摘要:
A wire organizer (16) comprises, signal wire receiving passages (22), fingers (19) receiving electrical contacts (9) of an electrical connector assembly (6), and each of the passages (22) that receives a signal wire (2) superposes the signal wire (2) over one of the contacts (9) for joined connection of the signal wire (2) to the contact (9).
摘要:
A connector assembly (6) comprises, conductive signal contacts (9) and a ground bus (10), a separator (16) between first and second rows of the contacts (9), the contacts (9) and the ground bus (10) being supported against the separator (16), the separator (16) having fingers (19) between adjacent contacts (9) of each row, and the ground bus (10) and the contacts (9) being of greater height than the fingers (19) for ease in connection to wires (2, 5) of an electrical cable (1).
摘要:
An electrical cable assembly 1 comprises, electrical contacts 9 mounted in an insulative housing 8, the contacts 9 are connected to signal wires 4 of an electrical cable 2, a ground bus 7 connected to ground wires 5 of the cable 2, the wires 4,5 are bent to extend toward a cable entry side 15 or 16 of the assembly 1, the ground bus 7 is connected by tabs 14 to selected contacts 9', and the tabs 14 offset the ground bus 7 to a side of the assembly 1.
摘要:
A cable 3 connector 1 comprising, a housing block 2 and an electrical cable 3 having a signal wire 13 connected to a corresponding signal contact 4, and at least one reference wire 14 connected to a reference conductor 5 extending beside the signal contact 4, a housing 6 coupled to the housing 6 block 2 and receiving the signal contact 4 in one of multiple contact positions 7 in the housing 6, and a reference contact 10 received in the housing 6 and connected to the reference conductor 5.
摘要:
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
摘要:
A system is provided to enable leakage current measurement or parametric tests to be performed with an isolation buffer provided in a channel line. Multiple such isolation buffers are used to connect a single signal channel to multiple lines. Leakage current measurement is provided by providing a buffer bypass element, such as a resistor or transmission gate, between the input and output of each buffer. The buffer bypass element can be used to calibrate buffer delay out of the test system by using TDR measurements to determine the buffer delay based on reflected pulses through the buffer bypass element. Buffer delay can likewise be calibrated out by comparing measurements of a buffered and non-buffered channel line, or by measuring a device having a known delay.
摘要:
A series of pulses may be driven down each drive channel, which creates a series of composite pulses at the output of the buffer. Each composite pulse is a composition of the individual pulses driven down the drive channels. Timing offsets associated with the drive channels may be adjusted until the individual pulses of the composite pulse align or closely align. Those timing offsets calibrate and/or deskew the drive channels, compensating for differences in the propagation delays through the drive channels. The composite pulse may be feed back to the tester through compare channels, and offsets associated with compare signals for each compare channel may be aligned to the composite pulse, which calibrates and/or deskews the compare channels.
摘要:
A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要:
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.