公开(公告)号：US20250014956A1

公开(公告)日：2025-01-09

申请号：US18741160

申请日：2024-06-12

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Ju-Li WANG ,  Zi-Zhong WANG ,  Yen-Fu LIU

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/367 ,  H01L23/58

Abstract: An electronic device includes an electronic unit having a first side and a second side; an encapsulation layer surrounding the electronic unit and having a plurality of openings exposing the second side of the electronic unit; a first circuit structure disposed on the first side of the electronic unit and electrically connected to the electronic unit; a second circuit structure disposed on the second side of the electronic unit; a via penetrating the encapsulation layer and electrically connecting the first circuit structure to the second circuit structure; and a heat dissipation layer disposed on the second side of the electronic unit, wherein the heat dissipation layer contacts the electronic unit through the plurality of openings.

公开(公告)号：US20250087547A1

公开(公告)日：2025-03-13

申请号：US18810891

申请日：2024-08-21

Applicant: InnoLux Corporation

Inventor： Chung-Jyh LIN ,  Yen-Fu LIU ,  Ju-Li WANG

IPC: H01L23/367 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic device is provided, including a chip unit, a heat dissipation film, an encapsulation layer, a through hole, and a circuit structure. The chip unit has a first side and a second side opposite to the first side. The heat dissipation film is disposed on the first side. The encapsulation layer surrounds the chip unit and the heat dissipation film. The through hole penetrates the encapsulation layer, and has a first position and a second position. The circuit structure is disposed on the second side. The through hole is electrically connected to the chip unit through the circuit structure. The first position is connected to the circuit structure, and the second position is farther away from the circuit structure than the first position. The first position has a first width, the second position has a second width, and the first width is greater than the second width.

公开(公告)号：US20240347496A1

公开(公告)日：2024-10-17

申请号：US18604452

申请日：2024-03-13

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Wen-Hsiang LIAO ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI ,  Yen-Fu LIU

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/20 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/95 ,  H01L21/568 ,  H01L23/295 ,  H01L2224/19 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/95001 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/04941

Abstract: An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 μm and less than or equal to 15 μm.

公开(公告)号：US20240332158A1

公开(公告)日：2024-10-03

申请号：US18598066

申请日：2024-03-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Yen-Fu LIU ,  Wen-Hsiang LIAO ,  Te-Hsun LIN ,  Ju-Li WANG ,  Dong-Yan YANG ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2224/13105 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.