Apparatus and method for reducing energy contamination of low energy ion beams
    1.
    发明授权
    Apparatus and method for reducing energy contamination of low energy ion beams 失效
    降低能量离子束能量污染的装置和方法

    公开(公告)号:US06710358B1

    公开(公告)日:2004-03-23

    申请号:US09513396

    申请日:2000-02-25

    IPC分类号: G21K510

    CPC分类号: H01J37/3171 H01J2237/05

    摘要: An ion implantation method for reducing energy contamination in low energy beams is disclosed in this invention. The ion implantation method requires the use of a target chamber for containing a target for implantation in vacuum and an ion source chamber with an ion source for generating an ion beam. A means for conducting a mass analysis of the ion beam, such as an analyzer magnet, is also needed. The ion source chamber includes a beam deceleration optics that includes a beam deceleration means for decelerating the ion beam for producing a low energy ion beam. The beam deceleration optics further includes a beam steering means for generating an electrostatic field for steering the ion beam to a targeted ion-beam direction and separating neutralized particles from the ion beam by allowing the neutralized particles to transmit in a neutralized-particle direction slightly different from the targeted ion-beam direction. The ion beam steering means further includes a beam stopper for blocking said neutralized particles from reaching said target of implantation that minimizes energy contamination from high energy neutralized particles.

    摘要翻译: 在本发明中公开了一种用于减少能量束中的能量污染的离子注入方法。 离子注入方法需要使用目标室来容纳用于在真空中注入的靶和具有用于产生离子束的离子源的离子源室。 还需要用于进行离子束的质量分析的装置,例如分析器磁体。 离子源室包括光束减速光学器件,其包括用于减小离子束以产生低能量离子束的光束减速装置。 光束减速光学元件进一步包括光束转向装置,用于产生用于将离子束转向目标离子束方向的静电场,并且通过允许中和的颗粒在中和颗粒方向上稍微不同的透射从离子束分离中和的颗粒 从目标离子束方向。 离子束转向装置还包括用于阻挡所述被中和的颗粒到达所述注入目标的束塞,其最小化来自高能中和颗粒的能量污染。

    Apparatus and method for uniformly depositing thin films over substrates

    公开(公告)号:US06579420B2

    公开(公告)日:2003-06-17

    申请号:US09780212

    申请日:2001-02-09

    IPC分类号: C23C1600

    摘要: A thin film deposition apparatus and method are disclosed in this invention. The apparatus includes a depositing thin-film particle source, a beam-defining aperture between the particle source and the deposited substrate(s), and a substrate holder to rotate the substrate(s) around its center and move the center along a lateral path so that the substrate(s) can scan across the particle beam from one substrate edge to the other edge. The method includes a step of providing a vacuum chamber for containing a thin-film particle source for generating thin-film particles to deposit a thin-film on the substrates. The method further includes a step of containing a substrate holder in the vacuum chamber for holding a plurality of substrates having a thin-film deposition surface of each substrate facing the beam of thin-film particles. The method further includes a step of providing a rotational means for rotating the substrate holder to rotate each of the substrates exposed to the thin-film particles for depositing a thin film thereon. And, the method further includes a step of providing a laterally reciprocal moving means for reciprocally moving said substrate holder for said beam traversing on said substrate holder from one side of the edge to the other side of the edge or at least passing through the central area of said substrate holder.

    METHODS FOR PACKAGING LIGHT EMITTING DEVICES AND RELATED MICROELECTRONIC DEVICES
    3.
    发明申请
    METHODS FOR PACKAGING LIGHT EMITTING DEVICES AND RELATED MICROELECTRONIC DEVICES 审中-公开
    用于包装发光装置和相关微电子装置的方法

    公开(公告)号:US20130062653A1

    公开(公告)日:2013-03-14

    申请号:US13672793

    申请日:2012-11-09

    申请人: Peiching Ling

    发明人: Peiching Ling

    IPC分类号: H01L33/50

    摘要: A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.

