-
1.发明授权Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making 失效增韧光敏聚氰脲酸酯抗蚀剂及其制造方法及制造方法
公开(公告)号：US5919596A
公开(公告)日：1999-07-06
申请号：US798592
申请日：1997-02-11
申请人： Jeffrey C. Hedrick , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck , Jeffrey D. Gelorme , Voya Rista Markovich , Thomas H. Lewis , Stephen Joseph Fuerniss
发明人： Jeffrey C. Hedrick , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck , Jeffrey D. Gelorme , Voya Rista Markovich , Thomas H. Lewis , Stephen Joseph Fuerniss
CPC分类号： G03F7/38 , Y10S430/106
摘要： Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.
摘要翻译： 公开了一种可固化以形成耐裂纹的光敏聚氰化脲抗蚀剂的混合物。 还公开了其使用和制造过程的结构。 抗蚀剂可以被定制为对光化辐射是积极或消极敏感的。 由于其热和机械性能的改善，固化的抗蚀剂适合在高温下使用，例如在电子封装应用中。
-
公开(公告)号：US5824157A
公开(公告)日：1998-10-20
申请号：US523881
申请日：1995-09-06
申请人： Elizabeth F. Foster , Jeffrey C. Hedrick , Robert M. Japp , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck
发明人： Elizabeth F. Foster , Jeffrey C. Hedrick , Robert M. Japp , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck
CPC分类号： B29B15/122 , H05K3/022
摘要： The invention involves a fluid treatment device to solution or melt impregnate a resin or polymer or any combination thereof into a reinforcement which can be utilized to fabricate composite materials for laminates, circuit boards, structural/aerospace materials, automotive components, etc. The invention offers significant advantages and benefits over existing methods and equipment and allows the impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.
摘要翻译： 本发明涉及一种流体处理装置，用于将树脂或聚合物或其任何组合溶解或熔融浸渍到可用于制造用于层压材料，电路板，结构/航空航天材料，汽车部件等的复合材料的增强件中。本发明提供 与现有方法和设备相比具有显着的优点和优点，并且允许以更低的成本和更高的效率以更高的环境安全性进行浸渍过程。
-
3.发明授权
公开(公告)号：US5599611A
公开(公告)日：1997-02-04
申请号：US344479
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A prepreg comprising a reinforcing material impregnated with a curable material. The curable material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译： 一种预浸料，其包含浸渍有可固化材料的增强材料。 可固化材料包括含氟氰酸酯和含氟亚芳基醚聚合物的共混物。 氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，并且含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，X是任何能够与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。 固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。 热塑性聚合物相具有亚微米尺寸。
-
公开(公告)号：US5527838A
公开(公告)日：1996-06-18
申请号：US344478
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , C08K7/16
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A curable material comprising a particulate filler and a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
摘要翻译： 一种包含颗粒填料和含氟氰酸酯和含氟亚芳基醚聚合物的共混物的可固化材料。 氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有结构X-R- [R 1] m -X，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。
-
公开(公告)号：US5548034A
公开(公告)日：1996-08-20
申请号：US923723
申请日：1992-07-31
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , C08G65/48
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing poly(arylene ether) wherein said cyanate is a monomer having the structureN.ident.C--O--R--.sub.n --O--C.ident.Nsaid fluorine containing poly(arylene ether) has the structureX--R--.sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;said material being heat-curable at a temperatures between 180.degree. and 325.degree. C.;said material in the cured state comprising a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
摘要翻译： 一种包含含氟氰酸酯和含氟聚（亚芳基醚）的共混物的可固化材料，其中所述氰酸酯是具有结构N = CORnOC = N含氟聚（亚芳基醚）的单体，其结构为X-Rm-X，其中X 是能够与-C = N组反应的任何基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 所述材料在180至325℃的温度下是可热固化的; 所述固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。
-
6.发明授权Multilayer article having a planarized outer layer comprising a toughened polycyanurate 失效具有包括增韧的聚氰化脲的平坦化外层的多层制品
公开(公告)号：US5527592A
公开(公告)日：1996-06-18
申请号：US344454
