-
公开(公告)号：US20200107476A1
公开(公告)日：2020-04-02
申请号：US16146501
申请日：2018-09-28
Applicant: Intel Corporation
Inventor： Jaejin Lee , Chung-Hao Chen , Hao-Han Hsu , Xiang Li , Jun Liao
Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.
-
公开(公告)号：US10418940B2
公开(公告)日：2019-09-17
申请号：US15381902
申请日：2016-12-16
Applicant: Intel Corporation
Inventor： Hao-Han Hsu , Jaejin Lee , Chung-Hao Chen
Abstract: An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.
-
公开(公告)号：US10403973B2
公开(公告)日：2019-09-03
申请号：US14258683
申请日：2014-04-22
Applicant: Intel Corporation
Inventor： Chung-Hao Chen
Abstract: An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.
-
公开(公告)号：US10736246B2
公开(公告)日：2020-08-04
申请号：US16146501
申请日：2018-09-28
Applicant: Intel Corporation
Inventor： Jaejin Lee , Chung-Hao Chen , Hao-Han Hsu , Xiang Li , Jun Liao
Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.
-
公开(公告)号：US20180175795A1
公开(公告)日：2018-06-21
申请号：US15381902
申请日：2016-12-16
Applicant: Intel Corporation
Inventor： Hao-Han Hsu , Jaejin Lee , Chung-Hao Chen
CPC classification number: H03B5/36 , H03B5/1243 , H03B5/1265 , H03B5/1293 , H03B5/32 , H03B2200/0088 , H03H1/00 , H03H1/0007 , H03L7/00 , H03L7/185
Abstract: An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.
-
Patent Agency Ranking
6.发明授权Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces 有权电路板具有带信号迹线的信号层和具有大于信号迹线的附加信号迹线的参考平面公开(公告)号：US09596749B2
公开(公告)日：2017-03-14
申请号：US14567916
申请日：2014-12-11
Applicant: Intel Corporation
Inventor： Kuan-Yu Chen , Yun Ling , Mohd Muhaiyiddin Bin Abdullah , Jackson Chung Peng Kong , Chung-Hao Chen , Hao-Han Hsu , Xiang Li
CPC classification number: H05K1/0242 , H01P3/026 , H01P3/18 , H01P11/003 , H05K1/0216 , H05K1/0245 , H05K3/4644
Abstract: Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.
Abstract translation: 描述用于在电路板中路由信号迹线的技术。 根据所述技术的电子设备的示例包括包括多个导电层的电路板。 导电层包括信号层和参考平面。 信号层包括信号迹线，参考平面包括附加信号迹线。
-
公开(公告)号：US20160174361A1
公开(公告)日：2016-06-16
申请号：US14567916
申请日：2014-12-11
Applicant: Intel Corporation
Inventor： Kuan-Yu Chen , Yun Ling , Mohd Muhaiyiddin Bin Abdullah , Jackson Chung Peng Kong , Chung-Hao Chen , Hao-Han Hsu , Xiang Li
CPC classification number: H05K1/0242 , H01P3/026 , H01P3/18 , H01P11/003 , H05K1/0216 , H05K1/0245 , H05K3/4644
Abstract: Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.
Abstract translation: 描述用于在电路板中路由信号迹线的技术。 根据所述技术的电子设备的示例包括包括多个导电层的电路板。 导电层包括信号层和参考平面。 信号层包括信号迹线，参考平面包括附加信号迹线。
-
公开(公告)号：US20210118809A1
公开(公告)日：2021-04-22
申请号：US16606628
申请日：2017-05-31
Applicant: Intel Corporation
Inventor： Li-Sheng Weng , Chung-Hao Chen , James C. Matayabas, Jr. , Min Keen Tang
IPC: H01L23/552 , H01L23/31 , H05K9/00 , H01L23/00
Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.
-
公开(公告)号：US20200058994A1
公开(公告)日：2020-02-20
申请号：US16556866
申请日：2019-08-30
Applicant: INTEL CORPORATION
Inventor： Chung-Hao Chen
Abstract: An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.
-
公开(公告)号：US10269716B2
公开(公告)日：2019-04-23
申请号：US15201337
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Vijay Kasturi , Ana M. Yepes , Chung-Hao Chen , Bradley A. Jackson
IPC: H01L23/538 , H01L21/48 , H01L23/15
Abstract: Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.
-
-
-
-
-
-
-
-
-
Search Results
15
records
(took 0.015 seconds)
