Resin composition, prepreg and their uses
    2.
    发明授权
    Resin composition, prepreg and their uses 有权
    树脂组合物,预浸料及其用途

    公开(公告)号:US08748541B2

    公开(公告)日:2014-06-10

    申请号:US12379042

    申请日:2009-02-11

    摘要: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

    摘要翻译: 含有具有聚苯醚骨架的双功能亚苯基醚低聚物的末端乙烯基化合物(a),特殊的马来酰亚胺化合物(b),萘酚芳烷基型氰酸酯树脂(c)和萘-2-甲酸酯树脂的乙烯基化合物系树脂组合物, 骨架改性的酚醛清漆型环氧树脂(d)用于高多层和高频印刷线路板,该树脂组合物在低温下的清漆保质期优异,并且不显示多层成型性降低,吸湿后的耐热性 ,电气特性和剥离强度,以及预浸料,覆金属箔层压板和使用上述树脂组合物的树脂片。