Silicone gel composition
    1.
    发明授权
    Silicone gel composition 有权
    硅胶组合物

    公开(公告)号:US06265480B1

    公开(公告)日:2001-07-24

    申请号:US09548861

    申请日:2000-04-13

    IPC分类号: C08L8304

    摘要: A silicone gel composition comprising (A) 100 parts by weight of an organopolysiloxane comprising 80 to 98 mole % of R(CH3)SiO2/2 units, 0.1 to 10.0 mole % of RSiO3/2 units, and 0.1 to 10 mole % of R(CH3)2SiO1/2 units, wherein R is methyl, phenyl, or alkenyl, and provided 0.25 to 4.0 mole % the R groups in the organopolysiloxane are alkenyl; (B) an organopolysiloxane having an average of at least 2 silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from 0.1 to 5 silicon-bonded hydrogen atoms per alkenyl group in component (A); (C) a platinum catalyst; (D) 0.01 to 10 parts by weight of a silica powder; and (E) 0.01 to 5 parts by weight of a thixotropic agent selected from at least one epoxy compound, at least one polyhydric alcohol, and mixtures thereof; wherein the silicone gel composition has an apparent viscosity ratio of 2.0 to 10.0 and cures to form a silicone gel having a ¼ consistency of 10 to 200.

    摘要翻译: 一种硅凝胶组合物,其包含(A)100重量份的包含80至98摩尔%的R(CH 3)SiO 2/2单元,0.1至10.0摩尔%的RSiO 3/2单元和0.1至10摩尔%的R (CH 3)2 SiO 1/2单元,其中R为甲基,苯基或烯基,并且所述有机聚硅氧烷中的R基团为0.25〜4.0摩尔%为链烯基; (B)每分子平均具有至少2个硅键合的氢原子的有机聚硅氧烷,其量足以在组分(A)中每个烯基提供0.1至5个与硅键合的氢原子; (C)铂催化剂; (D)0.01〜10重量份二氧化硅粉末; 和(E)0.01至5重量份的选自至少一种环氧化合物,至少一种多元醇及其混合物的触变剂; 其中所述硅凝胶组合物的表观粘度比为2.0至10.0,并且固化以形成¼稠度为10至200的硅凝胶。

    Silicone gel composition and silicone gel for use in sealing and filling
of electrical and electronic parts
    2.
    发明授权
    Silicone gel composition and silicone gel for use in sealing and filling of electrical and electronic parts 失效
    硅胶组合物和硅胶,用于密封和填充电气和电子部件

    公开(公告)号:US6001943A

    公开(公告)日:1999-12-14

    申请号:US14557

    申请日:1998-01-28

    CPC分类号: C08L83/04 C08G77/12 C08G77/20

    摘要: The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.

    摘要翻译: 本发明提供一种用于密封和填充电气和电子部件的硅凝胶组合物,其特征在于当所述组合物固化时,所述组合物形成硅凝胶,其中在25℃的温度下的损耗弹性模量 ℃,0.1Hz的剪切频率为1.0×10 2〜1.0×10 4 Pa,复数弹性模量为1.0×10 5 Pa以下,硅胶凝胶的特征在于,在硅凝胶中密封或 填充电气或电子部件,该硅酮凝胶在25℃的温度和0.1Hz的剪切频率下的损耗弹性模量为1.0×10 2至1.0×10 4 Pa,复数弹性模量为1.0×10 5 Pa以下。

    Silicone gel composition for use as a sealant and a filler for
electrical and electronic components and a gel prepared from this
composition
    3.
    发明授权
    Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition 失效
    用作密封剂的硅胶组合物和用于电气和电子部件的填料以及由该组合物制备的凝胶

    公开(公告)号:US6001918A

    公开(公告)日:1999-12-14

    申请号:US110633

    申请日:1998-07-06

    摘要: A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.2 is an alkylene group having 2 to 4 carbon atoms; and (E) a hydrosilylation catalyst in a catalytic quantity; wherein the weight ratio of component (D) to component (C) in said gel composition is from 0.0005 to 0.05; and the silicone gel composition cures to form a silicone gel having a loss elastic modulus at 25.degree. C. and at a shear frequency of 0.1 Hz of from 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and a complex modulus of elasticity less than 1.0.times.10.sup.5 Pa.