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B3/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： An electronic circuit package comprising an electrically conductive circuit layer on a polymer, ceramic or multi-layer substrate wherein a curable dielectric material is applied over the electrically conductive circuit layer. The curable dielectric material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The dielectric material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译： 一种电子电路封装，包括在聚合物，陶瓷或多层基底上的导电电路层，其中可固化介电材料施加在导电电路层上。 可固化电介质材料包括含氟氰酸酯和含氟亚芳基醚聚合物的共混物。 氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。 固化状态下的电介质材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。 热塑性聚合物相具有亚微米尺寸。
-
7.发明授权Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns 失效包括具有嵌入的导电图案的增韧的聚氰脲酸酯的多层制品
公开(公告)号：US5523148A
公开(公告)日：1996-06-04
申请号：US344475
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A prepreg which is heat curable within a temperature range of between about 200.degree. C. and 325.degree. C. comprising a reinforcing material impregnated with a curable material said curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer wherein said cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nsaid fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;said material in the cured state comprising a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
摘要翻译： 一种在约200℃至325℃的温度范围内可热固化的预浸料，包括浸渍有可固化材料的增强材料，所述可固化材料包含含氟氰酸酯和含氟亚芳基醚的共混物 聚合物，其中所述氰酸酯是具有结构N的化合物，其中X是任何能够与-C 3 N N基团反应的基团， ; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 所述固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。
-
公开(公告)号：US5529836A
公开(公告)日：1996-06-25
申请号：US344476
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A laminate comprising a layer of conductive metal and a plurality of layers of a cured prepreg is disclosed. The prepreg comprises a reinforcing material impregnated with a curable material. The curable material is a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.ident.C--O--R--[R.sup.1 ].sub.n --O--C.ident.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译： 公开了一种包含导电金属层和多层固化预浸料的层压体。 预浸料包括浸渍有可固化材料的增强材料。 可固化材料是含氟氰酸酯和含氟亚芳基醚聚合物的共混物。 氰酸酯是具有结构N = C-O-R- [R 1] n -O-C = N的单体，含氟亚芳基醚聚合物具有结构X-R- [R 1] m -X，其中X是能够与-C = N基团反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。 固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。 热塑性聚合物相具有亚微米尺寸。
-
公开(公告)号：US5527593A
公开(公告)日：1996-06-18
申请号：US344477
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B3/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： An electronic circuit package comprising an electrically conductive pattern embedded within a curable material. The curable material comprises a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译： 一种电子电路封装，包括嵌入可固化材料内的导电图案。 可固化材料包括含氟氰酸酯和含氟亚芳基醚聚合物。 氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。 固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。 热塑性聚合物相具有亚微米尺寸。
-
10.发明授权Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin 失效分散在热固性树脂中的均相，共型或多组分热塑性聚合物
公开(公告)号：US5834537A
公开(公告)日：1998-11-10
申请号：US668732
申请日：1996-06-24
申请人： Jeffrey Thomas Gotro , Jeffrey Curtis Hedrick , Konstantinos Papathomas , Niranjan Mohanlal Patel , Alfred Viehbeck , William Joseph
发明人： Jeffrey Thomas Gotro , Jeffrey Curtis Hedrick , Konstantinos Papathomas , Niranjan Mohanlal Patel , Alfred Viehbeck , William Joseph
IPC分类号： C08L27/12 , C08G59/30 , C08L63/00 , C08L71/00 , C08L71/08 , C08L71/10 , C08L87/00 , C08L101/00 , C08L101/02 , H05K1/03
CPC分类号： C08L71/00 , C08G59/30 , C08L63/00 , H05K1/034 , Y10S525/905 , Y10S525/906
摘要： The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.
摘要翻译： 本发明涉及作为在其中引入反应性热塑性低聚物的结果而具有增强的断裂韧性的可固化热固性树脂组合物。 更具体地说，本发明涉及包含含有氟并含有至少一种可溶于热固性树脂的含氟热塑性均聚物组分的热固性树脂的组合物。 所述热塑性聚合物在固化期间经历原位相分离工艺以形成微相分离的多相热固性材料。
-
-
-
-
-
-
-
-
-
搜索结果
26 条记录 (耗时 0.036 秒)
