-
公开(公告)号：US10317952B2
公开(公告)日：2019-06-11
申请号：US15282950
申请日：2016-09-30
Applicant: INTEL CORPORATION
Inventor： Sandeep S. Iyer , Amanuel Abebaw , Mark Saltas , Mayank Patel , Charavana K. Gurumurthy , Suriyakala Ramalingam , Vladimir Malamud
Abstract: An apparatus is provided which comprises: a chassis compartment having a bottom surface and walls orthogonal to the bottom, wherein the chassis compartment comprises: a rectangular opening, which may be designed to accept a microelectromechanical (MEMS) device and four slots, which may be designed to accept one or more magnet(s), extending outwardly from the rectangular opening, wherein each of the slots comprises: an inner opening having a length coextensive with a side of the rectangular opening, and an outer opening having corresponding ends that extend a length of the outer opening beyond the length of the inner opening. Other embodiments are also disclosed and claimed.
-
公开(公告)号：US10125013B2
公开(公告)日：2018-11-13
申请号：US15354761
申请日：2016-11-17
Applicant: Intel Corporation
Inventor： Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
Abstract: Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
-
公开(公告)号：US10315200B2
公开(公告)日：2019-06-11
申请号：US15638167
申请日：2017-06-29
Applicant: Intel Corporation
Inventor： Amanuel M Abebaw , Mark Saltas , Anna M. Prakash , Liwei Wang
Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material. The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.
-
公开(公告)号：US20190006097A1
公开(公告)日：2019-01-03
申请号：US15640040
申请日：2017-06-30
Applicant: Intel Corporation
Inventor： Mark Saltas , Amanuel M Abebaw
Abstract: An apparatus for positioning magnetic components may include a base. The base may include an upper surface. The base may include a lower surface. The base may include a contact surface. The base may include a vacuum line in communication with the upper surface and the contact surface. The base may include a first pin. The base may include a second pin. The first pin and the second pin may be positioned adjacent the contact surface. The first pin and the second pin may protrude from the lower surface of the base. The base may be configured to generate a vacuum at the contact surface when a vacuum is applied to the vacuum line.
-
公开(公告)号：US20180337129A1
公开(公告)日：2018-11-22
申请号：US15774937
申请日：2015-12-11
Applicant: Intel Corporation
Inventor： Eric J. Li , Timothy A. Gosselin , Yoshihiro Tomita , Shawna M. Liff , Amram Eitan , Mark Saltas
IPC: H01L23/538 , H01L21/48 , H01L21/56 , H01L23/31
CPC classification number: H01L23/5381 , H01L21/4853 , H01L21/561 , H01L21/563 , H01L21/568 , H01L23/13 , H01L23/3157 , H01L23/48 , H01L23/5383 , H01L23/5385 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/96 , H01L25/0655 , H01L2224/11002 , H01L2224/1182 , H01L2224/12105 , H01L2224/131 , H01L2224/14134 , H01L2224/14177 , H01L2224/16148 , H01L2224/16227 , H01L2224/16238 , H01L2224/1701 , H01L2224/1703 , H01L2224/27002 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81005 , H01L2224/81011 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/83005 , H01L2224/83102 , H01L2224/83104 , H01L2224/92125 , H01L2224/95 , H01L2224/95001 , H01L2224/96 , H01L2924/15153 , H01L2924/15192 , H01L2924/181 , H01L2924/18161 , H01L2224/14131 , H01L2224/11 , H01L2924/00014 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2224/27
Abstract: A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
-
Patent Agency Ranking
公开(公告)号：US11156815B2
公开(公告)日：2021-10-26
申请号：US16336607
申请日：2016-09-30
Applicant: Intel Corporation
Inventor： Chia-Pin Chiu , Anna M. Prakash , Amanuel M Abebaw , Olga Gorbounova , Ching-Ping Janet Shen , Shan Zhong , Mark Saltas
Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesive layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.
-
公开(公告)号：US10790231B2
公开(公告)日：2020-09-29
申请号：US16510295
申请日：2019-07-12
Applicant: Intel Corporation
Inventor： Eric J. Li , Timothy A. Gosselin , Yoshihiro Tomita , Shawna M. Liff , Amram Eitan , Mark Saltas
IPC: H01L23/538 , H01L21/56 , H01L23/13 , H01L23/48 , H01L23/00 , H01L25/065 , H01L21/48 , H01L23/31
Abstract: A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
-
公开(公告)号：US10418329B2
公开(公告)日：2019-09-17
申请号：US15774937
申请日：2015-12-11
Applicant: Intel Corporation
Inventor： Eric J. Li , Timothy A. Gosselin , Yoshihiro Tomita , Shawna M. Liff , Amram Eitan , Mark Saltas
IPC: H01L23/538 , H01L23/48 , H01L23/13 , H01L21/56 , H01L23/00 , H01L25/065 , H01L21/48 , H01L23/31
Abstract: A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
-
公开(公告)号：US11075166B2
公开(公告)日：2021-07-27
申请号：US17005002
申请日：2020-08-27
Applicant: Intel Corporation
Inventor： Eric J. Li , Timothy A. Gosselin , Yoshihiro Tomita , Shawna M. Liff , Amram Eitan , Mark Saltas
IPC: H01L23/538 , H01L21/56 , H01L23/13 , H01L23/48 , H01L23/00 , H01L25/065 , H01L21/48 , H01L23/31
Abstract: A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
-
公开(公告)号：US10566134B2
公开(公告)日：2020-02-18
申请号：US15640040
申请日：2017-06-30
Applicant: Intel Corporation
Inventor： Mark Saltas , Amanuel M Abebaw
Abstract: An apparatus for positioning magnetic components may include a base. The base may include an upper surface. The base may include a lower surface. The base may include a contact surface. The base may include a vacuum line in communication with the upper surface and the contact surface. The base may include a first pin. The base may include a second pin. The first pin and the second pin may be positioned adjacent the contact surface. The first pin and the second pin may protrude from the lower surface of the base. The base may be configured to generate a vacuum at the contact surface when a vacuum is applied to the vacuum line.
-
-
-
-
-
-
-
-
-
Search Results
15
records
(took 0.012 seconds)
