摘要:
The present invention relates to a low expansion glass substrate which serves as a substrate of a reflective mask used in a lithography step of semiconductor production steps, wherein two side surfaces positioned to face each other among side surfaces formed along a periphery of the low expansion glass substrate, each have a flatness of 25 μm or less.
摘要:
The present invention relates to a low expansion glass substrate which serves as a substrate of a reflective mask used in a lithography step of semiconductor production steps, wherein two side surfaces positioned to face each other among side surfaces formed along a periphery of the low expansion glass substrate, each have a flatness of 25 μm or less.
摘要:
An object of the invention is to provide a method for removing foreign matter from a glass substrate surface to be finish-processed by a method accompanied with beam irradiation or laser light irradiation on the glass substrate surface. The present invention relates to a method for removing foreign matter from a glass substrate surface, which includes subjecting the glass substrate surface to gas cluster ion beam etching at an accelerating voltage of from 5 to 15 keV.
摘要:
The present invention is to provide a method for processing the whole of a glass substrate surface so as to give a surface excellent in flatness and surface roughness. The present invention provides a method of processing a glass substrate surface using a processing technique selected from the group consisting of ion-beam etching, gas cluster ion-beam etching, plasma etching, and nano-ablation, wherein a frame element satisfying the following (1) and (2) is arranged along the periphery of the glass substrate before the glass substrate surface is processed: (1) the difference between the height of the frame element and the height of the glass substrate surface is 1 mm or smaller; and (2) the frame element has a width which is not smaller than one-half the beam diameter or laser light diameter to be used in the processing technique.
摘要:
The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.
摘要:
To provide a polishing method for a glass substrate required to have extremely high surface smoothness and surface precision, like a glass substrate to be used for e.g. a reflective mask for extreme ultra violet lithography. A surface of a glass substrate containing SiO2 as the main component, is polished with a polishing slurry comprising colloidal silica having an average primary particle size of at most 50 nm, an acid and water, and having the pH adjusted to be within a range of from 0.5 to 4, so that the surface roughness Rms will be at most 0.15 nm as measured by an atomic force microscope.
摘要:
The present invention aims at providing a glass substrate required to have a surface polished with extremely high accuracy as in glass substrates for reflective masks for use in EUVL; and a polishing method for producing the glass substrate. The present invention provides a glass substrate for mask blank, which is a glass substrate comprising SiO2 as a main component and having a polished main surface, wherein concave defects and convex defects on the main surface have a depth of 2 nm or smaller and a height of 2 nm or smaller, respectively, and have a half-value width of 60 nm or smaller, so that the concave defects and/or the convex defects do not cause phase defects when the glass substrate is used to produce a mask for exposure and the mask is used. Also disclosed are a polishing method for producing the glass substrate, and a mask blank and a mask for exposure using the glass substrate.
摘要:
A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate.
摘要:
The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.
摘要:
An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a method of polishing a glass substrate which comprises polishing a major surface of the glass substrate while feeding a polishing slurry between the glass substrate and a pad surface of a polishing pad, wherein the polishing load of the polishing pad is from 1 to 60 g/cm2. The pad surface of the polishing pact is preferably dressing-processed.
摘要翻译:本发明的目的是提供一种用于减少用于EUVL等的反射掩模中的玻璃基板的凹陷缺陷的抛光方法。 本发明涉及一种抛光玻璃基板的方法,其中包括在玻璃基板和抛光垫的焊盘表面之间馈送抛光浆料的同时抛光玻璃基板的主表面,其中抛光垫的抛光载荷为1 至60g / cm 2。 抛光体的焊盘表面优选进行修整处理。