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公开(公告)号：US10461124B2
公开(公告)日：2019-10-29
申请号：US15670976
申请日：2017-08-07
Applicant: InvenSense, Inc.
Inventor： Renata Melamud Berger , Julius Ming-Lin Tsai , Stephen Lloyd
Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
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公开(公告)号：US10408797B2
公开(公告)日：2019-09-10
申请号：US15424720
申请日：2017-02-03
Applicant: InvenSense, Inc.
Inventor： Nikhil Apte , Renata Melamud Berger , Michael Daneman , James Christian Salvia
IPC: G01N29/32 , G01N29/44 , G01N29/38 , G01N29/04 , G01N29/30 , B06B1/02 , B06B1/06 , G01S7/52 , G01S7/521
Abstract: An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.
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公开(公告)号：US11517938B2
公开(公告)日：2022-12-06
申请号：US16107894
申请日：2018-08-21
Applicant: InvenSense, Inc.
Inventor： Mei-Lin Chan , Nikhil Apte , Renata Melamud Berger
Abstract: An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.
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公开(公告)号：US11107858B2
公开(公告)日：2021-08-31
申请号：US16666024
申请日：2019-10-28
Applicant: InvenSense, Inc.
Inventor： Renata Melamud Berger , Julius Ming-Lin Tsai , Stephen Lloyd
Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
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公开(公告)号：US20160127845A1
公开(公告)日：2016-05-05
申请号：US14527235
申请日：2014-10-29
Applicant: INVENSENSE, INC.
Inventor： Baris Cagdaser , Renata Melamud Berger , Omid Oliaei , Aleksey S. Khenkin
IPC: H04R29/00
CPC classification number: H04R29/004 , H04R3/00 , H04R3/04 , H04R25/305 , H04R2201/003 , H04R2460/11 , H04R2499/11
Abstract: Systems and techniques for detecting blockage associated with a microelectromechanical systems (MEMS) microphone of a device are presented. The device includes a MEMS acoustic sensor and a processor. The MEMS acoustic sensor is contained in a cavity within the device. The processor is configured to detect a blockage condition associated with an opening of the cavity that contains the MEMS acoustic sensor.
Abstract translation: 提出了用于检测与设备的微机电系统（MEMS）麦克风相关联的阻塞的系统和技术。 该装置包括MEMS声学传感器和处理器。 MEMS声学传感器被包含在装置内的空腔中。 处理器被配置为检测与包含MEMS声学传感器的腔的开口相关联的阻塞状态。
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Patent Agency Ranking
公开(公告)号：US11471912B2
公开(公告)日：2022-10-18
申请号：US16592618
申请日：2019-10-03
Applicant: InvenSense, Inc.
Inventor： Nikhil Apte , Renata Melamud Berger , Michael Daneman
Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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公开(公告)号：US10441975B2
公开(公告)日：2019-10-15
申请号：US15419835
申请日：2017-01-30
Applicant: InvenSense, Inc.
Inventor： Nikhil Apte , Renata Melamud Berger , Michael Daneman
Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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公开(公告)号：US10670716B2
公开(公告)日：2020-06-02
申请号：US15266673
申请日：2016-09-15
Applicant: InvenSense, Inc.
Inventor： Nikhil Apte , Julius Ming-Lin Tsai , Michael Julian Daneman , Renata Melamud Berger
Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam. The activation also includes receiving reflected ultrasonic signals at a second group of ultrasonic transducers of the plurality of ultrasonic transducers.
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公开(公告)号：US10045126B2
公开(公告)日：2018-08-07
申请号：US14962182
申请日：2015-12-08
Applicant: INVENSENSE, INC.
Inventor： Renata Melamud Berger , Sushil Bharatan , Thomas Chen
Abstract: A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate.
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公开(公告)号：US09924288B2
公开(公告)日：2018-03-20
申请号：US14527235
申请日：2014-10-29
Applicant: INVENSENSE, INC.
Inventor： Baris Cagdaser , Renata Melamud Berger , Omid Oliaei , Aleksey S. Khenkin
CPC classification number: H04R29/004 , H04R3/00 , H04R3/04 , H04R25/305 , H04R2201/003 , H04R2460/11 , H04R2499/11
Abstract: Systems and techniques for detecting blockage associated with a microelectromechanical systems (MEMS) microphone of a device are presented. The device includes a MEMS acoustic sensor and a processor. The MEMS acoustic sensor is contained in a cavity within the device. The processor is configured to detect a blockage condition associated with an opening of the cavity that contains the MEMS acoustic sensor.
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