公开(公告)号：US5382384A

公开(公告)日：1995-01-17

申请号：US85698

申请日：1993-06-29

Applicant: Stephen Baigrie ,  Edward F. Chu ,  George B. Park ,  Vijay N. Reddy ,  James A. Rinde ,  Robert P. Saltman

Inventor： Stephen Baigrie ,  Edward F. Chu ,  George B. Park ,  Vijay N. Reddy ,  James A. Rinde ,  Robert P. Saltman

IPC: C08K3/04 ,  C08K3/08 ,  H01B1/22 ,  H01B1/24 ,  H01C7/02 ,  H01B1/00 ,  H01B1/20

CPC classification number: H01B1/22 ,  C08K3/04 ,  C08K3/08 ,  H01B1/24 ,  H01C7/027

Abstract: A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

Abstract translation: 一种导电聚合物组合物，其中颗粒状导电填料在基本上无定形的热塑性树脂和热固性树脂的混合物的聚合物组分中破裂。 在优选的组合物中，无定形热塑性树脂和热固性树脂基本相互溶解。 为了提高组合物暴露于连续热循环的热稳定性，优选通过以至少15℃的速度加热无定形热塑性树脂，热固性树脂和颗粒状导电填料的未固化混合物来固化组合物 C. /分钟到治愈温度。

公开(公告)号：US4507340A

公开(公告)日：1985-03-26

申请号：US173946

申请日：1980-07-31

Applicant: James A. Rinde ,  Eugene F. Lopez ,  Leon C. Glover

Inventor： James A. Rinde ,  Eugene F. Lopez ,  Leon C. Glover

IPC: B29C61/06 ,  C08G59/38 ,  C09J163/00 ,  F16L11/00

CPC classification number: B29C61/0616 ,  C08G59/38 ,  C09J163/00 ,  Y10S138/01 ,  Y10S174/08 ,  Y10T428/1328 ,  Y10T428/31529

Abstract: Novel curable adhesives are solid, substantially free of cross-linking and substantially tack-free at 25.degree. C.; remain substantially uncured when maintained for extended periods at 80.degree. C.; have an initial viscosity of 10.sup.3 to 10.sup.4 poise at 150.degree. C. and cure relatively slowly at 150.degree. C.; and cure rapidly at 200.degree. C. The adhesives preferably contain at least one epoxy resin, particularly an epoxy resin having a softening point of at least 50.degree. C. and an epoxy equivalent weight of at least 200 in combination with an epoxy resin which is liquid at 25.degree. C. or an elastomer or other compatible high molecular weight polymer. The adhesive preferably also contains a high temperature curing agent and preferably also a filler, which may be particulate or fibrous. The novel adhesives are particularly useful in combination with heat-recoverable devices, e.g. devices comprising components made of heat-recoverable metal.

Abstract translation: 新型可固化粘合剂是固体，基本上不含交联并且在25℃基本上无粘性; 在80℃下长时间保持基本未固化; 在150℃下的初始粘度为103〜104泊，150℃下相对缓慢地固化。 并在200℃下快速固化。粘合剂优选含有至少一种环氧树脂，特别是软化点至少为50℃，环氧当量至少为200的环氧树脂与环氧树脂组合，其中环氧树脂是 25℃的液体或弹性体或其它相容的高分子量聚合物。 粘合剂优选还含有高温固化剂，优选还含有可以是颗粒状或纤维状的填料。 新型粘合剂特别适用于热可回收装置，例如， 装置包括由热可回收金属制成的部件。

公开(公告)号：US5883457A

公开(公告)日：1999-03-16

申请号：US839995

申请日：1997-04-24

Applicant: James A. Rinde ,  Barry C. Mathews

Inventor： James A. Rinde ,  Barry C. Mathews

IPC: G06F3/033 ,  H01L41/08

CPC classification number: G06F3/0436

Abstract: A touch sensor system, including a substrate, capable of propagating surface acoustic waves; and a reflective array formed on said substrate, said reflective array having a plurality of reflective elements, each reflective element reflecting a portion of an incident surface acoustic wave. The reflective array is formed of an organic matrix. The organic matrix is preferably chemically bonded to the substrate, and is preferably a thermoset resin. The resulting reflective arrays are preferably stable under changes in moisture between 0% and 60% RH at temperatures between about 0.degree.-50.degree. C. The organic matrix can also be used in a humidity or chemical sensor.

