公开(公告)号：US20160104689A1

公开(公告)日：2016-04-14

申请号：US14969779

申请日：2015-12-15

Applicant: Invensas Corporation

Inventor： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

公开(公告)号：US20140213020A1

公开(公告)日：2014-07-31

申请号：US14242206

申请日：2014-04-01

Applicant: Invensas Corporation

Inventor： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Abstract translation: 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。

公开(公告)号：US20160218088A1

公开(公告)日：2016-07-28

申请号：US15086693

申请日：2016-03-31

Applicant: Invensas Corporation

Inventor： Simon J. S. McElrea ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR.

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L23/48 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L29/0657 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00

Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

Abstract translation: 堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。

公开(公告)号：US20130207249A1

公开(公告)日：2013-08-15

申请号：US13728246

申请日：2012-12-27

Applicant: INVENSAS CORPORATION

Inventor： Al Vindasius ,  Marc E. Robinson ,  Larry Jacobsen ,  Donald Almen

IPC: H01L25/00 ,  H01L23/34

CPC classification number: H01L25/00 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011

Abstract: Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to the electrical connection pads. After being placed atop one another in a stack, vertically adjacent die or die segments can be electrically interconnected using a flexible bond wire or bond ribbon attached to an electrical connection pad exposed within such opening, the bond wire or ribbon protruding horizontally, and an electrically conductive polymer, or epoxy, filaments or lines can be applied to the stack.

Abstract translation: 在模具或多个模具段的一侧或多侧上的金属重路由互连可以形成用于电连接的边缘焊盘。 在可选的变薄和分离之后，绝缘可以应用于模具或多个模具段的表面，并且可以在电连接垫的绝缘体中形成开口。 在彼此放置在堆叠中之后，垂直相邻的模具或模具段可以使用柔性接合线或粘结带电连接，该粘合线或粘结带附接到暴露在该开口内的电连接垫，水平地突出的接合线或带， 导电聚合物或环氧树脂，丝或线可以施加到堆叠。

公开(公告)号：US09824999B2

公开(公告)日：2017-11-21

申请号：US14969779

申请日：2015-12-15

Applicant: Invensas Corporation

Inventor： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/29

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

公开(公告)号：US09252116B2

公开(公告)日：2016-02-02

申请号：US14242206

申请日：2014-04-01

Applicant: Invensas Corporation

Inventor： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/29

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Abstract translation: 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。

公开(公告)号：US08729690B2

公开(公告)日：2014-05-20

申请号：US13728246

申请日：2012-12-27

Applicant: Invensas Corporation

Inventor： Al Vindasius ,  Marc E. Robinson ,  Larry Jacobsen ,  Donald Almen

IPC: H01L23/522

CPC classification number: H01L25/00 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011

Abstract: Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to the electrical connection pads. After being placed atop one another in a stack, vertically adjacent die or die segments can be electrically interconnected using a flexible bond wire or bond ribbon attached to an electrical connection pad exposed within such opening, the bond wire or ribbon protruding horizontally, and an electrically conductive polymer, or epoxy, filaments or lines can be applied to the stack.

Abstract translation: 在模具或多个模具段的一侧或多侧上的金属重路由互连可以形成用于电连接的边缘焊盘。 在可选的变薄和分离之后，绝缘可以应用于模具或多个模具段的表面，并且可以在电连接垫的绝缘体中形成开口。 在彼此放置在堆叠中之后，垂直相邻的模具或模具段可以使用柔性接合线或粘结带电连接，该粘合线或粘结带附接到暴露在该开口内的电连接垫，水平地突出的接合线或带， 导电聚合物或环氧树脂，丝或线可以施加到堆叠。