公开(公告)号：US20190296449A1

公开(公告)日：2019-09-26

申请号：US16124332

申请日：2018-09-07

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION

Inventor： Koh HASHIMOTO

IPC: H01Q21/00 ,  H01Q13/08 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q21/06

Abstract: An antenna device according to an aspect of the present invention includes dielectric plates, a first to fourth vias, lines, a conductor plate, opening sections, and an antenna element for transmission. The first to fourth vias respectively pierce through the dielectric plates corresponding to the vias and transmit high-frequency signals. A high-frequency signal flowing in the first via is transmitted to the element via a line and an opening section. The line is provided on an upper surface of a dielectric plate and is connected to an upper end portion of the first via. The opening section is provided right above a part of the line. A high-frequency signal flowing in the second, the third, and the fourth vias is transmitted from another line. The line is provided on an upper surface of another dielectric plate and is connected to an upper end of the second via.

公开(公告)号：US20180205133A1

公开(公告)日：2018-07-19

申请号：US15682372

申请日：2017-08-21

Applicant: Kabushiki Kaisha Toshiba

Inventor： Koh HASHIMOTO ,  Makoto SANO ,  Keiju YAMADA

IPC: H01Q1/22 ,  H01Q13/10 ,  H01Q25/00

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L2223/6677 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/405 ,  H01Q9/065 ,  H01Q9/26 ,  H01Q13/106 ,  H01Q21/28 ,  H01Q25/00

Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.

公开(公告)号：US20150364823A1

公开(公告)日：2015-12-17

申请号：US14701593

申请日：2015-05-01

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koh HASHIMOTO ,  Makoto HIGAKI ,  Manabu MUKAI

IPC: H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q9/0407 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/045 ,  H01Q13/106 ,  H01Q21/064

Abstract: According to an embodiment, the antenna device includes a substrate, a through hole, first and second grounded conductors, a radiating element and a feeder line. The substrate includes first to third layers. The third layer is formed between the first and the second layers. The through hole is formed on a substrate. The first grounded conductor is formed in the first layer and has a gap positioned between the first grounded conductor and the through hole. The second grounded conductor is formed in the second layer. The radiating element transmits or receives linearly-polarized waves. The feeder line is formed in the third layer, and is electrically continuous with the through hole. The feeder line includes a straight line that is formed in the third layer in an area of projection of the gap in thickness direction of the substrate and that is formed to be substantially parallel to a plane of polarization of the linearly-polarized waves.

Abstract translation: 根据实施例，天线装置包括基板，通孔，第一和第二接地导体，辐射元件和馈线。 衬底包括第一至第三层。 第三层形成在第一和第二层之间。 通孔形成在基板上。 第一接地导体形成在第一层中，并且具有位于第一接地导体和通孔之间的间隙。 第二接地导体形成在第二层中。 辐射元件发射或接收线偏振波。 馈电线形成在第三层中，与通孔电连接。 馈线包括在衬底的厚度方向上的间隙的突出区域中形成在第三层中并且形成为大致平行于线偏振波的偏振平面的直线。

公开(公告)号：US20240040293A1

公开(公告)日：2024-02-01

申请号：US18483015

申请日：2023-10-09

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koh HASHIMOTO

IPC: H04R1/04 ,  H04R1/02

CPC classification number: H04R1/04 ,  H04R1/026 ,  H04R2201/003

Abstract: According to one embodiment, a transducer includes: a first conductive member; a substrate forming a first space with the first conductive member; a second conductive member opposed to the first conductive member via the substrate, and forming a second space with the substrate; first conductors electrically connecting the first conductive member with the second conductive member; a first transmission conductor in at least one of the first/the second spaces; and a second transmission conductor in at least one of the first space or the second space, and separated from the first transmission conductor, wherein the second conductive member includes a through hole through the second conductive member in a direction opposed to the first conductive member, and connecting to the second space, and an orthogonal projection of the through hole in the direction includes at least portion of each of the first/the second transmission conductor.

公开(公告)号：US20220321984A1

公开(公告)日：2022-10-06

申请号：US17654078

申请日：2022-03-09

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koh HASHIMOTO

IPC: H04R1/04 ,  H04R1/02

Abstract: According to one embodiment, a transducer includes: a first conductive member; a substrate forming a first space with the first conductive member; a second conductive member opposed to the first conductive member via the substrate, and forming a second space with the substrate; first conductors electrically connecting the first conductive member with the second conductive member; a first transmission conductor in at least one of the first/the second spaces; and a second transmission conductor in at least one of the first space or the second space, and separated from the first transmission conductor, wherein the second conductive member includes a through hole through the second conductive member in a direction opposed to the first conductive member, and connecting to the second space, and an orthogonal projection of the through hole in the direction includes at least portion of each of the first/the second transmission conductor.

