公开(公告)号：US3257708A

公开(公告)日：1966-06-28

申请号：US44530765

申请日：1965-04-05

Applicant: IBM

Inventor： STRICKER ALFRED A

IPC: H05K13/04

CPC classification number: H05K13/0478 ,  Y10T29/49153 ,  Y10T29/49218 ,  Y10T29/49915 ,  Y10T29/49943 ,  Y10T29/53174 ,  Y10T29/5327

公开(公告)号：US3332912A

公开(公告)日：1967-07-25

申请号：US48801065

申请日：1965-09-17

Applicant: IBM

Inventor： STRICKER ALFRED A ,  WALKER WILLIAM J

IPC: C08K5/17

CPC classification number: C08K5/175 ,  Y10S260/19 ,  Y10S524/913 ,  C08L69/00

公开(公告)号：US3677853A

公开(公告)日：1972-07-18

申请号：US3677853D

申请日：1969-12-30

Applicant: IBM

Inventor： ANZELONE THOMAS A JR ,  LARSON HAROLD A ,  STRICKER ALFRED A

IPC: C09J5/00 ,  H01L21/302 ,  H01L21/58 ,  B32B31/00

CPC classification number: H01L24/26 ,  H01L21/302 ,  H01L24/83 ,  H01L2224/83048 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/07802 ,  Y10S228/903 ,  H01L2924/3512 ,  H01L2924/00

Abstract: WAFERS ARE BONDED TO A CARRIER SURFACE WHICH TENDS TO BULGE IN REACTION TO THE BONDING PROCESS, PARTICULARLY HEATING, BUT TO RETURN TO A FLAT CONFIGURATION AFTER BOND CURING. VOID-FREE BONDING IS OBTAINED BY SHAPING THE BONDING MATERIAL TO THE CARRIER BULGE AND INTRODUCING THE WAFER TO THE HIGH POINT OF THE BULGE RELATIVE TO THE FLAT SURFACE OF THE CARRIER. CLOSURE PRESSURE BETWEEN WAFER AND CARRIER AND THE REACTION OF THE CARRIER IN COOLING TO A SUBSTANTIALLY FLAT SURFACE CONFIGURATION COPERATE TO COMPLETE THE BONDING.

公开(公告)号：US3443707A

公开(公告)日：1969-05-13

申请号：US3443707D

申请日：1967-07-14

Applicant: IBM

Inventor： FICKER WALTER W ,  RAJAC THOMAS J ,  STRICKER ALFRED A

IPC: H05K13/02 ,  B65B21/02 ,  B65B69/00 ,  B65G65/04

CPC classification number: H05K13/021

公开(公告)号：US3444617A

公开(公告)日：1969-05-20

申请号：US3444617D

申请日：1965-11-05

Applicant: IBM

Inventor： STRICKER ALFRED A ,  WALKER WILLIAM J

IPC: H05K3/30 ,  H05K7/10

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K7/1053 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/4914

公开(公告)号：US3216097A

公开(公告)日：1965-11-09

申请号：US27335363

申请日：1963-04-16

Applicant: IBM

Inventor： STRICKER ALFRED A ,  SOL KAMENETSKY

IPC: H05K13/04

CPC classification number: H05K13/0478 ,  Y10T29/53052 ,  Y10T29/53065 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53196 ,  Y10T29/53209 ,  Y10T29/5327

公开(公告)号：US3214060A

公开(公告)日：1965-10-26

申请号：US11597861

申请日：1961-06-09

Applicant: IBM

Inventor： STRICKER ALFRED A ,  MASTERSON FRANK H

IPC: H01L21/00

CPC classification number: H01L21/67138