公开(公告)号：US12255382B2

公开(公告)日：2025-03-18

申请号：US18504376

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11664596B2

公开(公告)日：2023-05-30

申请号：US17373926

申请日：2021-07-13

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

CPC classification number: H01Q9/0407 ,  H01Q1/085 ,  H01Q1/2283 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US11374322B2

公开(公告)日：2022-06-28

申请号：US16643722

申请日：2017-09-30

Applicant: INTEL CORPORATION

Inventor： Omer Asaf ,  Sidharth Dalmia ,  Trang Thai ,  Josef Hagn ,  Richard S. Perry ,  Jonathan C. Jensen ,  Raanan Sover

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q13/06

Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

公开(公告)号：US20190372229A1

公开(公告)日：2019-12-05

申请号：US16000795

申请日：2018-06-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/08 ,  H01Q1/22

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US20220278439A1

公开(公告)日：2022-09-01

申请号：US17739880

申请日：2022-05-09

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11870132B2

公开(公告)日：2024-01-09

申请号：US17739880

申请日：2022-05-09

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/1421 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20190260110A1

公开(公告)日：2019-08-22

申请号：US15939139

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Trang Thai ,  Raanan Sover ,  Noam Kogan ,  Jonathan Jensen ,  Richard Perry ,  William James Lambert ,  Omer Asaf ,  Ralph Winzenburg ,  Daniel R. Cox ,  Josef Hagn ,  Sidharth Dalmia

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06

Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.

公开(公告)号：US12218408B2

公开(公告)日：2025-02-04

申请号：US17231051

申请日：2021-04-15

Applicant: Intel Corporation

Inventor： Trang Thai ,  Sidharth Dalmia ,  Raanan Sover ,  Josef Hagn ,  Omer Asaf ,  Simon Svendsen

IPC: H01Q1/24 ,  H01L23/64 ,  H01L23/66 ,  H01Q9/04 ,  H01Q21/06

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

公开(公告)号：US20240356198A1

公开(公告)日：2024-10-24

申请号：US18761473

申请日：2024-07-02

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q9/04 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q9/0407 ,  H01Q21/065 ,  H01L2223/6677 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15311

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

公开(公告)号：US12068525B2

公开(公告)日：2024-08-20

申请号：US17938768

申请日：2022-10-07

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q9/04 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q9/0407 ,  H01Q21/065 ,  H01L2223/6677 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15311

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.