公开(公告)号：US20220059916A1

公开(公告)日：2022-02-24

申请号：US17187633

申请日：2021-02-26

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koh HASHIMOTO

IPC: H01P3/08 ,  H01Q13/10 ,  H05K1/02

Abstract: According to one embodiment, a transmission line includes a substrate; a first transmission conductor on a first surface of the substrate; first conductors penetrating from the first surface of the substrate to a second surface of the substrate on an opposite side from the first surface; second conductors on a side opposite to the first conductors with respect to the first transmission conductor, and penetrating from the first surface to the second surface; a first conductive member forming a first space surrounding the first transmission conductor, and electrically connecting the first conductors and the second conductors; and a second conductive member forming a second space surrounding a region on the second surface of the substrate, the region opposing to the first transmission conductor, and electrically connecting the first conductors and the second conductors.

公开(公告)号：US20210218146A1

公开(公告)日：2021-07-15

申请号：US17016625

申请日：2020-09-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koh HASHIMOTO

IPC: H01Q13/20 ,  H01Q1/38 ,  H01Q19/20 ,  H01Q15/10

Abstract: According to one embodiment an antenna apparatus includes: a first conductor layer; a second conductor layer; a dielectric layer between the first and the second conductor layers; a plurality of first conductor vias corresponding to a first direction; a plurality of second conductor vias opposed to the first conductor vias corresponding to the first direction; and a plurality of first openings in the first direction in a region of the first conductor layer between the first and the second conductor vias. A plurality of third conductor vias are part of the plurality of first conductor vias and are arranged along the first openings. Positions of the third conductor vias in a second direction are different from positions of others of the first conductor vias in the second direction, the second direction is substantially orthogonal to the first direction and is substantially parallel to the first conductor layer.

公开(公告)号：US20180123261A1

公开(公告)日：2018-05-03

申请号：US15691006

申请日：2017-08-30

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Makoto SANO ,  Keiju YAMADA ,  Koh HASHIMOTO ,  Makoto HIGAKI

IPC: H01Q21/00 ,  H01Q7/00 ,  H01Q1/52

CPC classification number: H01Q21/0087 ,  H01Q1/523 ,  H01Q7/00 ,  H01Q9/0414 ,  H01Q9/0442 ,  H01Q9/265 ,  H01Q13/08 ,  H01Q21/0006

Abstract: According to one embodiment, an antenna device includes first and second split ring resonators and a power supply line. The first split ring resonator includes a conductor enclosing a first opening and having a first void separating a part of the conductor. The second split ring resonator is opposed to the first split ring resonator, including a conductor which encloses a second opening and has a second void separating a part of the conductor. The power supply line feeds power to the first or second split ring resonator. The first split ring resonator is not electrically connected to the second split ring resonator. The first void does not overlap with the second void in an opposing direction of the first split ring resonator and the second split ring resonator.

公开(公告)号：US20170054217A1

公开(公告)日：2017-02-23

申请号：US15239173

申请日：2016-08-17

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koh HASHIMOTO ,  Makoto HIGAKI ,  Manabu MUKAI

IPC: H01Q9/28 ,  H01Q1/38

CPC classification number: H01Q9/0457 ,  H01Q13/10 ,  H01Q21/065

Abstract: A plane antenna device includes a multi-layered dielectric substrate having a plurality of dielectric layers; a first conductive plane on or in the multi-layered dielectric substrate; a second conductive plane on or in the multi-layered dielectric substrate, wherein at least first and second dielectric layers of the plurality of dielectric layers are disposed between the first and second conductive planes; a first signal line being between the at least first and second dielectric layers, the first signal line being between the first conductive plane and the second conductive plane; a first conductive via in the first dielectric layer, the first conductive via being distanced from the first signal line; and a second conductive via in the second dielectric layer, the second conductive via being distanced from the first signal line, the second conductive via being aligned to the first conductive via.

Abstract translation: 平面天线装置包括具有多个电介质层的多层电介质基板; 在多层电介质基片上或其中的第一导电平面; 所述多层电介质基板上或其中的第二导电平面，其中所述多个电介质层中的至少第一和第二电介质层设置在所述第一和第二导电平面之间; 所述第一信号线在所述至少第一和第二电介质层之间，所述第一信号线在所述第一导电平面和所述第二导电平面之间; 第一导电通孔在第一介电层中，第一导电通孔与第一信号线分开; 以及在所述第二介电层中的第二导电通孔，所述第二导电通孔与所述第一信号线分开，所述第二导电通孔与所述第一导电通孔对准。

公开(公告)号：US20220404457A1

公开(公告)日：2022-12-22

申请号：US17685947

申请日：2022-03-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiroki MORI ,  Xu ZHU ,  Hiroshi YOSHIDA ,  Koh HASHIMOTO

IPC: G01S7/03 ,  H01Q21/00

Abstract: According to one embodiment, a radar device includes a transmission module including a transmission antenna and first integrated circuits, a reception module including a reception antenna and second integrated circuits, and a third integrated circuit. Each of the first integrated circuits includes first transmission circuits, first reception circuits, and a first signal generation circuit. Each of the second integrated circuits includes second transmission circuits, second reception circuits, and a second signal generation circuit. The third integrated circuit includes third transmission circuits, third reception circuits, and a third signal generation circuit.