Tan , Paul K. Rosenberg , Wayne V. Sorin
IPC: G02B6/42
Abstract: In the examples provided herein, an apparatus has a first substrate upon which one or more first filters have been fabricated on a first surface of the first substrate. The apparatus also has a second substrate upon which one or more second filters have been fabricated on a second surface of the second substrate, wherein the one or more first filters and the one or more second filters each transmit a different band of wavelengths. Additionally, the apparatus has a bonding material that bonds the first substrate to the second substrate.
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公开(公告)号：US10290996B1
公开(公告)日：2019-05-14
申请号：US15962649
申请日：2018-04-25
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Sagi Varghese Mathai , Stanley Cheung , Wayne V. Sorin , Michael Renne Ty Tan
Abstract: A bottom-emitting vertical-cavity surface-emitting laser (VCSEL) structure includes a first substrate permitting the passage of light therethrough, an n-doped distributed Bragg reflector (nDBR), a p-doped distributed Bragg reflector (pDBR), one or more active layers, at least one of a high contrast grating mirror and a dielectric-enhanced metal mirror, and a plurality of layers, where the VCSEL structure is configured to be flip chipped to a second substrate. The pDBR and the nDBR define a laser cavity extending vertically therebetween and containing the one or more active layers. The at least one of a high contrast grating mirror and a dielectric-enhanced metal mirror may be disposed over the pDBR. The plurality of layers may be disposed over the at least one of the high contrast grating mirror and the dielectric-enhanced metal mirror to optically and hermetically seal the laser cavity.
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公开(公告)号：US10082684B2
公开(公告)日：2018-09-25
申请号：US15106850
申请日：2014-01-24
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Sagi Varghese Mathai , David A. Fattal , Michael Renne Ty Tan , Wayne Victor Sorin
CPC classification number: G02F1/0102 , G02F1/01 , G02F1/017 , G02F2201/302 , G02F2201/307 , G02F2201/38 , G02F2203/28 , H01S3/0085
Abstract: A high contrast grating optical modulation includes an optical modulator at a front surface of a substrate to modulate received light. The high contrast grating optical modulation further includes a high contrast grating (HCG) lens adjacent to a back surface of the substrate opposite to the front surface to focus incident light onto the optical modulator. The substrate is transparent to operational wavelengths of the focused incident light and the modulated light.
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Patent Agency Ranking
公开(公告)号：US10018788B2
公开(公告)日：2018-07-10
申请号：US15522228
申请日：2014-10-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Sagi Varghese Mathai , Michael Renne Ty Tan , Wayne Victor Sorin
Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.
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公开(公告)号：US10680714B2
公开(公告)日：2020-06-09
申请号：US16250381
申请日：2019-01-17
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Wayne Victor Sorin , Michael Renne Ty Tan , David A. Fattal , Sagi Varghese Mathai
Abstract: Techniques related to optical devices including a high contrast grating (HCG) lens are described herein. In an example, an optical device includes a transparent substrate. A laser emitter or detector at a first side of the transparent substrate to emit or detect a laser light transmitted via the transparent substrate. A HCG lens is at a second side of the transparent substrate to transmit and refract the laser light.
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公开(公告)号：US11415763B2
公开(公告)日：2022-08-16
申请号：US16988428
申请日：2020-08-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , Sagi Varghese Mathai , Michael Renne Ty Tan
Abstract: Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.
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公开(公告)号：US10897122B2
公开(公告)日：2021-01-19
申请号：US15958029
申请日：2018-04-20
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Sagi Varghese Mathai , Michael Renee Ty Tan
Abstract: An optical apparatus is provided for an optical transceiver. The optical apparatus includes an interposer, a glass lens chip bonded to the interposer, and a plurality of bottom-emitting vertical-cavity surface-emitting lasers (VCSELs) flip chipped to the interposer. Each of the bottom-emitting VCSELs is fabricated on a respective substrate, at least one bottom-emitting VCSEL is capable of emitting an optical signal having a wavelength of about 850 nm, and at least a portion of the respective substrate on which the at least one bottom-emitting VCSEL is fabricated is removed to permit the at least one bottom-emitting VCSEL to emit the optical signal having the wavelength of about 850 nm to the glass lens chip.
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公开(公告)号：US20200244040A1
公开(公告)日：2020-07-30
申请号：US16258616
申请日：2019-01-27
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Binhao Wang , Wayne Sorin , Michael Renne Ty Tan , Sagi Varghese Mathai , Stanley Cheung
Abstract: A VCSEL device includes a substrate and a first DBR structure disposed on the substrate. The VCSEL device further includes a cathode contact disposed on a top surface of the first DBR structure. In addition, the VCSEL device includes a VCSEL mesa that is disposed on the top surface of the first DBR structure. The VCSEL mesa includes a quantum well, a non-circularly-shaped oxide aperture region disposed above the quantum well, and a second DBR structure disposed above the non-circularly-shaped oxide aperture region. In addition, the VCSEL mesa includes a selective polarization structure disposed above the second DBR structure and an anode contact disposed above the selective polarization structure.
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