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公开(公告)号:US20170345142A1
公开(公告)日:2017-11-30
申请号:US15356799
申请日:2016-11-21
Applicant: KLA-Tencor Corporation
Inventor: Bjorn Brauer , Santosh Bhattacharyya
CPC classification number: G06T7/0006 , G06K9/6202 , G06T7/001 , G06T2207/10061 , G06T2207/30148
Abstract: Defect detection is performed by comparing a test image and a reference image with a rendered design image, which may be generated from a design file. This may occur because a comparison of the test image and another reference image was inconclusive due to noise. The results of the two comparisons with the rendered design image can indicate whether a defect is present in the test image.
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2.
公开(公告)号:US11151707B2
公开(公告)日:2021-10-19
申请号:US16277769
申请日:2019-02-15
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Jacob George , Saravanan Paramasivam , Martin Plihal
IPC: G06T7/00 , G06N3/08 , G06N3/04 , G06K9/62 , G01N23/2251
Abstract: A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.
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公开(公告)号:US10325361B2
公开(公告)日:2019-06-18
申请号:US15367076
申请日:2016-12-01
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya
Abstract: A system, method, and computer program product are provided for automatically generating a wafer image to design coordinate mapping. In use, a design of a wafer is received by a computer processor. In addition, an image of a wafer fabricated from the design is received by the computer processor. Further, a coordinate mapping between the design and the image is automatically generated by the computer processor.
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4.
公开(公告)号:US10127651B2
公开(公告)日:2018-11-13
申请号:US15356729
申请日:2016-11-21
Applicant: KLA-Tencor Corporation
Inventor: Ashok Kulkarni , Saibal Banerjee , Santosh Bhattacharyya , Bjorn Brauer
Abstract: Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori.
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5.
公开(公告)号:US20180149603A1
公开(公告)日:2018-05-31
申请号:US15826019
申请日:2017-11-29
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Devashish Sharma , Christopher Maher , Bo Hua , Philip Measor , Robert M. Danen
CPC classification number: G01N21/9505 , G01N21/956 , G01N23/04 , G01N2021/8883 , G01N2223/6462 , G01R31/2831 , G01R31/311 , G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
Abstract: Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein. The volume of a semiconductor wafer subject to defect discovery and verification is reduced by storing images associated with a subset of the total depth of the semiconductor structures under measurement. Image patches associated with defect locations at one or more focus planes or focus ranges are recorded. The number of optical modes under consideration is reduced based on any of a comparison of one or more measured wafer level defect signatures and one or more expected wafer level defect signatures, measured defect signal to noise ratio, and defects verified without de-processing. Furthermore, verified defects and recorded images are employed to train a nuisance filter and optimize the measurement recipe. The trained nuisance filter is applied to defect images to select the optimal optical mode for production.
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公开(公告)号:US09830421B2
公开(公告)日:2017-11-28
申请号:US14983452
申请日:2015-12-29
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Bjorn Braeuer , Lisheng Gao
CPC classification number: G06F17/5081 , G03F7/70616
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. One method includes selecting one or more alignment targets from a design for a specimen. At least a portion of the one or more alignment targets include built in targets included in the design for a purpose other than alignment of inspection results to design data space. At least the portion of the one or more alignment targets does not include one or more individual device features. One or more images for the alignment target(s) and output generated by the inspection subsystem at the position(s) of the alignment target(s) may then be used to determine design data space positions of other output generated by the inspection subsystem in a variety of ways described herein.
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7.
公开(公告)号:US20200184628A1
公开(公告)日:2020-06-11
申请号:US16277769
申请日:2019-02-15
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Jacob George , Saravanan Paramasivam , Martin Plihal
IPC: G06T7/00 , G06N3/08 , G06N3/04 , G06K9/62 , G01N23/2251
Abstract: A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.
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公开(公告)号:US10192302B2
公开(公告)日:2019-01-29
申请号:US15356799
申请日:2016-11-21
Applicant: KLA-Tencor Corporation
Inventor: Bjorn Brauer , Santosh Bhattacharyya
Abstract: Defect detection is performed by comparing a test image and a reference image with a rendered design image, which may be generated from a design file. This may occur because a comparison of the test image and another reference image was inconclusive due to noise. The results of the two comparisons with the rendered design image can indicate whether a defect is present in the test image.
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公开(公告)号:US10151706B1
公开(公告)日:2018-12-11
申请号:US15481421
申请日:2017-04-06
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Hucheng Lee , Bjorn Brauer
Abstract: Methods and systems for detecting defects on a specimen are provided. One method includes identifying first and second portions of dies on a specimen as edge dies and center dies, respectively. The method also includes determining first and second inspection methods for the first and second portions, respectively. Parameter(s) of comparisons performed in the first and second inspection methods are different. The method further includes detecting defects in at least one of the edge dies using the first inspection method and detecting defects in at least one of the center dies using the second inspection method.
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10.
公开(公告)号:US20170206650A1
公开(公告)日:2017-07-20
申请号:US15356729
申请日:2016-11-21
Applicant: KLA-Tencor Corporation
Inventor: Ashok Kulkarni , Saibal Banerjee , Santosh Bhattacharyya , Bjorn Brauer
IPC: G06T7/00
CPC classification number: G06T7/0006 , G06T7/001 , G06T2207/10061 , G06T2207/30148
Abstract: Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori.
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