中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.044 seconds)

    Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
    1.
    发明授权
    Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures 有权

    公开(公告)号：US10532926B2

    公开(公告)日：2020-01-14

    申请号：US15358956

    申请日：2016-11-22

    Applicant: INVENSENSE, INC.

    Inventor： Michael Daneman ,  Martin Lim ,  Kegang Huang ,  Igor Tchertkov

    IPC: B81B7/02 ,  B81C1/00

    Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

    MICROELECTROMECHANICAL MICROPHONE WITH DIFFERENTIAL CAPACITIVE SENSING
    2.
    发明申请
    MICROELECTROMECHANICAL MICROPHONE WITH DIFFERENTIAL CAPACITIVE SENSING 审中-公开
    具有差分电容感应的微电子麦克风

    公开(公告)号：US20160360322A1

    公开(公告)日：2016-12-08

    申请号：US14733560

    申请日：2015-06-08

    Applicant: INVENSENSE, INC.

    Inventor： Fang Liu ,  Michael Daneman ,  Thomas Chen

    IPC: H04R19/04 ,  H04R31/00 ,  H04R7/16

    CPC classification number: H04R19/04 ,  H04R19/005 ,  H04R31/00

    Abstract: Microelectromechanical microphones include structures that permit differential capacitive sensing. In certain structures, a movable plate is disposed between a rigid plate and a substrate. A first capacitor is formed between the movable plate and the substrate and a second capacitor is formed between the movable plate and the rigid plate. Respective bias voltages can be applied to the rigid plate and the substrate, and a differential capacitive signal can be probed in response to displacement of the movable plate caused by a pressure wave. The movable plate and the rigid plate are mechanically coupled to first and second portions of the substrate, respectively. A dielectric member mechanically couples the movable plate and the rigid plate, thus providing mechanical stability.

    Abstract translation: 微电子麦克风包括允许差分电容感测的结构。 在某些结构中，可动板设置在刚性板和衬底之间。 在可动板和基板之间形成第一电容器，在可动板和刚性板之间形成第二电容器。 可以对刚性板和衬底施加相应的偏置电压，并且可以响应于由压力波引起的可移动板的位移来探测差分电容信号。 可移动板和刚性板分别机械耦合到基板的第一和第二部分。 电介质构件将可动板与刚性板机械连接，从而提供机械稳定性。

    Image generation in an electronic device using ultrasonic transducers
    3.
    发明授权
    Image generation in an electronic device using ultrasonic transducers 有权

    公开(公告)号：US10474862B2

    公开(公告)日：2019-11-12

    申请号：US15611704

    申请日：2017-06-01

    Applicant: InvenSense, Inc.

    Inventor： Bruno W. Garlepp ,  Michael H. Perrott ,  Michael Daneman ,  James Christian Salvia ,  Nikhil Apte

    IPC: G06K9/00

    Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image. An electronic device and a method of generating an image of a fingerprint with a fingerprint sensor are also provided.

    PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS
    6.
    发明申请
    PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS 审中-公开
    具有集成CMOS的压电麦克风

    公开(公告)号：US20160090300A1

    公开(公告)日：2016-03-31

    申请号：US14860139

    申请日：2015-09-21

    Applicant: INVENSENSE, INC.

    Inventor： Julius Ming-Lin Tsai ,  Michael Daneman

    IPC: B81B7/02 ,  B81C1/00

    Abstract: A piezoelectric microphone and/or a piezoelectric microphone system is presented herein. In an implementation, a piezoelectric microphone includes a microelectromechanical systems (MEMS) layer and a complementary metal-oxide-semiconductor (CMOS) layer. The MEMS layer includes at least one piezoelectric layer and a conductive layer. The conductive layer is deposited on the at least one piezoelectric layer and is associated with at least one sensing electrode. The CMOS layer is deposited on the MEMS layer. Furthermore, a cavity formed in the CMOS layer includes the at least one sensing electrode

    Abstract translation: 此处呈现压电麦克风和/或压电麦克风系统。 在一个实现中，压电麦克风包括微机电系统（MEMS）层和互补金属氧化物半导体（CMOS）层。 MEMS层包括至少一个压电层和导电层。 导电层沉积在至少一个压电层上并且与至少一个感测电极相关联。 CMOS层沉积在MEMS层上。 此外，形成在CMOS层中的空腔包括至少一个感测电极

    Image generation in an electronic device using ultrasonic transducers
    7.
    发明授权
    Image generation in an electronic device using ultrasonic transducers 有权

    公开(公告)号：US10860831B2

    公开(公告)日：2020-12-08

    申请号：US16679067

    申请日：2019-11-08

    Applicant: InvenSense, Inc.

    Inventor： Bruno W. Garlepp ,  Michael H. Perrott ,  Michael Daneman ,  James Christian Salvia ,  Nikhil Apte

    IPC: G06K9/00

    Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image. An electronic device and a method of generating an image of a fingerprint with a fingerprint sensor are also provided.

    Supplemental sensor modes and systems for ultrasonic transducers
    9.
    发明授权
    Supplemental sensor modes and systems for ultrasonic transducers 有权

    公开(公告)号：US11471912B2

    公开(公告)日：2022-10-18

    申请号：US16592618

    申请日：2019-10-03

    Applicant: InvenSense, Inc.

    Inventor： Nikhil Apte ,  Renata Melamud Berger ,  Michael Daneman

    IPC: B06B1/06 ,  B06B1/02

    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

    Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
    10.
    发明授权
    Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures 有权

    公开(公告)号：US10850973B2

    公开(公告)日：2020-12-01

    申请号：US16698535

    申请日：2019-11-27

    Applicant: INVENSENSE, INC.

    Inventor： Michael Daneman ,  Martin Lim ,  Kegang Huang ,  Igor Tchertkov

    IPC: B81B7/02 ,  B81C1/00

    Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Patent Agency Ranking