Abstract translation: 包括能够传播表面声波的基板的触摸传感器系统; 以及形成在所述基板上的反射阵列，所述反射阵列具有多个反射元件，每个反射元件反映入射表面声波的一部分。 反射阵列由有机基质形成。 有机基质优选化学键合到基底上，并且优选为热固性树脂。 所得到的反射阵列优选在约0-50℃之间的0％和60％RH之间的湿度变化下是稳定的。有机基质也可用于湿度或化学传感器中。

公开(公告)号：US5104930A

公开(公告)日：1992-04-14

申请号：US660770

申请日：1991-02-25

Applicant: James A. Rinde ,  Frank W. Mercer ,  Keith Dawes ,  Rudolf R. Bukownik

Inventor： James A. Rinde ,  Frank W. Mercer ,  Keith Dawes ,  Rudolf R. Bukownik

IPC: C08G18/08 ,  C08G18/10 ,  C08G18/32 ,  C08G18/50 ,  C08G18/61 ,  C08G18/69 ,  C08G18/75 ,  C08G18/76 ,  C08G18/78 ,  C08K5/00

CPC classification number: C08G18/10 ,  C08G18/0842 ,  C08G18/3234 ,  C08G18/3237 ,  C08G18/3256 ,  C08G18/5024 ,  C08G18/503 ,  C08G18/61 ,  C08G18/696 ,  C08G18/75 ,  C08G18/765 ,  C08G18/7825 ,  C08K5/0016 ,  C08G2190/00 ,  C08G2220/00

Abstract: Crosslinkable gel compositions cure rapidly to provide gel compositions which possess superior combinations of chemical and physical properties and aging resistance. These compositions are particularly useful for environmentally protecting substrates, especially electrical conductors, connectors, and splices and for sealing around jacketed cables, for example where they enter splice cases.

Abstract translation: 可交联的凝胶组合物快速固化以提供具有优异的化学和物理性能和耐老化性的组合的凝胶组合物。 这些组合物特别可用于环境保护基材，特别是电导体，连接器和接头，并且用于密封夹套电缆周围，例如在它们进入接合情况下。

公开(公告)号：US4997685A

公开(公告)日：1991-03-05

申请号：US399422

申请日：1989-08-25

Applicant: George Pieslak ,  Tony G. Alvernaz ,  Robin John ,  James A. Rinde ,  Eric Van Zele

Inventor： George Pieslak ,  Tony G. Alvernaz ,  Robin John ,  James A. Rinde ,  Eric Van Zele

IPC: B05D1/34 ,  B05D1/36 ,  B05D3/02 ,  B05D7/00 ,  B05D7/14 ,  F16L58/10

CPC classification number: F16L58/1054 ,  B05D1/36 ,  B05D7/146 ,  B05D7/582 ,  B05D2202/00 ,  B05D2254/02 ,  B05D2301/50 ,  B05D2504/00 ,  B05D2505/00 ,  B05D3/0218

Abstract: The invention relates to a method for applying a protective coating to a substrate, such as metallic pipe, which comprises applying onto the substrate a liquid curable polymeric composition capable of curing to a substantial extent within about 24 hours at less than about 80.degree. C., then applying one or more polymeric layers, the innermost of which is capable of interacting with said curable composition, and permitting the composition to cure. In certain embodiments the polymeric layer is applied as a polymeric article, in other embodiments a multiple layer polymeric covering is applied over the curable composition.

