中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

35 records (took 0.015 seconds)

    Hermaphroditic socket/adapter
    1.
    发明授权
    Hermaphroditic socket/adapter 有权
    双相插座/适配器

    公开(公告)号：US07371096B2

    公开(公告)日：2008-05-13

    申请号：US11707604

    申请日：2007-02-16

    Applicant: Glenn Goodman ,  James V. Murphy

    Inventor： Glenn Goodman ,  James V. Murphy

    IPC: H01R13/28

    CPC classification number: H01R12/714 ,  H01R12/716 ,  H01R13/631 ,  H01R24/84

    Abstract: A hermaphroditic terminal assembly for connecting electrical devices includes an insulating support member for supporting female sockets and male pins, a number of female sockets, and a number of male pins. An intercoupling component for connecting electrical devices includes two hermaphroditic terminal assemblies configured such that the first hermaphroditic terminal assembly can be mated with the second hermaphroditic terminal assembly.

    Abstract translation: 用于连接电气装置的阴模组合件包括用于支撑阴插座和阳销，多个阴插座和多个阳销的绝缘支撑构件。 用于连接电气装置的相互耦合部件包括两个两性端子组件，其被配置为使得第一阴模端子组件可以与第二阴模端子组件配合。

    Solder ball terminal
    2.
    发明授权
    Solder ball terminal 失效
    焊球端子

    公开(公告)号：US06325280B1

    公开(公告)日：2001-12-04

    申请号：US09473095

    申请日：1999-12-28

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: B23K3102

    CPC classification number: H05K7/1084 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3478

    Abstract: A method of providing such an intercoupling component includes positioning terminals within holes of an insulative support member and attaching a solder ball to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contacts a corresponding solder ball; soldering the solder ball to the end of the terminal while maintaining the generally spherical shape of the solder ball; and removing the insulative support member from the fixture. The solder balls are generally soldered by passing the insulative support member with terminals and fixture with solder balls through a reflow apparatus.

    Abstract translation: 提供这种相互联结部件的方法包括将端子定位在绝缘支撑部件的孔内并将焊球附接到每个端子。 使用具有多个凹部的夹具来实现将焊锡球连接到端子，所述凹部位于与绝缘支撑构件中的孔的图案相对应的图案中; 用焊球填充每个凹槽; 将绝缘支撑构件定位在固定装置上，使得每个端子的端部接触相应的焊球; 将焊球焊接到端子的端部，同时保持焊球的大致球形; 以及从所述固定装置移除所述绝缘支撑构件。 通常通过使具有端子的绝缘支撑构件和具有焊球的固定装置通过回流装置来焊接焊球。

    Converter socket terminal
    3.
    发明授权
    Converter socket terminal 有权
    转换器插座端子

    公开(公告)号：US06313530B1

    公开(公告)日：2001-11-06

    申请号：US09563482

    申请日：2000-05-02

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: H01L2334

    CPC classification number: H01R13/2421 ,  G01R1/0483 ,  H01L23/32 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

    Abstract translation: 插座端子组件包括插座主体，其具有带有开口的端部，并且相对端构造成接触印刷电路板的相应连接区域，设置在插座主体的开口处的接触弹簧，以接收和施加摩擦 足以将销的下端保持在插座主体的开口内的力; 以及弹性构件，其设置在所述开口的下端内，以向所述销施加并且响应于向所述销施加的向下的力施加足以克服所述接触弹簧的摩擦力的向上的力。 销具有适于接触集成电路封装的电接触区域的端部，以及构造成插入插座主体的开口内的相对端。 相互联接部件包括具有孔的插座支撑构件，每个孔容纳相应的插座端子组件。

    Socket/adapter system
    4.
    发明授权
    Socket/adapter system 有权
    插座/适配器系统

    公开(公告)号：US06213787B1

    公开(公告)日：2001-04-10

    申请号：US09464415

    申请日：1999-12-16

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: H01R1200

    CPC classification number: H01R12/716 ,  G01R1/0483 ,  H01R13/187 ,  H01R13/2421

    Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

    Abstract translation: 插座端子组件包括插座主体，其具有带有开口的端部，并且相对端构造成接触印刷电路板的相应连接区域，设置在插座主体的开口处的接触弹簧，以接收和施加摩擦 足以将销的下端保持在插座主体的开口内的力; 以及弹性构件，其设置在所述开口的下端内，以向所述销施加并且响应于向所述销施加的向下的力施加足以克服所述接触弹簧的摩擦力的向上的力。 销具有适于接触集成电路封装的电接触区域的端部，以及构造成插入插座主体的开口内的相对端。 相互联接部件包括具有孔的插座支撑构件，每个孔容纳相应的插座端子组件。

    Terminal positioning method and construction
    5.
    再颁专利
    Terminal positioning method and construction 失效
    终端定位方法与施工

    公开(公告)号：USRE32540E

    公开(公告)日：1987-11-10

    申请号：US839957

    申请日：1986-03-17

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: B65D73/00 ,  B65D73/02 ,  H01R4/02 ,  H01R43/20 ,  H05K3/30

    CPC classification number: H05K3/306 ,  B65D73/0042 ,  H01R12/58 ,  H01R4/02 ,  H01R43/205 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2203/0195 ,  Y10T29/49153

    Abstract: An improved method and construction for positioning a plurality of socket terminals on an electrical circuit board in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material is provided with a plurality of holes in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head including an intermediate groove such that the heads extend into the holes and are adapted for frictional snap engagement with the sheet. The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the board. Thereafter, the sheet may be removed. The enlarged head of the circuit terminal is provided with leading edge sheet contacting surface to enable the terminals to be push positioned into the holes without injuring the sheet.

