公开(公告)号：US06265480B1

公开(公告)日：2001-07-24

申请号：US09548861

申请日：2000-04-13

申请人： Hiroji Enami ,  Akihiro Nakamura

发明人： Hiroji Enami ,  Akihiro Nakamura

IPC分类号： C08L8304

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/00 ,  C08L2666/28

摘要： A silicone gel composition comprising (A) 100 parts by weight of an organopolysiloxane comprising 80 to 98 mole % of R(CH3)SiO2/2 units, 0.1 to 10.0 mole % of RSiO3/2 units, and 0.1 to 10 mole % of R(CH3)2SiO1/2 units, wherein R is methyl, phenyl, or alkenyl, and provided 0.25 to 4.0 mole % the R groups in the organopolysiloxane are alkenyl; (B) an organopolysiloxane having an average of at least 2 silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from 0.1 to 5 silicon-bonded hydrogen atoms per alkenyl group in component (A); (C) a platinum catalyst; (D) 0.01 to 10 parts by weight of a silica powder; and (E) 0.01 to 5 parts by weight of a thixotropic agent selected from at least one epoxy compound, at least one polyhydric alcohol, and mixtures thereof; wherein the silicone gel composition has an apparent viscosity ratio of 2.0 to 10.0 and cures to form a silicone gel having a ¼ consistency of 10 to 200.

摘要翻译： 一种硅凝胶组合物，其包含（A）100重量份的包含80至98摩尔％的R（CH 3）SiO 2/2单元，0.1至10.0摩尔％的RSiO 3/2单元和0.1至10摩尔％的R （CH 3）2 SiO 1/2单元，其中R为甲基，苯基或烯基，并且所述有机聚硅氧烷中的R基团为0.25〜4.0摩尔％为链烯基; （B）每分子平均具有至少2个硅键合的氢原子的有机聚硅氧烷，其量足以在组分（A）中每个烯基提供0.1至5个与硅键合的氢原子; （C）铂催化剂; （D）0.01〜10重量份二氧化硅粉末; 和（E）0.01至5重量份的选自至少一种环氧化合物，至少一种多元醇及其混合物的触变剂; 其中所述硅凝胶组合物的表观粘度比为2.0至10.0，并且固化以形成¼稠度为10至200的硅凝胶。

公开(公告)号：US6001943A

公开(公告)日：1999-12-14

申请号：US14557

申请日：1998-01-28

申请人： Hiroji Enami ,  Yuji Hamada ,  Akihiro Nakamura ,  Takeaki Saiki

发明人： Hiroji Enami ,  Yuji Hamada ,  Akihiro Nakamura ,  Takeaki Saiki

IPC分类号： C08L83/05 ,  C08L83/04 ,  C08L83/07 ,  H01L23/29 ,  H01L23/31 ,  C08G77/08

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20

摘要： The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.

摘要翻译： 本发明提供一种用于密封和填充电气和电子部件的硅凝胶组合物，其特征在于当所述组合物固化时，所述组合物形成硅凝胶，其中在25℃的温度下的损耗弹性模量 ℃，0.1Hz的剪切频率为1.0×10 2〜1.0×10 4 Pa，复数弹性模量为1.0×10 5 Pa以下，硅胶凝胶的特征在于，在硅凝胶中密封或 填充电气或电子部件，该硅酮凝胶在25℃的温度和0.1Hz的剪切频率下的损耗弹性模量为1.0×10 2至1.0×10 4 Pa，复数弹性模量为1.0×10 5 Pa以下。

公开(公告)号：US6001918A

公开(公告)日：1999-12-14

申请号：US110633

申请日：1998-07-06

申请人： Hiroji Enami ,  Akihiro Nakamura ,  Yuji Hamada ,  Takeaki Saiki

发明人： Hiroji Enami ,  Akihiro Nakamura ,  Yuji Hamada ,  Takeaki Saiki

IPC分类号： C08L83/05 ,  C08K3/36 ,  C08K5/17 ,  C08L83/04 ,  C08L83/07 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  C08K3/34

CPC分类号： C08K5/17 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20

摘要： A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.2 is an alkylene group having 2 to 4 carbon atoms; and (E) a hydrosilylation catalyst in a catalytic quantity; wherein the weight ratio of component (D) to component (C) in said gel composition is from 0.0005 to 0.05; and the silicone gel composition cures to form a silicone gel having a loss elastic modulus at 25.degree. C. and at a shear frequency of 0.1 Hz of from 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and a complex modulus of elasticity less than 1.0.times.10.sup.5 Pa.

