公开(公告)号：US20220190918A1

公开(公告)日：2022-06-16

申请号：US17119844

申请日：2020-12-11

Applicant: Intel Corporation

Inventor： Brandon C. MARIN ,  Kaveh HOSSEINI ,  Conor O'KEEFFE ,  Hiroki TANAKA

IPC: H04B10/2581 ,  H04B10/50 ,  H04B10/66 ,  G02F1/09 ,  G02F1/01 ,  G02B27/28

Abstract: Embodiments disclosed herein include photonics systems with a dual polarization module. In an embodiment, a photonics patch comprises a patch substrate, and a photonics die over a first surface of the patch substrate. In an embodiment, a multiplexer is over a second surface of the patch substrate. In an embodiment, a first optical path from the photonics die to the multiplexer is provided for propagating a first optical signal, and a second optical path from the photonics die to the multiplexer is provided for propagating a second optical signal. In an embodiment, a Faraday rotator is provided along the second optical path to convert the second optical signal from a first mode to a second mode before reaching the multiplexer.

公开(公告)号：US20220197044A1

公开(公告)日：2022-06-23

申请号：US17131714

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Kaveh HOSSEINI ,  Conor O'KEEFFE ,  Brandon C. MARIN ,  Hiroki TANAKA

IPC: G02B27/28 ,  G02B6/10 ,  F21V8/00 ,  G02B6/27

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a dual polarization chiplet that may be used by an optical receiver to split multi-polarized light traveling on a single fiber and carrying two or more light signals into two or more fibers each carrying the particular light signal. The dual polarization chiplet may also be used by an optical transmitter to combine multiple light signals to be transmitted onto a single fiber, where each of the multiple light signals are represented by a different polarization of a wavelength on the single fiber. Other embodiments may be described and/or claimed.

公开(公告)号：US20220196936A1

公开(公告)日：2022-06-23

申请号：US17132967

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Kaveh HOSSEINI ,  Xiaoqian LI ,  Conor O'KEEFFE ,  Jing FANG ,  Kevin P. MA ,  Shamsul ABEDIN

IPC: G02B6/42 ,  H01L21/66

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a bidirectional optical grating coupler that may be used for testing. A photonic apparatus includes a first layer with electro-optical circuitry that is optically coupled with a bidirectional optical grating coupler. A second layer is physically coupled with a first side of the first layer and includes a first light path to optically coupled with the bidirectional optical grating coupler. A third layer is physically coupled with a second side of the first layer opposite the first side of the first layer, and includes a second light path that optically couples with the bidirectional grating coupler. Operational testing of the electro-optical circuitry is based in part on light received or transmitted through the second light path. Other embodiments may be described and/or claimed.

公开(公告)号：US20220092016A1

公开(公告)日：2022-03-24

申请号：US17031823

申请日：2020-09-24

Applicant: Intel Corporation

Inventor： Mahesh K. KUMASHIKAR ,  Dheeraj SUBBAREDDY ,  Anshuman THAKUR ,  MD Altaf HOSSAIN ,  Ankireddy NALAMALPU ,  Casey G. THIELEN ,  Daniel S. KLOWDEN ,  Kevin P. MA ,  Sergey Yuryevich SHUMARAYEV ,  Sandeep SANE ,  Conor O'KEEFFE

IPC: G06F13/42 ,  G06F13/40 ,  G06F13/16 ,  G11C7/10

Abstract: Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.