    摘要翻译: 一种形成发光器件的方法包括提供配置为发射第一颜色的光的发光二极管(LED),并且提供由不含磷光体材料的硅树脂材料制成的多个半球形透镜。 每个透镜具有附着于其上的荧光体材料层。 该方法还包括测试多个透镜以选择将第一颜色的光转换为第二颜色的光的透镜子集。 该方法还包括使用LED,所选择的透镜子集中的一个和导热基板来形成发光器件。 在一个实施例中,在多个透镜的测试之后,所选择的透镜子集之一被布置在LED上。 在另一个实施例中,多个透镜的测试用除了LED之外的光源进行。

    Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
    4.
    发明申请
    Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure 失效
    在LED封装结构上形成荧光材料均匀层的方法和装置

    公开(公告)号:US20110039358A1

    公开(公告)日:2011-02-17

    申请号:US12587281

    申请日:2009-10-05

    申请人: Peiching Ling

    发明人: Peiching Ling

    IPC分类号: H01L33/50

    摘要: A method for forming a layer of phosphor material on an LED encapsulant structure includes forming a layer of a phosphor material on a first surface, disposing the first surface to cause the phosphor material to be in contact with a surface of the LED encapsulant structure, applying a pressure between the first surface and the surface of the LED encapsulant structure, and causing the layer of the phosphor material to be attached to the LED encapsulant structure.

    摘要翻译: 一种在LED封装结构上形成磷光体材料层的方法包括在第一表面上形成荧光材料层,设置第一表面以使荧光体材料与LED封装结构的表面接触,施加 在LED封装结构的第一表面和表面之间的压力,并且使磷光体材料的层附着到LED密封剂结构。

    Methods of manufacturing micro-lens array substrates for implementation
in flat panel display
    7.
    发明授权
    Methods of manufacturing micro-lens array substrates for implementation in flat panel display 失效
    制造用于平板显示器中的微透镜阵列基板的制造方法

    公开(公告)号:US5871653A

    公开(公告)日:1999-02-16

    申请号:US802736

    申请日:1997-02-20

    申请人: Peiching Ling

    发明人: Peiching Ling

    IPC分类号: B29D11/00 G02B3/00

    摘要: Three process flows for manufacturing the micro-lens array substrates are disclosed. The process flows consist of two main parts. The first part of the process flows involves fabrication of a master mold. The first two process flows utilize photolithography means to print and dry etch the micro-lens array pattern on the substrate, which is covered by a oxidation or a wet etch stopping layer. The desired surface curvature corresponding to the desired size, shape, and pattern of the micro-lens array is created by either oxidizing the exposed silicon layer (in the first process flow) or to wet-etch the exposed SiO2 by using HF solutions (in the second process flow). The third process flow creates damaged areas by using a focused laser light at first. Then, the damaged areas are preferably etched by solutions, leaving the desired surface curvature. The second part of the process flows uses the master mold to make the secondary molds and third molds, and finally micro-lens array substrate through the conventional processes. Two applications of the micro-lens array substrates into flat panel display are also disclosed. First, to achieve wider viewing angle, higher resolution, higher brightness, and lower manufacturing cost, a conventional light diffuser and one substrate facing the viewer of two parallel transparent substrates sandwiching the liquid crystal in flat panel display can be replaced by a transparent micro-lens array substrate (or sheet) fabricated with the presently inventive process. Furthermore, a micro-lens array sheet made with the present inventive process flow can be attached such a substrate to reduce the manufacturing cost. Second, in a LCD utilizing phosphor elements as light source, a micro-lens array plate can be used to focus the UV light onto the phosphor elements for reduction of power consumption by the lamps.

    摘要翻译: 公开了用于制造微透镜阵列基板的三个工艺流程。 工艺流程由两个主要部分组成。 工艺流程的第一部分涉及制造主模具。 前两个工艺流程利用光刻装置来印刷和干蚀刻衬底上的微透镜阵列图案,其被氧化或湿蚀刻停止层覆盖。 通过氧化暴露的硅层(在第一工艺流程中)或通过使用HF溶液湿法蚀刻暴露的SiO 2来产生对应于微透镜阵列的所需尺寸,形状和图案的所需表面曲率(在 第二工序流程)。 第三个工艺流程首先通过使用聚焦激光来创建受损区域。 然后,损伤区域优选地通过溶液蚀刻,留下所需的表面曲率。 工艺流程的第二部分使用母模制造二次模具和第三模具,最后通过常规工艺制作微透镜阵列基板。 还公开了将微透镜阵列基板应用于平板显示器的两种应用。 首先,为了实现更宽的视角,更高的分辨率,更高的亮度和更低的制造成本,可以将传统的光扩散器和面向观察者的两个平行透明基板的基板夹在平板显示器中的液晶中, 用本发明方法制造的透镜阵列基片(或片)。 此外,用本发明的工艺流程制成的微透镜阵列片可以附接这样的衬底以降低制造成本。 第二,在使用荧光体元件作为光源的LCD中,可以使用微透镜阵列板将UV光聚焦到荧光体元件上,以降低灯的功率消耗。