Abstract translation: 本发明涉及一种将保护涂层施加到诸如金属管的基底上的方法，该方法包括将能固化至大约24小时内的液体可固化的聚合物组合物施加至基材上，所述液体可固化的聚合物组合物在约低于约80℃ ，然后施加一个或多个聚合物层，其最内部能够与所述可固化组合物相互作用，并允许组合物固化。 在某些实施方案中，聚合物层作为聚合物制品施用，在其它实施方案中，多层聚合物覆盖物涂覆在可固化组合物上。

公开(公告)号：US5250228A

公开(公告)日：1993-10-05

申请号：US788655

申请日：1991-11-06

Applicant: Stephen Baigrie ,  Edward F. Chu ,  George B. Park ,  Vijay N. Reddy ,  James A. Rinde ,  Robert P. Saltman

Inventor： Stephen Baigrie ,  Edward F. Chu ,  George B. Park ,  Vijay N. Reddy ,  James A. Rinde ,  Robert P. Saltman

IPC: C08K3/04 ,  C08K3/08 ,  H01B1/22 ,  H01B1/24 ,  H01C7/02 ,  H01B1/00 ,  H01B1/70

CPC classification number: H01B1/22 ,  C08K3/04 ,  C08K3/08 ,  H01B1/24 ,  H01C7/027

Abstract: A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

Abstract translation: 一种导电聚合物组合物，其中颗粒状导电填料分散在聚合物组分中，聚合物组分是基本上无定形的热塑性树脂和热固性树脂的混合物。 在优选的组合物中，无定形热塑性树脂和热固性树脂基本上是相互溶解的。 为了提高组合物暴露于连续热循环的热稳定性，优选通过以至少15℃的速度加热无定形热塑性树脂，热固性树脂和颗粒状导电填料的未固化混合物来固化组合物 C. /分钟到治愈温度。

公开(公告)号：US4325737A

公开(公告)日：1982-04-20

申请号：US197465

申请日：1980-10-16

Applicant: James A. Rinde

Inventor： James A. Rinde

IPC: C08J9/28 ,  C08L1/12 ,  C08L1/08

CPC classification number: C08J9/28 ,  C08J2201/0546

Abstract: Organic foams having a low density and very small cell size and method for producing same in either a metal-loaded or unloaded (nonmetal loaded) form are described. Metal-doped foams are produced by soaking a polymer gel in an aqueous solution of desired metal salt, soaking the gel successively in a solvent series of decreasing polarity to remove water from the gel and replace it with a solvent of lower polarity with each successive solvent in the series being miscible with the solvents on each side and being saturated with the desired metal salt, and removing the last of the solvents from the gel to produce the desired metal-doped foam having desired density cell size, and metal loading. The unloaded or metal-doped foams can be utilized in a variety of applications requiring low density, small cell size foam. For example, rubidium-doped foam made in accordance with the invention has utility in special applications, such as in x-ray lasers.

Abstract translation: 描述了具有低密度和非常小的泡孔尺寸的有机泡沫体以及用于以金属加载或卸载（非金属加载）形式生产的有机泡沫体。 通过将聚合物凝胶浸渍在所需金属盐的水溶液中来制备金属掺杂的泡沫，将凝胶依次以极性降低的溶剂系列浸泡以从凝胶中除去水，并用每个相继的溶剂代替低极性的溶剂 该系列与每一侧上的溶剂混溶并被所需的金属盐饱和，并从凝胶中除去最后的溶剂以产生具有所需密度单元尺寸和金属负载的所需金属掺杂泡沫。 无负载或金属掺杂的泡沫可用于需要低密度，小泡孔泡沫的各种应用中。 例如，根据本发明制成的掺杂铷的泡沫可用于特殊应用中，例如在x射线激光器中。

公开(公告)号：US4021280A

公开(公告)日：1977-05-03

申请号：US609642

申请日：1975-09-02

Applicant: James A. Rinde ,  Fred J. Fulton

Inventor： James A. Rinde ,  Fred J. Fulton

IPC: B01J13/04 ,  B29D27/00

CPC classification number: B01J13/046 ,  Y10S264/06 ,  Y10S376/916 ,  Y10T156/1052

Abstract: Foam-encapsulated laser fusion targets are fabricated by suspending fusion fuel filled shells in a solution of cellulose acetate, extruding the suspension through a small orifice into a bath of ice water, soaking the thus formed shell containing cellulose acetate gel in the water to extract impurities, freezing the gel, and thereafter freeze-drying wherein water and solvents sublime and the gel structure solidifies into a low-density microcellular foam containing one or more encapsulated fuel-filled shells. The thus formed material is thereafter cut and mounted on a support to provide laser fusion targets containing a fuel-filled shell surrounded by foam having a thickness of 10 to 60 .mu.m, a cell size of less than 2 .mu.m, and density of 0.08 to 0.6.times.10.sup.3 kg/m.sup.3. Various configured foam-encapsulated targets capable of being made by the encapsulation method are illustrated.

