摘要:
A thermal printer is provided which is capable of easily controlling the operations of a carriage and conveyance rollers by only one drive motor thereof and which enables the size and cost to be reduced. A thermal printer including a carriage capable of reciprocatively moving along a platen when a carriage drive shaft is rotated; a thermal head provided for the carriage to oppose the platen; an urging member for urging the thermal head to the platen; a cam portion for separating the thermal head from the platen against the urging force of the urging member when the thermal head has passed a printable range as a result of movement of the carriage; conveyance rollers to be rotated when a roller drive shaft is rotated and arranged to convey a recording medium; a drive motor for rotating the carriage drive shaft and the roller drive shaft; and drive-force transmission device which always transmits the drive force of the drive motor to the carriage drive shaft and which transmits the drive force of the drive motor to the roller drive shaft only when the carriage is moved in either direction and when the thermal head has passed the printable range.
摘要:
A loop heat pipe includes: an evaporator to convert liquid phase working fluid into vapor phase working fluid; a condenser to convert vapor phase working fluid into liquid phase working fluid; a first vapor line and a first liquid line to allow the evaporator to communicate with the condenser and form a circular main loop; and a second vapor line and a second liquid line to allow the evaporator to communicate with the condenser and form a circular auxiliary loop; wherein the evaporator includes a reservoir that temporarily stores the liquid phase working fluid, a first vapor collector that communicates with the first vapor line, a second vapor collector that communicates with the second vapor line, first wick disposed between the reservoir and the first vapor collector, and second wick disposed between the reservoir and the second vapor collector.
摘要:
An anti-reflection structure body comprises a base member which is made of glassy carbon and at a surface of which is formed an anti-reflection structure including a cluster of minute projections each having a diameter that contracts towards a tip thereof. The minute projections preferably have an average height of from 200 nm to 3000 nm and an average maximum diameter of from 50 nm to 300 nm, and an average pitch of from 50 nm to 300 nm. An anti-reflection structure body which is easily produced, capable of achieving an anti-reflection effect near to non-reflection, and capable of providing the minute structure even to a member having a high melting point such as quartz glass or the like by transfer or the like can be provided.
摘要:
A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.
摘要:
A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.
摘要:
A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die pad 14 with a semiconductor chip 32 mounted thereon is placed between first and second molding dies 40, 42 such that the die pad 14 is supported above the second molding die 42. A sealant 30 is then injected between the first and second molding dies 40, 42 to seal the semiconductor chip 32. Part of the die pad 14 has one or more protrusions 16 projecting in the direction of the second molding die 42. Injecting the sealant 30 presses the protrusions 16 against the second molding die 42 and seals the semiconductor chip 32.
摘要:
A tape cassette winding apparatus that can accept either an audio compact cassette (ACC) or a digital compact cassette (DCC) that has a revolving drive arrangement for rotating the hub or reel of the cassette to load tape into the cassette. The winding apparatus has first and second winding shafts constructed to fit into an ACC hub or DCC hub. A moving assembly selectively moves the correct winding shaft into position to engage either an ACC hub or DCC hub. The revolving drive rotates the cassette hub to load tape into the cassette when the correct winding shaft has been selected and engaged in the cassette hub. A lid opening assembly is provided to open and close the hub protective lid on DCC's.
摘要:
A server device includes: electronic devices; a housing that houses the electronic devices; at least one fan; air volume control units configured to adjust a volume of cooling airflow which is generated by rotation of the at least one fan and is ventilated through the electronic devices by opening and closing of respective valves; a valve opening control unit configured to control valve opening degrees of the air volume control units so that temperatures inside the electronic devices become a given target temperature; a fan control unit configured to run the at least one fan at a fan rotating speed that achieves a volume of cooling airflow to make temperatures inside the electronic devices become the given target temperature at a valve opening degree higher than the valve opening degrees that the valve opening control unit controls.
摘要:
To provide production methods for a 3-D mold, a finely processed product, and a fine pattern molded product in which the depth and the line width can be formed with high precision, a 3-D mold, a finely processed product, a fine-pattern molded product, and an optical element formed with high precision.A method of producing a 3-D mold that is configured to control depth within 10 nm and form a line width of 200 nm or less, wherein an irradiation step, which irradiates an electron beam to a resist layer of an object of processing that has the resist layer constituted with a polysiloxane-based material on or above a substrate, includes a step having irradiation conditions such that the acceleration voltage is from 1 kV to 3 kV without generation of the backscattering and the dosage is 400 μC/cm2, a method of producing finely processed product using the 3-D mold, a method of producing fine-pattern molded product using the 3-D mold or the finely processed product, and the 3-D mold, the finely processed product, the fine-pattern molded product, and an optical element formed with high precision with these production methods.
摘要翻译:为了提供三维模具,精细加工产品和精细图案模制产品的制造方法,其中可以高精度地形成深度和线宽度,三维模具,精细加工的产品,细微的 图案模制产品和高精度地形成的光学元件。 一种制造三维模具的方法,其被配置为控制10nm内的深度并形成200nm以下的线宽,其中照射步骤将电子束照射到具有 在基板上或上方由基于聚硅氧烷的材料构成的抗蚀剂层包括具有使得加速电压为1kV〜3kV而不产生后向散射且剂量为400μC/ cm 2的照射条件的工序, 使用3-D模具生产精细加工的产品,使用3-D模具或精细加工产品制造精细图案模制产品的方法,以及3-D模具,精加工产品,精细图案模制 产品和以这些制造方法高精度地形成的光学元件。
摘要:
A first semiconductor chip is mounted on a substrate on which an interconnect pattern is formed, and a surface of the first semiconductor chip having electrodes faces the substrate. A second semiconductor chip is mounted on the first semiconductor chip. Electrodes of the second semiconductor chip are electrically connected to the interconnect pattern by wires. A first resin is provided between the first semiconductor chip and the substrate, and a second resin which differs from the first resin seals the first and second semiconductor chips.