公开(公告)号：US20110153119A1

公开(公告)日：2011-06-23

申请号：US12967777

申请日：2010-12-14

Applicant: Ho-Geun LEE ,  Seok-Jin LEE ,  Jang-Sik BAE

Inventor： Ho-Geun LEE ,  Seok-Jin LEE ,  Jang-Sik BAE

IPC: G06F7/00

CPC classification number: G08G1/096725 ,  F02N11/0837 ,  G08G1/09623 ,  G08G1/096783 ,  Y02T10/48

Abstract: Provided are a method and a device for controlling a vehicle approaching an intersection, and more particularly, a method and a device for controlling a vehicle approaching an intersection, which controls a vehicle approaching an intersection by selecting a traffic signal for the vehicle. The method of controlling a vehicle approaching an intersection includes: collecting traffic light information including signal cycles and positional coordinates of traffic lights installed at the intersection; selecting a corresponding traffic light among the traffic lights in consideration of positional information of the vehicle at the intersection and the positional coordinates of the traffic lights; and controlling the vehicle on the basis of the signal cycle of the corresponding traffic light.

Abstract translation: 提供一种用于控制接近交叉点的车辆的方法和装置，更具体地，涉及一种控制接近交叉口的车辆的方法和装置，其通过选择车辆的交通信号来控制接近交叉路口的车辆。 接近交叉路口的车辆控制方法包括：收集交通信号灯，包括信号周期和安装在十字路口的交通灯的位置坐标; 考虑到交叉口处的车辆的位置信息和交通信号灯的位置坐标，在交通灯中选择对应的交通信号灯; 并根据对应的交通信号灯的信号周期控制车辆。

公开(公告)号：US20140183728A1

公开(公告)日：2014-07-03

申请号：US14147051

申请日：2014-01-03

Applicant: Jun-Won HAN ,  Jae-Hyun KIM ,  Tae-Hoon KIM ,  Ho-Geun LEE ,  You-Jeong JEONG ,  Jung-Sik CHOI

Inventor： Jun-Won HAN ,  Jae-Hyun KIM ,  Tae-Hoon KIM ,  Ho-Geun LEE ,  You-Jeong JEONG ,  Jung-Sik CHOI

IPC: H01L23/00 ,  B32B7/06

CPC classification number: H01L24/14 ,  B32B7/06 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/18161 ,  H01L2924/3511 ,  Y10T428/1476 ,  Y10T428/2839 ,  H01L2924/00014

Abstract: A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.

Abstract translation: 晶片支撑结构包括用于支撑晶片的支撑衬底，用于将晶片从支撑衬底分离的释放层以及用于将晶片附接到支撑衬底的粘合剂层。