公开(公告)号：US09646910B2

公开(公告)日：2017-05-09

申请号：US15019931

申请日：2016-02-09

Applicant: INTEL CORPORATION

Inventor： Sandeep Ahuja ,  Eric W. Buddrius ,  Roger D. Flynn ,  Rajat Agarwal

IPC: H05K7/20 ,  H05K13/00 ,  G06F1/20 ,  H01L23/36 ,  H01L23/433 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/36 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/433 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K7/20445 ,  Y10T29/49002 ,  H01L2924/00

Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

公开(公告)号：US20160155682A1

公开(公告)日：2016-06-02

申请号：US15019931

申请日：2016-02-09

Applicant: INTEL CORPORATION

Inventor： Sandeep Ahuja ,  Eric W. Buddrius ,  Roger D. Flynn ,  Rajat Agarwal

IPC: H01L23/36 ,  H01L25/00 ,  H01L25/065 ,  H01L23/433 ,  H01L21/48

CPC classification number: H01L23/36 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/433 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K7/20445 ,  Y10T29/49002 ,  H01L2924/00

Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

Abstract translation: 在至少一些实施例中，使热传递最大化的电子封装包括在基板上的多个部件。 组件上安装有加强板。 加强板具有露出部件的开口。 多个单独的集成散热器安装在部件的开口内。 第一热界面材料层（TIM1）沉积在组件和多个单独的集成散热器之间。 在至少一些实施例中，对于部件，TIM1的厚度最小化。

公开(公告)号：US09721871B2

公开(公告)日：2017-08-01

申请号：US14958420

申请日：2015-12-03

Applicant: Intel Corporation

Inventor： Emery E. Frey ,  Eric D. McAfee ,  Shankar Krishnan ,  Juan G. Cevallos ,  Roger D. Flynn

IPC: H01L23/473 ,  H01L23/34 ,  H01L23/40 ,  H01L23/28 ,  H01L23/367 ,  H01L23/46 ,  B23P15/26 ,  G06F1/20 ,  H01L21/48 ,  H01L23/00 ,  H01L23/36 ,  H01L23/44

CPC classification number: H01L23/473 ,  B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/28 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/44 ,  H01L23/46 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1432

Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

公开(公告)号：US20170162475A1

公开(公告)日：2017-06-08

申请号：US14958420

申请日：2015-12-03

Applicant: Intel Corporation

Inventor： Emery E. Frey ,  Eric D. McAfee ,  Shankar Krishnan ,  Juan G. Cevallos ,  Roger D. Flynn

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/367 ,  H01L21/48 ,  B23P15/26 ,  G06F1/20

CPC classification number: H01L23/473 ,  B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/28 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/44 ,  H01L23/46 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1432

Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.