    Integrated circuit intercoupling component with heat sink
    7.
    发明授权
    Integrated circuit intercoupling component with heat sink 失效
    具有散热器的集成电路互耦组件

    公开(公告)号：US5917703A

    公开(公告)日：1999-06-29

    申请号：US062215

    申请日：1998-04-17

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: H05K7/20 ,  H01L23/32 ,  H01L23/40

    CPC classification number: H01L23/32 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/1433

    Abstract: An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned within the package support member, and having an upper surface in contact with a lower surface of the integrated circuit package disposed within the package support member. The package support member includes contact terminals disposed within associated openings of the package for electrically connecting the contacting areas of the integrated circuit package to the corresponding connection regions of the substrate. The openings extend from an upper surface to an opposite lower surface of the support member and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink may be configured to be removable and replaceable.

    Abstract translation: 提供互耦合部件（例如，插座或适配器），用于增加在位于相互耦合部件内的集成电路（IC）阵列内产生的热的耗散，同时保持相对低的轮廓。 互耦组件包括位于封装支撑构件内的散热器，并且具有与设置在封装支撑构件内的集成电路封装的下表面接触的上表面。 封装支撑构件包括设置在封装的相关开口内的接触端子，用于将集成电路封装的接触区域电连接到衬底的相应连接区域。 开口从支撑构件的上表面延伸到相对的下表面，并且位于与连接触点的图案对应的图案中。 散热器可以被配置为可移动和可更换的。

    Ball grid array including modified hard ball contacts and apparatus for attaching hard ball contacts to a ball grid array
    8.
    发明授权
    Ball grid array including modified hard ball contacts and apparatus for attaching hard ball contacts to a ball grid array 失效
    包括改进的硬球接触件的球栅阵列和用于将硬球接触件附接到球栅阵列的装置

    公开(公告)号：US5716222A

    公开(公告)日：1998-02-10

    申请号：US689529

    申请日：1996-08-08

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: H01R13/24 ,  H05K3/32 ,  H05K7/10 ,  H01R4/58

    CPC classification number: H01R13/2435 ,  H01R13/2471 ,  H01R13/2478 ,  H01R13/2485 ,  H05K3/325 ,  H05K7/1061

    Abstract: A plurality of rigid, generally spherical contact elements are attached to the solder balls of a ball grid array (BGA) package to provide rigid contact points that are suitable for engagement with the contacts of a direct BGA socket assembly. The contact elements include a flattened circumferential surface and a circumferential groove formed in the flattened surface. The circumferential groove divides the contact element into opposing hemispheres. An alignment assembly for aligning the contact elements with the BGA solder ball footprint includes a carrier sheet of electrically insulative, flexible material having a plurality of holes arranged in a predetermined array corresponding to the footprint of solder balls. The contact elements are snap received within the holes of the carrier sheet such that one hemisphere of the contact element is disposed on each side of the carrier sheet. The alignment assembly further includes an alignment fixture for receiving the carrier sheet and BGA package in overlying relation. The alignment fixture includes alignment pins for aligning the carrier sheet in a predetermined position, and alignment arms for aligning the BGA package relative to the carrier sheet. In a method for attaching the contact elements to the solder balls, the solder balls are heated to a reflow temperature wherein gravity forces BGA package downwardly onto the contact element and the facing hemisphere of the contacts are attached to the solder ball while the opposing hemisphere remains exposed for engagement with the socket contact.

    Abstract translation: 多个刚性的，通常为球形的接触元件附接到球栅阵列（BGA）封装的焊球，以提供适于与直接BGA插座组件的触点接合的刚性接触点。 接触元件包括平坦化的圆周表面和形成在平坦表面中的周向槽。 圆周槽将接触元件分成相对的半球。 用于使接触元件与BGA焊球对准的对准组件包括电绝缘的柔性材料的载体片，其具有以对应于焊球的覆盖区的预定阵列布置的多个孔。 接触元件被卡扣接收在载体片的孔内，使得接触元件的一个半球设置在载体片的每一侧上。 对准组件还包括用于以覆盖关系接收载体片和BGA封装的对准夹具。 对准夹具包括用于将载体片材对准预定位置的对准销和用于使BGA封装件相对于载体片材对准的对准臂。 在将接触元件附着到焊料球的方法中，将焊球加热到回流温度，其中重力将BGA向下封装到接触元件上，并且接触件的面对半球附接到焊球，同时相对的半球保持 露出用于与插座触点接合。

Patent Agency Ranking