公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20230038805A1

公开(公告)日：2023-02-09

申请号：US17956624

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Ralph Miele ,  Sandeep Ahuja ,  Jeffory Smalley

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/40

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

公开(公告)号：US20160179158A1

公开(公告)日：2016-06-23

申请号：US14852859

申请日：2015-09-14

Applicant: Intel Corporation

Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC: G06F1/26 ,  G06F1/18 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F3/0412 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，处理器包括至少一个核心和电源管理逻辑。 电源管理逻辑用于从包括处理器的封装内的多个管芯接收温度数据，并且确定多个温度控制裕度的最小温度控制裕度。 每个温度控制余量将基于与管芯相关联的相应的热控制温度并且还基于与管芯相关联的相应的温度数据来确定。 电源管理逻辑还可以生成包含最小温度控制余量的热报告，并存储热报告。 描述和要求保护其他实施例。

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20230380102A1

公开(公告)日：2023-11-23

申请号：US18358329

申请日：2023-07-25

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Nishi Ahuja ,  Jun Zhang ,  Qing Qiao ,  Checa Hung ,  Yung Shun Liang ,  Min Wu ,  Ying-Shan Lo ,  Carrie Chen ,  Jia-Hong Wu

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272 ,  H05K7/20763

Abstract: Example method and apparatus, systems, and articles of manufacture for immersion cooling systems are disclosed herein. An example apparatus disclosed herein includes a tank to hold a coolant, an overflow chamber to direct the coolant toward an outlet, and a plate within the overflow chamber, the plate including a plurality of openings, the coolant to pass through at least one of the plurality of openings before reaching the outlet.

公开(公告)号：US11495518B2

公开(公告)日：2022-11-08

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L31/00 ,  H01L21/00 ,  H01L23/40 ,  H01L25/18 ,  H01L23/427

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US20200301490A1

公开(公告)日：2020-09-24

申请号：US16898603

申请日：2020-06-11

Applicant: Intel Corporation

Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  G06F3/041

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

公开(公告)号：US20200251403A1

公开(公告)日：2020-08-06

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L23/40 ,  H01L23/427 ,  H01L25/18

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US10275001B2

公开(公告)日：2019-04-30

申请号：US14752512

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Timothy Y. Kam ,  Sandeep Ahuja ,  Rajat Agarwal ,  Avinash Sodani ,  Jinho Suh ,  Meenakshisundaram Chinthamani

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3225

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

公开(公告)号：US20160378149A1

公开(公告)日：2016-12-29

申请号：US14752512

申请日：2015-06-26

Applicant: INTEL CORPORATION

Inventor： Timothy Y. Kam ,  Sandeep Ahuja ,  Rajat Agarwal ,  Avinash Sodani ,  Jinho Suh ,  Meenakshisundaram Chinthamani

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3225 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3275 ,  G06F2212/1028 ,  G11C7/04 ,  Y02D10/126 ,  Y02D10/13 ,  Y02D10/14 ,  Y02D10/16

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

Abstract translation: 这里公开了一种被配置为实现计算设备的部件的热调节的计算设备。 计算设备包括热耦合到电子部件的电子部件和温度传感器。 计算设备还包括热管理控制器，用于从温度传感器接收温度测量并产生电子部件的节流因子。 如果温度测量值大于指定的阈值，则节流因素是将电子元件的性能降至至少为电子元件的性能保证。