公开(公告)号：US20240214022A1

公开(公告)日：2024-06-27

申请号：US18145860

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Vamshi Krishna AAGIRU ,  Santhosh AP ,  Praveen Kashyap Ananta BHAT ,  Arjun C ,  Shailendra Singh CHAUHAN ,  Sajal Kumar DAS ,  Walid EL HAJJ ,  Isha GARG ,  Sagar GUPTA ,  Mallari HANCHATE ,  Mythili HEGDE ,  Siva Prasad JANGILI GANGA ,  Satyajit Siddharay KAMAT ,  Noam KOGOS ,  Ronen KRONFELD ,  Adiel LANGER ,  Gil MEYUHAS ,  Padmesh MURUGAN LATHA ,  Vishram Shriram PANDIT ,  Abhijith PRABHA ,  Manisha RAIGURU ,  Ehud RESHEF ,  Amir RUBIN ,  Shubham Kumar SAHU ,  Gurpreet SANDHU ,  Michael SHACHAR ,  Harry SKINNER ,  Madhukiran SRINIVASAREDDY ,  Gokul SUBRAMANIAM ,  Maruti TAMRAKAR ,  Jayprakash THAKUR ,  Vijaya Prasad UMMELLA ,  Yagnesh Vinodrai WAGHELA

IPC: H04B1/3827 ,  H04W52/36

CPC classification number: H04B1/3838 ,  H04W52/365 ,  H04B2001/3844

Abstract: Various principles and methods are described herein to improve wireless communication in a user computing device. Certain aspects of the disclosure describe management of wireless transmissions relative to various regulations related to a specific absorption rate. Other aspects of the disclosure relate to detection of user proximity to a transmitting antenna. Other aspects relate to alternative strategies to improve wireless communication, such as selection of alternate antennas or baseband modems, or changes in device orientation.

公开(公告)号：US20230387978A1

公开(公告)日：2023-11-30

申请号：US18049651

申请日：2022-10-26

Applicant: Intel Corporation

Inventor： Santhosh AP ,  Madhukiran SREENIVASAREDDY ,  Vamshi Krishna AAGIRU ,  Praveen KUMAR ,  Nithesha ANANDA

IPC: H04B7/06 ,  H04B17/336

CPC classification number: H04B7/0608 ,  H04B17/336

Abstract: A mobile communication device including a processor configured to: retrieve a first isolation metric from a lookup table between an antenna and a first further antenna; retrieve a second isolation metric from a lookup table between the antenna and the second further antenna; determine that the second isolation metric is greater than the first isolation metric; and switch transmitting the signal from the first further antenna to the second further antenna.

公开(公告)号：US20240196344A1

公开(公告)日：2024-06-13

申请号：US18063094

申请日：2022-12-08

Applicant: Intel Corporation

Inventor： Vamshi Krishna AAGIRU ,  Nithesha ANANDA ,  Santhosh AP ,  Abir CHATTERJEE ,  Sajal Kumar DAS ,  Walid EL HAJJ ,  Noam KOGOS ,  Adiel LANGER ,  Gil MEYUHAS ,  Amir RUBIN ,  Michael SHACHAR ,  Nidhi P. SHETTY ,  Madhukiran SRINIVASAREDDY ,  Ricardo VELASCO

IPC: H04W52/36 ,  H04W52/22 ,  H04W76/28

CPC classification number: H04W52/367 ,  H04W52/225 ,  H04W76/28

Abstract: Devices with radiating antennas are subject to various regulations designed to limit the absorption of radiofrequency energy in a human body part in close proximity to a radiating antenna. Various conventional strategies are available for management of transmissions to comply with these regulations; however, each of these conventional strategies has drawbacks, such as a negative effect on the wireless link. Various strategies are disclosed herein to comply with the requisite regulations while maintaining the wireless link. In addition, strategies are presented to select wireless link rates, taking into account limitations that may be in place to satisfy the necessary regulations.

公开(公告)号：US20230141967A1

公开(公告)日：2023-05-11

申请号：US17520768

申请日：2021-11-08

Applicant: Intel Corporation

Inventor： Shailendra Singh CHAUHAN ,  Santhosh AP ,  Arunthathi CHANDRABOSE ,  Mythili HEGDE

IPC: H04W52/02 ,  H04B7/0413

CPC classification number: H04W52/0261 ,  H04B7/0413 ,  H04W84/12

Abstract: A battery-powered device includes a baseband modem, configured to receive or send data according to a first operational mode, wherein the data correspond to a software application being executed on the battery-powered device; and a processor, configured to determine a resource requirement of the software application; and send a signal representing the determined resource requirement to the baseband modem; wherein the baseband modem is further configured to change from the first operational mode to a second operational mode based on the signal.

公开(公告)号：US20230098822A1

公开(公告)日：2023-03-30

申请号：US17868800

申请日：2022-07-20

Applicant: Intel Corporation

Inventor： Santhosh AP ,  Madhukiran SREENIVASAREDDY ,  Vamshi Krishna AAGIRU ,  Nithesha ANANDA

IPC: H04W52/22 ,  H04B1/3827

Abstract: A method comprising: retrieving a predefined power threshold; determining a transmission power of a transmitting antenna, wherein the transmitting antenna is actively transmitting a signal; retrieving a predefined transmission time interval; determining that the transmission power exceeds the predefined power threshold; determining a duration of transmitting the signal; comparing the duration with the predefined transmission time interval; and switching transmitting the signal from the transmitting antenna to a further antenna when the duration equals the predefined transmission time interval.

公开(公告)号：US20230006375A1

公开(公告)日：2023-01-05

申请号：US17902503

申请日：2022-09-02

Applicant: Intel Corporation

Inventor： Shailendra Singh CHAUHAN ,  Bijendra SINGH ,  Siva Prasad JANGILI GANGA ,  Santhosh AP ,  Ranjul BALAKRISHNAN

IPC: H01R12/71 ,  H01R12/52 ,  H01R13/24

Abstract: Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.