公开(公告)号：US10317952B2

公开(公告)日：2019-06-11

申请号：US15282950

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： Sandeep S. Iyer ,  Amanuel Abebaw ,  Mark Saltas ,  Mayank Patel ,  Charavana K. Gurumurthy ,  Suriyakala Ramalingam ,  Vladimir Malamud

IPC: G06F1/16 ,  H01F7/02

Abstract: An apparatus is provided which comprises: a chassis compartment having a bottom surface and walls orthogonal to the bottom, wherein the chassis compartment comprises: a rectangular opening, which may be designed to accept a microelectromechanical (MEMS) device and four slots, which may be designed to accept one or more magnet(s), extending outwardly from the rectangular opening, wherein each of the slots comprises: an inner opening having a length coextensive with a side of the rectangular opening, and an outer opening having corresponding ends that extend a length of the outer opening beyond the length of the inner opening. Other embodiments are also disclosed and claimed.

公开(公告)号：US20190391386A1

公开(公告)日：2019-12-26

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US20170263517A1

公开(公告)日：2017-09-14

申请号：US15607352

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Robert F. Cheney ,  Ashish Dhall ,  Suriyakala Ramalingam

IPC: H01L23/24 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83007 ,  H01L2224/83051 ,  H01L2224/83104 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

公开(公告)号：US09691675B1

公开(公告)日：2017-06-27

申请号：US14977670

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Robert F Cheney ,  Ashish Dhall ,  Suriyakala Ramalingam

IPC: H01L23/04 ,  H01L23/24 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

公开(公告)号：US20170178988A1

公开(公告)日：2017-06-22

申请号：US14977670

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Robert F Cheney ,  Ashish Dhall ,  Suriyakala Ramalingam

IPC: H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

公开(公告)号：US20180070456A1

公开(公告)日：2018-03-08

申请号：US15257726

申请日：2016-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Suriyakala Ramalingam ,  Chester C. Lee ,  Raiyomand F. Aspandiar

IPC: H05K3/28 ,  H05K1/18 ,  H01L21/56

CPC classification number: H05K3/284 ,  H01L21/563 ,  H05K1/18 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1338 ,  H05K2203/304

Abstract: An electronic system may include a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer may include parylene. Furthermore, the electronic system may include an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments may be described and/or claimed.

公开(公告)号：US20160343591A1

公开(公告)日：2016-11-24

申请号：US15225678

申请日：2016-08-01

Applicant: INTEL CORPORATION

Inventor： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen-Givoni ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29

Abstract: Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于具有以通常随机分布图案排列的填充颗粒的底部填充层的集成电路（IC）封装的技术和配置。 在一些实施例中，通过对IC封装组件的一个或多个部件上的静电电荷，通过对填料进行表面处理以减少填充剂电荷，可以通过施加电力来抵抗填料颗粒的大致随机分布图案 通过使用相对较低的最大填充剂粒度的底部填充材料和/或通过在相对低的温度下快速固化底部填充层，使底部填充材料的填料颗粒在与重力方向相反的方向上。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160240395A1

公开(公告)日：2016-08-18

申请号：US15139265

申请日：2016-04-26

Applicant: Intel Corporation

Inventor： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/29647 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括用硫醇粘合促进剂，唑偶合剂，表面改性填料和基于过氧化物的交联聚合物化学物质之一改性底部填充材料，以便利用本文的实施方案极大地增强包装结构中的粘合性。

公开(公告)号：US11022792B2

公开(公告)日：2021-06-01

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US10356912B2

公开(公告)日：2019-07-16

申请号：US15257726

申请日：2016-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Suriyakala Ramalingam ,  Chester C. Lee ,  Raiyomand F. Aspandiar

IPC: H05K1/18 ,  H05K3/28 ,  H01L21/56

Abstract: An electronic system includes a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer includes parylene. Furthermore, the electronic system includes an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments being described and/or claimed.