摘要翻译： 一种硅凝胶组合物，其包含：（A）每分子100重量份含有至少两个烯基的有机聚硅氧烷，并且在25℃下的粘度为0.01至100Pa.s。 （B）每分子含有至少两个与硅键合的氢原子的有机聚硅氧烷，其在25℃下的粘度为0.001至10Pa.s，其量足以提供0.2至5摩尔与硅键合的氢原子 组分（A）中的1摩尔烯基; （C）0.01〜15重量份比表面积为50m 2 / g以上的二氧化硅粉末; （D）0.0001〜1.0重量份由以下通式表示的二胺化合物：R12N-R2-NR12，其中每个R1独立地是氢原子或具有1-4个碳原子的烷基，R2是亚烷基 具有2至4个碳原子; 和（E）催化剂的氢化硅烷化催化剂; 其中所述凝胶组合物中组分（D）与组分（C）的重量比为0.0005至0.05; 并且硅凝胶组合物固化以形成在25℃和0.1Hz的剪切频率为1.0×10 2至1.0×10 4 Pa下的损耗弹性模量和小于1.0×10 5 Pa的复数弹性模量的硅凝胶。

公开(公告)号：US20100276721A1

公开(公告)日：2010-11-04

申请号：US12223133

申请日：2007-02-01

申请人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

发明人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

IPC分类号： H01L33/62 ,  C08L83/05

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

公开(公告)号：US20070134425A1

公开(公告)日：2007-06-14

申请号：US10580798

申请日：2004-11-24

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

IPC分类号： B05D3/02 ,  B32B9/04

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

公开(公告)号：US20060073347A1

公开(公告)日：2006-04-06

申请号：US10530693

申请日：2003-09-08

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Atsushi Togashi ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Atsushi Togashi ,  Hiroji Enami

IPC分类号： B32B27/06 ,  C08L83/04 ,  H01L21/56

CPC分类号： C08K5/5419 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L2205/02 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

摘要翻译： 可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。

公开(公告)号：US06376635B1

公开(公告)日：2002-04-23

申请号：US09702638

申请日：2000-11-01

申请人： Masaaki Amako ,  Tadashi Okawa ,  Hiroji Enami ,  Masayuki Onishi

发明人： Masaaki Amako ,  Tadashi Okawa ,  Hiroji Enami ,  Masayuki Onishi

IPC分类号： C08G7712

CPC分类号： C07F7/0838

摘要： An oligosiloxane having the formula (R1O)aSi(OSiR22R3)4−a wherein R1 is alkyl; each R2 is independently selected from C1 to C10 monovalent hydrocarbyl free of aliphatic unsaturation; R3 is hydrocarbly free of aliphatic unsaturation and having at least 11 carbon atoms; and a is 1, 2, or 3; and a method of preparing an alkoxy-functional oligosiloxane.

摘要翻译： 具有式（R1O）aSi（OSiR22R3）4-a的低聚硅氧烷，其中R1是烷基; 每个R 2独立地选自不含脂肪族不饱和键的C1至C10一价烃基; R3不含脂族不饱和基团且具有至少11个碳原子; a是1,2或3; 和制备烷氧基官能的低聚硅氧烷的方法。

公开(公告)号：US08373286B2

公开(公告)日：2013-02-12

申请号：US13062374

申请日：2009-09-04

申请人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

发明人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

IPC分类号： H01L23/29

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00

摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

摘要翻译： 一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元， 三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷 其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。 一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

公开(公告)号：US07919150B2

公开(公告)日：2011-04-05

申请号：US10580798

申请日：2004-11-24

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

IPC分类号： B05D5/00 ,  B05D1/38 ,  B05D3/10

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

公开(公告)号：US07282270B2

公开(公告)日：2007-10-16

申请号：US10530693

申请日：2003-09-08

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Atsushi Togashi ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Atsushi Togashi ,  Hiroji Enami

IPC分类号： B32B9/04

CPC分类号： C08K5/5419 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L2205/02 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

摘要翻译： 可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。