公开(公告)号：US20240172393A1

公开(公告)日：2024-05-23

申请号：US18428991

申请日：2024-01-31

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Yang Yao ,  Ming Zhang ,  Yuehong Fan ,  Xiang Que ,  Mark MacDonald ,  Casey Jamesen Carte ,  Yue Yang ,  Eric D. McAfee ,  Satyam Saini ,  Suchismita Sarangi ,  Drew Damm ,  Jessica Gullbrand

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

Abstract: Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

公开(公告)号：US20250081396A1

公开(公告)日：2025-03-06

申请号：US18948081

申请日：2024-11-14

Applicant: Intel Corporation

Inventor： Guangying Zhang ,  Chuanlou Wang ,  Yuehong Fan ,  Shaorong Zhou ,  Yang Yao ,  Yingqiong Bu ,  Xiang Que ,  Guoliang Ying

IPC: H05K7/20

Abstract: Immersion cooling systems are disclosed. An example immersion cooling system includes an immersion tank including a cooling fluid and a reservoir to contain a recirculated portion of the cooling fluid. The reservoir is separated from the immersion tank by a height to generate a liquid surface height variance between the cooling fluid in the immersion tank and the cooling fluid in the reservoir. A supply conduit is to fluidly couple the immersion tank and the reservoir. The cooling fluid to be provided from the reservoir to the immersion tank via gravity.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

Applicant: Intel Corporation

Inventor： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.