公开(公告)号：US09869714B2

公开(公告)日：2018-01-16

申请号：US15185468

申请日：2016-06-17

Applicant: INTEL CORPORATION

Inventor： John C. Johnson ,  James G. Maveety ,  Abram M. Detofsky ,  James E. Neeb

IPC: G01R31/00 ,  G01R31/28 ,  G01R1/44 ,  H05K7/20 ,  G01R1/067 ,  G01R31/26 ,  G01R1/04

CPC classification number: G01R31/2874 ,  G01R1/0458 ,  G01R1/06722 ,  G01R1/06783 ,  G01R1/44 ,  G01R31/2642 ,  G01R31/2875 ,  G01R31/2891 ,  H05K7/20

Abstract: A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

公开(公告)号：US09448278B2

公开(公告)日：2016-09-20

申请号：US14746764

申请日：2015-06-22

Applicant: INTEL CORPORATION

Inventor： Christopher R. Schroeder ,  Christopher W. Ackerman ,  James C. Shipley ,  Tolga Acikalin ,  Ioan Sauciuc ,  Michael L. Rutigliano ,  James G. Maveety ,  Ashish Gupta

IPC: G01R31/28 ,  G01R31/26 ,  G06F1/20 ,  H01L23/473 ,  H01L23/467 ,  F28F3/12

CPC classification number: G01R31/2875 ,  F28F3/12 ,  G01R31/2642 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract translation: 测试半导体装置的装置包括保持至少一个传热流体单元的基座。 至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。 供应孔横截面大于回流孔横截面。 模具界面也被包括为液体不可渗透的材料。