公开(公告)号：US20240096741A1

公开(公告)日：2024-03-21

申请号：US18520425

申请日：2023-11-27

Applicant: Intel Corporation

Inventor： Phil GENG ,  David SHIA ,  Ralph V. MIELE ,  Guixiang TAN ,  Jimmy CHUANG ,  Sandeep AHUJA ,  Sanjoy K. SAHA ,  Jeffory L. SMALLEY ,  Mark E. SPRENGER

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

公开(公告)号：US20210120670A1

公开(公告)日：2021-04-22

申请号：US17134028

申请日：2020-12-24

Applicant: Intel Corporation

Inventor： Guixiang TAN ,  Xiang LI ,  Casey WINKEL ,  George VERGIS

IPC: H05K1/11 ,  H05K5/02 ,  H05K5/00 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

公开(公告)号：US20230092972A1

公开(公告)日：2023-03-23

申请号：US18070433

申请日：2022-11-28

Applicant: Intel Corporation

Inventor： Phil GENG ,  Guixiang TAN ,  Yanbing SUN ,  Xiang LI ,  George VERGIS ,  Sanjoy K. SAHA

IPC: H05K7/10 ,  H05K1/11 ,  H01L23/473 ,  H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

公开(公告)号：US20220225542A1

公开(公告)日：2022-07-14

申请号：US17710640

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Tong Wa CHAO ,  Mark BIANCO ,  Yanbing SUN ,  Ming ZHANG ,  Guixiang TAN ,  Devdatta P. KULKARNI ,  Guocheng ZHANG ,  Hao ZHOU

IPC: H05K7/20 ,  G11C5/04

Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

公开(公告)号：US20210321543A1

公开(公告)日：2021-10-14

申请号：US17357776

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Guixiang TAN ,  Xiang LI ,  Jimmy CHUANG ,  Devdatta P. KULKARNI ,  Casey WINKEL ,  Evan A. CHENELLY

IPC: H05K7/20 ,  G06F1/20 ,  G11C5/04

Abstract: An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.