    LIGHT-EMITTING STRUCTURE AND A METHOD FOR FABRICATING THE SAME
    8.
    发明申请
    LIGHT-EMITTING STRUCTURE AND A METHOD FOR FABRICATING THE SAME 有权
    发光结构及其制造方法

    公开(公告)号:US20130140983A1

    公开(公告)日:2013-06-06

    申请号:US13704788

    申请日:2011-06-17

    IPC分类号: H05B33/10 H05B33/12

    摘要: A light-emitting structure and a method of fabricating the light-emitting structure. The method includes covering an LED die provided on a carrier with a uniform phosphor layer, with an accommodation space constituted by the carrier and the uniform phosphor layer;and forming in the accommodation space a first light-pervious body such that the uniform phosphor layer in various shapes is formed on the LED die. The light-emitting structure thus fabricated has excellent optical property.

    摘要翻译: 发光结构和制造发光结构的方法。 该方法包括:具有均匀荧光体层的载体上设置的具有由载体和均匀荧光体层构成的容纳空间的LED管芯; 并且在容纳空间中形成第一透光体,使得在LED管芯上形成各种形状的均匀荧光体层。 由此制造的发光结构具有优异的光学性能。

    Methods for packaging light emitting devices and related microelectronic devices
    9.
    发明授权
    Methods for packaging light emitting devices and related microelectronic devices 有权
    用于封装发光器件和相关微电子器件的方法

    公开(公告)号:US08399267B2

    公开(公告)日:2013-03-19

    申请号:US12977248

    申请日:2010-12-23

    申请人: Peiching Ling

    发明人: Peiching Ling

    IPC分类号: H01L21/00

    摘要: A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.

    摘要翻译: 一种形成发光器件的方法包括提供配置为发射第一颜色的光的发光二极管(LED),并且提供由不含磷光体材料的硅树脂材料制成的多个半球形透镜。 每个透镜具有附着于其上的荧光体材料层。 该方法还包括测试多个透镜以选择将第一颜色的光转换为第二颜色的光的透镜子集。 该方法还包括使用LED,所选择的透镜子集中的一个和导热基板来形成发光器件。 在一个实施例中,在多个透镜的测试之后,所选择的透镜子集之一被布置在LED上。 在另一个实施例中,多个透镜的测试用除了LED之外的光源进行。

    Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
    10.
    发明申请
    Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure 失效
    在LED封装结构上形成荧光材料均匀层的方法和装置

    公开(公告)号:US20110045619A1

    公开(公告)日:2011-02-24

    申请号:US12587291

    申请日:2009-10-05

    申请人: Peiching Ling

    发明人: Peiching Ling

    IPC分类号: H01L33/50 H01L33/56

    摘要: A method for forming wavelength-conversion LED encapsulant structure includes forming an LED encapsulant structure body, forming a layer of a wavelength-conversion material on a first surface, disposing the first surface to cause the wavelength-conversion material to be in contact with a surface region of the LED encapsulant structure body, applying a pressure between the first surface and the surface region of the LED encapsulant structure body, and causing at least a portion of the wavelength-conversion material to be at least partially embedded in the surface region of the LED encapsulant structure body.

    摘要翻译: 用于形成波长转换LED密封剂结构的方法包括形成LED密封结构体,在第一表面上形成波长转换材料层,设置第一表面以使波长转换材料与表面接触 区域,在所述LED密封结构体的所述第一表面和所述表面区域之间施加压力,并且使所述波长转换材料的至少一部分至少部分地嵌入所述LED封装结构体的表面区域中; LED密封结构体。