    摘要翻译: 一种硅凝胶组合物,其包含:(A)每分子100重量份含有至少两个烯基的有机聚硅氧烷,并且在25℃下的粘度为0.01至100Pa.s。 (B)每分子含有至少两个与硅键合的氢原子的有机聚硅氧烷,其在25℃下的粘度为0.001至10Pa.s,其量足以提供0.2至5摩尔与硅键合的氢原子 组分(A)中的1摩尔烯基; (C)0.01〜15重量份比表面积为50m 2 / g以上的二氧化硅粉末; (D)0.0001〜1.0重量份由以下通式表示的二胺化合物:R12N-R2-NR12,其中每个R1独立地是氢原子或具有1-4个碳原子的烷基,R2是亚烷基 具有2至4个碳原子; 和(E)催化剂的氢化硅烷化催化剂; 其中所述凝胶组合物中组分(D)与组分(C)的重量比为0.0005至0.05; 并且硅凝胶组合物固化以形成在25℃和0.1Hz的剪切频率为1.0×10 2至1.0×10 4 Pa下的损耗弹性模量和小于1.0×10 5 Pa的复数弹性模量的硅凝胶。

    LIQUID MEDICATION DISPENSING MACHINE
    5.
    发明申请
    LIQUID MEDICATION DISPENSING MACHINE 有权
    液体药物分配机

    公开(公告)号:US20140261880A1

    公开(公告)日:2014-09-18

    申请号:US14351993

    申请日:2012-09-07

    IPC分类号: B65B3/00

    摘要: Provided is a liquid medication dispensing machine that can remove a liquid medication from one end of a supply pipe with higher reliability. The liquid medication dispensing machine includes a plurality of supply nozzles located at equal intervals through which liquid medications flow from a plurality of liquid medication bottles containing the liquid medications, respectively, to a prescription bottle. The plurality of supply nozzles are moved sequentially to a supply position where a supply nozzle faces an upper opening of the prescription bottle. The liquid medication dispensing machine further includes a cleaning unit that removes the liquid medication adhering to the supply nozzle. The supply nozzles are moved sequentially to a cleaning position where the cleaning unit removes the liquid medication from the supply nozzle. The cleaning position is provided at a position away from the supply position by a distance smaller than a spacing between the supply nozzles.

    摘要翻译: 提供了一种液体药物分配机,其可以以更高的可靠性从供给管的一端去除液体药物。 液体药物分配机包括多个供应喷嘴,其间隔相等,液体药物分别从容纳液体药物的多个液体药物瓶流出到处方瓶中。 多个供给喷嘴顺序地移动到供给喷嘴面向处方瓶的上部开口的供给位置。 液体药物分配机还包括清除单元,该清洁单元除去附着在供应喷嘴上的液体药物。 供应喷嘴依次移动到清洁单元,其中清洁单元从供应喷嘴去除液体药物。 清洁位置设置在远离供给位置的距离小于供给喷嘴之间的距离的位置处。

    Solid-state imaging element and driving method of the solid-state imaging element
    7.
    发明授权
    Solid-state imaging element and driving method of the solid-state imaging element 有权
    固态成像元件和固态成像元件的驱动方法

    公开(公告)号:US08629385B2

    公开(公告)日:2014-01-14

    申请号:US12705161

    申请日:2010-02-12

    IPC分类号: H01L27/00

    摘要: Disclosed herein is a solid-state imaging element including: (A) a light reception/charge storage region formed in a semiconductor layer, the light reception/charge storage region including M light reception/charge storage layers stacked one on top of the other, where M≧2; (B) a charge output region formed in the semiconductor layer; (C) a conduction/non-conduction control region which includes a portion of the semiconductor layer located between the light reception/charge storage region and the charge output region; and (D) a conduction/non-conduction control electrode adapted to control the conduction or non-conduction state of the conduction/non-conduction control region, wherein mth potential control electrodes are provided between the mth and (m+1)th light reception/charge storage layers, where 1≦m≦(M−1), to control the potentials of the light reception/charge storage layers.