Abstract translation: 通过将聚合燃料填充的壳悬浮在乙酸纤维素溶液中，将悬浮液通过小孔挤出到冰水浴中，将由此形成的包含醋酸纤维素凝胶的壳体浸泡在水中以提取杂质来制造泡沫包封的激光融合靶 ，冷凝凝胶，然后冷冻干燥，其中水和溶剂升华，凝胶结构固化成含有一种或多种包封的燃料填充的壳的低密度微孔泡沫。 然后将如此形成的材料切割并安装在支撑体上，以提供激光熔化靶，其包含由泡沫塑料包围的燃料填充的壳体，其厚度为10至60μm，电池尺寸小于2μm，密度为0.08 至0.6×10 3 kg / m 3。 示出了能够通过封装方法制造的各种配置的泡沫封装的靶。

公开(公告)号：US06531950B1

公开(公告)日：2003-03-11

申请号：US09606821

申请日：2000-06-28

Applicant: Paul N. Becker ,  James A. Rinde ,  Barry C. Mathews ,  Orion Jankowski ,  Cecilia A. Walsh

Inventor： Paul N. Becker ,  James A. Rinde ,  Barry C. Mathews ,  Orion Jankowski ,  Cecilia A. Walsh

IPC: H01C713

CPC classification number: H01C1/1406 ,  H01C7/027 ,  Y10T29/49082

Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer, and electrical devices using an adhesion promoting layer in combination with a crosslinking agent are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.

Abstract translation: 一种电气装置，其中由导电聚合物组合物构成的元件与金属电极的第一表面定位，第一表面具有中心线平均粗糙度Ra和反射密度RD，产品Ra时间RD至少为 0.06μm，具有位于金属电极的第一表面和聚合物元件之间的粘附促进层。 导电聚合物组合物优选表现出PTC行为。 在其它方面，提供了使用多于一种粘合促进层的电气装置，以及使用与交联剂组合的粘合促进层的电气装置。 其他实施例包括具有通过脉冲电镀工艺制成的金属电极的电气装置，以及通过在扩散限制条件下电沉积制成的金属电极。 电气设备可以是电路保护装置，并具有改善的电气和物理特性。

公开(公告)号：US06235801B1

公开(公告)日：2001-05-22

申请号：US09285414

申请日：1999-04-02

Applicant: Miguel A. Morales ,  Mark W. Ellsowrth ,  James A. Rinde ,  Barry C. Mathews

Inventor： Miguel A. Morales ,  Mark W. Ellsowrth ,  James A. Rinde ,  Barry C. Mathews

IPC: C08J932

CPC classification number: C08J9/32 ,  C08J2203/22 ,  C08J2205/02 ,  C08J2383/04

Abstract: A gel material is expanded by first subjecting mixture of a gel precursor material and heat-expandable microspheres to a curing regimen which cures the precursor material into a gel material without expanding the microspheres and then heating to expand the gel material containing the microspheres. In this manner, an intermediate product in the form of a gel which is more handleable than the typically syrupy precursor material is produced. This intermediate product can be manipulated and placed at the intended application location and then expanded.

Abstract translation: 通过首先使凝胶前体材料和热膨胀性微球体的混合物使固化方法膨胀凝胶材料，所述固化方案将前体材料固化成凝胶材料，而不使微球膨胀，然后加热以膨胀含有微球体的凝胶材料。 以这种方式，产生比通常糖浆状前体材料更易于处理的凝胶形式的中间产物。 该中间产品可以被操纵并放置在预定的应用位置，然后扩大。