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公开(公告)号：US10025756B2
公开(公告)日：2018-07-17
申请号：US14508469
申请日：2014-10-07
Applicant: KLA-Tencor Corporation
Inventor： Dana Klein , Sven Jug
IPC: G06F17/18 , G03F7/20 , G05B19/418
Abstract: Methods and respective modules which reduce sample size and measurement duration of metrology parameters by selecting a relatively small subset of measured targets to represent a distribution of parameter measurements of a large number of targets. The subset is selected by sampling a substantially equal number of measurements from each of a selected number of quantiles of the distribution. The methods and modules allow identification of targets which represent correctly the whole target measurement distribution. The methods and modules optimize quantiles and sample size selections, using accuracy scores and estimations of the robustness of the selections. Sampling and selections may be carried out iteratively to reach specified criteria that match the results which can be derived when considering the whole distribution.
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公开(公告)号：US10203200B2
公开(公告)日：2019-02-12
申请号：US15329618
申请日：2016-11-01
Applicant: KLA-Tencor Corporation
Inventor： Tal Marciano , Michael E. Adel , Mark Ghinovker , Barak Bringoltz , Dana Klein , Tal Itzkovich , Vidya Ramanathan , Janay Camp
Abstract: Method, metrology modules and RCA tool are provided, which use the behavior of resonance region(s) in measurement landscapes to evaluate and characterize process variation with respect to symmetric and asymmetric factors, and provide root cause analysis of the process variation with respect to process steps. Simulations of modeled stacks with different layer thicknesses and process variation factors may be used to enhance the analysis and provide improved target designs, improved algorithms and correctables for metrology measurements. Specific targets that exhibit sensitive resonance regions may be utilize to enhance the evaluation of process variation.
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公开(公告)号：US09329033B2
公开(公告)日：2016-05-03
申请号：US13834915
申请日：2013-03-15
Applicant: KLA-TENCOR CORPORATION
Inventor： Eran Amit , Dana Klein , Guy Cohen , Amir Widmann , Nimrod Shuall , Amnon Manassen , Nuriel Amir
CPC classification number: G01B21/042 , G03F7/70625 , G03F7/70633
Abstract: Aspects of the present disclosure describe systems and methods for calibrating a metrology tool by using proportionality factors. The proportionality factors may be obtained by measuring a substrate under different measurement conditions. Then calculating the measured metrology value and one or more quality merits. From this information, proportionality factors may be determined. Thereafter the proportionality factors may be used to quantify the inaccuracy in a metrology measurement. The proportionality factors may also be used to determine an optimize measurement recipe. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Abstract translation: 本公开的方面描述了通过使用比例因子来校准度量工具的系统和方法。 可以通过在不同测量条件下测量衬底来获得比例因子。 然后计算测量的度量值和一个或多个质量优点。 根据该信息，可以确定比例因子。 此后，可以使用比例因子来量化度量测量中的不精确度。 比例因子也可用于确定优化测量配方。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US09903711B2
公开(公告)日：2018-02-27
申请号：US15090389
申请日：2016-04-04
Applicant: KLA-Tencor Corporation
Inventor： Ady Levy , Daniel Kandel , Michael E. Adel , Leonid Poslavsky , John Robinson , Tal Marciano , Barak Bringoltz , Tzahi Grunzweig , Dana Klein , Tal Itzkovich , Nadav Carmel , Nuriel Amir , Vidya Ramanathan , Janay Camp , Mark Wagner
IPC: G01B11/14 , G01B11/27 , G01N21/95 , G03F7/20 , G01N21/21 , G01N21/31 , G01N21/41 , G01N21/47 , G01N21/64
CPC classification number: G01B11/272 , G01N21/211 , G01N21/31 , G01N21/41 , G01N21/4738 , G01N21/4788 , G01N21/6489 , G01N21/9501 , G01N2021/213 , G03F7/705 , G03F7/70525 , G03F7/70533 , G03F7/70616
Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.
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公开(公告)号：US10754260B2
公开(公告)日：2020-08-25
申请号：US15184612
申请日：2016-06-16
Applicant: KLA-Tencor Corporation
Inventor： Onur Demirer , Roie Volkovich , William Pierson , Mark Wagner , Dana Klein
Abstract: The generation of flexible sparse metrology sample plans includes receiving a full set of metrology signals from one or more wafers from a metrology tool, determining a set of wafer properties based on the full set of metrology signals and calculating a wafer property metric associated with the set of wafer properties, calculating one or more independent characterization metrics based on the full set of metrology signals, and generating a flexible sparse sample plan based on the set of wafer properties, the wafer property metric, and the one or more independent characterization metrics. The one or more independent characterization metrics of the one or more properties calculated with metrology signals from the flexible sparse sampling plan is within a selected threshold from one or more independent characterization metrics of the one or more properties calculated with the full set of metrology signals.
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Patent Agency Ranking
公开(公告)号：US20180023950A1
公开(公告)日：2018-01-25
申请号：US15329618
申请日：2016-11-01
Applicant: KLA-Tencor Corporation
Inventor： Tal Marciano , Michael E. Adel , Mark Ghinovker , Barak Bringoltz , Dana Klein , Tal Itzkovich , Vidya Ramanathan , Janay Camp
IPC: G01B11/27
CPC classification number: G01B11/272 , G03F7/70616 , G03F7/70633 , H01L22/12 , H01L22/20
Abstract: Method, metrology modules and RCA tool are provided, which use the behavior of resonance region(s) in measurement landscapes to evaluate and characterize process variation with respect to symmetric and asymmetric factors, and provide root cause analysis of the process variation with respect to process steps. Simulations of modeled stacks with different layer thicknesses and process variation factors may be used to enhance the analysis and provide improved target designs, improved algorithms and correctables for metrology measurements. Specific targets that exhibit sensitive resonance regions may be utilize to enhance the evaluation of process variation.