    摘要翻译: 本发明公开了一种固态成像元件,包括:(A)形成在半导体层中的光接收/电荷存储区域,所述光接收/电荷存储区域包括一个层叠在一起的M个光接收/电荷存储层, 其中M> = 2; (B)形成在半导体层中的电荷输出区域; (C)导电/非导通控制区域,其包括位于光接收/电荷存储区域和电荷输出区域之间的半导体层的一部分; 和(D)适于控制导通/非导通控制区域的导通或非导通状态的导通/非导通控制电极,其中第m电位控制电极设置在第m和第(m + 1)个光 接收/电荷存储层,其中1 @ m @(M-1),以控制光接收/电荷存储层的电位。

    Imaging apparatus and method, electronic device, and program
    8.
    发明授权
    Imaging apparatus and method, electronic device, and program 有权
    成像设备和方法,电子设备和程序

    公开(公告)号:US08466990B2

    公开(公告)日:2013-06-18

    申请号:US12805520

    申请日:2010-08-04

    CPC分类号: H04N5/3675

    摘要: An imaging apparatus includes: an imaging unit configured to image an image using an imaging device; an image obtaining unit configured to obtain a plurality of images equivalent to the time of dark, imaged by the imaging unit; a registering unit configured to register, with an image obtained by the image obtaining unit, the address and change amount of a pixel where the output value of the pixel changes so as to exceed a predetermined threshold; and a correcting unit configured to correct, when taking a pixel corresponding to an address registered by the registering unit as a processing object pixel, the pixel value of the processing object pixel based on comparison between difference of the output values of the processing object pixel and a peripheral pixel of the processing object pixel, and the change amount of the processing object pixel.

    摘要翻译: 一种成像装置,包括:成像单元,被配置为使用成像装置对图像进行成像; 图像获取单元,被配置为获得由所述成像单元成像的等于黑暗时间的多个图像; 注册单元,被配置为用图像获取单元获得的图像登记像素的输出值改变以超过预定阈值的像素的地址和变化量; 以及校正单元,被配置为基于通过所述处理对象像素的输出值的差异与所述处理对象像素的输出值的差异来对所述处理对象像素的像素值进行比较,当对应于由所述登记单元登记的地址的像素作为处理对象像素时, 处理对象像素的周边像素和处理对象像素的变化量。

    Solid-state image pickup element and driving method thereof
    9.
    发明授权
    Solid-state image pickup element and driving method thereof 有权
    固体摄像元件及其驱动方法

    公开(公告)号:US08362412B2

    公开(公告)日:2013-01-29

    申请号:US12646512

    申请日:2009-12-23

    IPC分类号: H01L27/00 H01L27/146

    摘要: A solid-state image pickup element includes: (A) a light receiving/charge accumulating region formed in a semiconductor layer and formed by laminating M (where M≧2) light receiving/charge accumulating layers; (B) a charge outputting region formed in the semiconductor layer; (C) a depletion layer forming region formed of a part of the semiconductor layer, the part of the semiconductor layer being situated between the light receiving/charge accumulating region and the charge outputting region; and (D) a control electrode region for controlling a state of formation of a depletion layer in the depletion layer forming region, wherein the solid-state image pickup element further includes a light receiving/charge accumulating layer extending section extending from each light receiving/charge accumulating layer to the depletion layer forming region.

    摘要翻译: 固体摄像元件包括:(A)形成在半导体层中并通过层叠M(其中M≥2)光接收/电荷累积层形成的光接收/电荷累积区; (B)形成在半导体层中的电荷输出区域; (C)由半导体层的一部分形成的耗尽层形成区域,半导体层的一部分位于光接收/电荷累积区域和电荷输出区域之间; 以及(D)用于控制耗尽层形成区域中的耗尽层的形成状态的控制电极区域,其中所述固态摄像元件还包括从每个光接收/ 电荷累积层到耗尽层形成区域。

    Semiconductor device, method of manufacturing the same, and electronic apparatus
    10.
    发明授权
    Semiconductor device, method of manufacturing the same, and electronic apparatus 有权
    半导体装置及其制造方法以及电子设备

    公开(公告)号:US08067313B2

    公开(公告)日:2011-11-29

    申请号:US12657799

    申请日:2010-01-28

    申请人: Akihiro Nakamura

    发明人: Akihiro Nakamura

    摘要: Disclosed is a method of manufacturing a semiconductor device including forming a transistor on a first surface of a device substrate, forming a hole in a second surface opposite to the first surface of the device substrate, and supplying hydrogen to a gate insulating film of the transistor from the second surface of the device substrate through the hole.

    摘要翻译: 公开了一种制造半导体器件的方法,包括在器件衬底的第一表面上形成晶体管,在与器件衬底的第一表面相对的第二表面中形成孔,并向晶体管的栅极绝缘膜提供氢 从设备基板的第二表面通过孔。