公开(公告)号：US20190043778A1

公开(公告)日：2019-02-07

申请号：US16061324

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Zhizhong TANG ,  Shinobu KOURAKATA ,  Kazuo OGATA ,  Paul R. START ,  Syadwad JIAN ,  William Nicholas LABANOK ,  Wei HU ,  Peng LI ,  Douglas R. YOUNG ,  Gregory S. CONSTABLE ,  John J. Beatty ,  Pardeep K. BHATTI ,  Luke J. GARNER ,  Aravindha R. ANTONISWAMY

IPC: H01L23/367 ,  H01L21/48 ,  H01L25/065

Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.

公开(公告)号：US20170179080A1

公开(公告)日：2017-06-22

申请号：US14975128

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Akshay MATHKAR ,  Nachiket Raghunath RARAVIKAR ,  Donald Tiendung TRAN ,  Jerry Lee JENSEN ,  Javier A. FALCON ,  William Nicholas LABANOK ,  Robert Leon SANKMAN ,  Robert Allen STINGEL

IPC: H01L25/065 ,  H01L23/29 ,  H05K1/02 ,  H01L21/56 ,  H01L25/00 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/293 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H05K1/0298 ,  H05K1/115

Abstract: Semiconductor package interposers having high-density and high-aspect ratio encapsulated interconnects, and semiconductor package assemblies incorporating such interposers, are described. In an example, a semiconductor package interposer includes several conductive interconnects encapsulated in a polymer substrate and having height dimensions greater than a cross-sectional dimension. The semiconductor package interposer may support a first semiconductor package above a second semiconductor package and may electrically connect die pins of the first semiconductor package to die pins of the second semiconductor package.