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公开(公告)号：US20160290796A1
公开(公告)日：2016-10-06
申请号：US15090389
申请日：2016-04-04
Applicant: KLA-Tencor Corporation
Inventor： Ady Levy , Daniel Kandel , Michael E. Adel , Leonid Poslavsky , John Robinson , Tal Marciano , Barak Bringoltz , Tzahi Grunzweig , Dana Klein , Tal Itzkovich , Nadav Carmel , Nuriel Amir , Vidya Ramanathan , Janay Camp , Mark Wagner
CPC classification number: G01B11/272 , G01N21/211 , G01N21/31 , G01N21/41 , G01N21/4738 , G01N21/4788 , G01N21/6489 , G01N21/9501 , G01N2021/213 , G03F7/705 , G03F7/70525 , G03F7/70533 , G03F7/70616
Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.
Abstract translation: 计量性能分析系统包括包括一个或多个检测器的计量工具和通信地耦合到所述一个或多个检测器的控制器。 所述控制器被配置为从所述计量工具接收与度量目标相关联的一个或多个度量数据集，其中所述一个或多个测量数据集包括一个或多个测量的度量度量，并且所述一个或多个测量的度量度量指示与标称值的偏差 。 控制器还被配置为确定与标称值和一个或多个所选择的半导体工艺变化的偏差之间的关系，并且基于一个或多个测量值的值之间的关系确定偏离标称值的一个或多个根本原因 度量和一个或多个所选择的半导体工艺变化。
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公开(公告)号：US20140060148A1
公开(公告)日：2014-03-06
申请号：US13834915
申请日：2013-03-15
Applicant: KLA-TENCOR CORPORATION
Inventor： Eran Amit , Dana Klein , Guy Cohen , Amir Widmann , Nimrod Shuall , Amnon Manassen , Nuriel Amir
IPC: G01B21/04
CPC classification number: G01B21/042 , G03F7/70625 , G03F7/70633
Abstract: Aspects of the present disclosure describe systems and methods for calibrating a metrology tool by using proportionality factors. The proportionality factors may be obtained by measuring a substrate under different measurement conditions. Then calculating the measured metrology value and one or more quality merits. From this information, proportionality factors may be determined. Thereafter the proportionality factors may be used to quantify the inaccuracy in a metrology measurement. The proportionality factors may also be used to determine an optimize measurement recipe. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Abstract translation: 本公开的方面描述了通过使用比例因子来校准度量工具的系统和方法。 可以通过在不同测量条件下测量衬底来获得比例因子。 然后计算测量的度量值和一个或多个质量优点。 根据该信息，可以确定比例因子。 此后，可以使用比例因子来量化度量测量中的不精确度。 比例因子也可用于确定优化测量配方。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US10901325B2
公开(公告)日：2021-01-26
申请号：US15763662
申请日：2018-02-27
Applicant: KLA-TENCOR CORPORATION
Inventor： Evgeni Gurevich , Michael E. Adel , Roel Gronheid , Yoel Feler , Vladimir Levinski , Dana Klein , Sharon Aharon
Abstract: Methods are provided for designing metrology targets and estimating the uncertainty error of metrology metric values with respect to stochastic noise such as line properties (e.g., line edge roughness, LER). Minimal required dimensions of target elements may be derived from analysis of the line properties and uncertainty error of metrology measurements, by either CDSEM (critical dimension scanning electron microscopy) or optical systems, with corresponding targets. The importance of this analysis is emphasized in view of the finding that stochastic noise may have increased importance with when using more localized models such as CPE (correctables per exposure). The uncertainty error estimation may be used for target design, enhancement of overlay estimation and evaluation of measurement reliability in multiple contexts.
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公开(公告)号：US20160370718A1
公开(公告)日：2016-12-22
申请号：US15184612
申请日：2016-06-16
Applicant: KLA-Tencor Corporation
Inventor： Onur Demirer , Roie Volkovich , William Pierson , Mark Wagner , Dana Klein
IPC: G03F9/00
Abstract: The generation of flexible sparse metrology sample plans includes receiving a full set of metrology signals from one or more wafers from a metrology tool, determining a set of wafer properties based on the full set of metrology signals and calculating a wafer property metric associated with the set of wafer properties, calculating one or more independent characterization metrics based on the full set of metrology signals, and generating a flexible sparse sample plan based on the set of wafer properties, the wafer property metric, and the one or more independent characterization metrics. The one or more independent characterization metrics of the one or more properties calculated with metrology signals from the flexible sparse sampling plan is within a selected threshold from one or more independent characterization metrics of the one or more properties calculated with the full set of metrology signals.
Abstract translation: 柔性稀疏测量样本计划的生成包括从计量工具接收来自一个或多个晶片的全套计量信号，基于全套测量信号确定一组晶片特性，并计算与该组相关联的晶片特性度量 的晶片属性，基于整套测量信号计算一个或多个独立表征度量，以及基于所述晶片属性集合，所述晶片属性度量以及所述一个或多个独立表征度量来生成柔性稀疏样本计划。 使用来自灵活稀疏采样计划的度量信号计算出的一个或多个属性的一个或多个独立特征度量，在由所述整套度量信号计算的一个或多个属性的一个或多个独立特性度量值的选定阈值内。
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