公开(公告)号：US10574100B2

公开(公告)日：2020-02-25

申请号：US15086578

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Konstantin Matyuch ,  Barak Freedman ,  Vladimir Malamud ,  Arnon Hirshberg ,  Israel Petronius

IPC: H02K41/02 ,  H02K1/17 ,  H02K11/30 ,  B81B7/02 ,  G02B26/08 ,  H02K15/03 ,  H02K15/12

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.

公开(公告)号：US20180235075A1

公开(公告)日：2018-08-16

申请号：US15434919

申请日：2017-02-16

Applicant: Intel Corporation

Inventor： Taylor Gaines ,  Anna M. Prakash ,  Ziv Belman ,  Baruch Schiffmann ,  Arnon Hirshberg ,  Ron Wittenberg ,  Vladimir Malamud

IPC: H05K1/02 ,  H05K3/22 ,  H05K1/18

CPC classification number: H01L23/552 ,  H05K1/0218 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/2018 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

公开(公告)号：US20190002735A1

公开(公告)日：2019-01-03

申请号：US15637960

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Mohit Gupta ,  Anna M. Prakash ,  Vladimir Malamud ,  Mark Saltas ,  Ziv Belman

IPC: C09J7/02 ,  H01B1/02 ,  H01L23/36 ,  C09J1/00

Abstract: Aspects of the embodiments are directed to an optoelectronic device that includes one or more pressure sensitive adhesives to secure components during an assembly process. The optoelectronic device includes an electromagnetic interference/radio frequency interference shield. The shield can include an aperture for permitting light to enter a photodetector. An infrared filter can be secured to the shield using a pressure sensitive adhesive (PSA) film. The PSA film can be a templated film that is double sided. A PSA film can also be used to secure the shield to the printed circuit board (PCB) of the optoelectronic device. To promote electromagnetic conduction between the shield and the PCB, the PSA film can include additives. Aspects of the embodiments are directed to methods for assembling the optoelectronic device by picking and placing a PSA film and applying a pressure to certain components to activate the PSA film adhesion.

公开(公告)号：US10317952B2

公开(公告)日：2019-06-11

申请号：US15282950

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： Sandeep S. Iyer ,  Amanuel Abebaw ,  Mark Saltas ,  Mayank Patel ,  Charavana K. Gurumurthy ,  Suriyakala Ramalingam ,  Vladimir Malamud

IPC: G06F1/16 ,  H01F7/02

Abstract: An apparatus is provided which comprises: a chassis compartment having a bottom surface and walls orthogonal to the bottom, wherein the chassis compartment comprises: a rectangular opening, which may be designed to accept a microelectromechanical (MEMS) device and four slots, which may be designed to accept one or more magnet(s), extending outwardly from the rectangular opening, wherein each of the slots comprises: an inner opening having a length coextensive with a side of the rectangular opening, and an outer opening having corresponding ends that extend a length of the outer opening beyond the length of the inner opening. Other embodiments are also disclosed and claimed.

公开(公告)号：US20170288479A1

公开(公告)日：2017-10-05

申请号：US15086578

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Konstantin Matyuch ,  Barak Freedman ,  Vladimir Malamud ,  Arnon Hirshberg ,  Israel Petronius

IPC: H02K1/17 ,  G02B26/08 ,  H02K15/12 ,  B81B7/02 ,  H02K11/30 ,  H02K15/03

CPC classification number: H02K1/17 ,  B81B3/0091 ,  B81B7/02 ,  B81B2201/042 ,  G02B26/085 ,  H02K11/30 ,  H02K15/03 ,  H02K15/12

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.