METHOD OF PROCESSING GLASS SUBSTRATE SURFACE
    4.
    发明申请
    METHOD OF PROCESSING GLASS SUBSTRATE SURFACE 审中-公开
    玻璃基板表面处理方法

    公开(公告)号:US20100080961A1

    公开(公告)日:2010-04-01

    申请号:US12631304

    申请日:2009-12-04

    IPC分类号: B32B3/02 B44C1/22 B29D11/00

    摘要: The present invention is to provide a method for processing the whole of a glass substrate surface so as to give a surface excellent in flatness and surface roughness. The present invention provides a method of processing a glass substrate surface using a processing technique selected from the group consisting of ion-beam etching, gas cluster ion-beam etching, plasma etching, and nano-ablation, wherein a frame element satisfying the following (1) and (2) is arranged along the periphery of the glass substrate before the glass substrate surface is processed: (1) the difference between the height of the frame element and the height of the glass substrate surface is 1 mm or smaller; and (2) the frame element has a width which is not smaller than one-half the beam diameter or laser light diameter to be used in the processing technique.

    摘要翻译: 本发明提供一种加工整个玻璃基板表面以提供平坦度和表面粗糙度优异的表面的方法。 本发明提供一种使用选自离子束蚀刻,气体簇离子束蚀刻,等离子体蚀刻和纳米烧蚀的处理技术来处理玻璃基板表面的方法,其中满足以下( (1)和(2)在玻璃基板表面被处理之前沿着玻璃基板的周边布置:(1)框架元件的高度与玻璃基板表面的高度之间的差为1mm或更小; 和(2)框架元件具有不小于处理技术中使用的光束直径或激光光径的一半的宽度。

    PROCESSING METHOD OF GLASS SUBSTRATE, AND HIGHLY FLAT AND HIGHLY SMOOTH GLASS SUBSTRATE
    5.
    发明申请
    PROCESSING METHOD OF GLASS SUBSTRATE, AND HIGHLY FLAT AND HIGHLY SMOOTH GLASS SUBSTRATE 有权
    玻璃基板的加工方法,以及高平板和高平板玻璃基板

    公开(公告)号:US20090017257A1

    公开(公告)日:2009-01-15

    申请号:US12233884

    申请日:2008-09-19

    IPC分类号: B32B17/00 C03B8/00

    摘要: The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.

    摘要翻译: 本发明提供一种以高生产率制造高度平坦且高度光滑的玻璃基板的加工方法。 通过处理玻璃基板,通过加工玻璃基板,以高生产率获得高度平坦且高度平滑的玻璃基板,其包括在处理之前测量玻璃基板的表面形状的步骤,通过改变处理来处理基板的表面的步骤 (第一处理步骤),以及对经过第一处理步骤(第二处理步骤)的玻璃基板的表面进行精抛光的步骤。 此时,根据从处理前的玻璃基板的表面的凹凸形状确定的处理量来确定第一处理工序中的基板的表面内的每个部位的处理条件, 通过使用相似的基板分别测量的第二处理步骤的处理量的平面分布。

    Polishing method for glass substrate, and glass substrate
    6.
    发明申请
    Polishing method for glass substrate, and glass substrate 审中-公开
    玻璃基板和玻璃基板的抛光方法

    公开(公告)号:US20070066066A1

    公开(公告)日:2007-03-22

    申请号:US11522413

    申请日:2006-09-18

    IPC分类号: H01L21/302 H01L21/461

    CPC分类号: C09G1/02

    摘要: To provide a polishing method for a glass substrate required to have extremely high surface smoothness and surface precision, like a glass substrate to be used for e.g. a reflective mask for extreme ultra violet lithography. A surface of a glass substrate containing SiO2 as the main component, is polished with a polishing slurry comprising colloidal silica having an average primary particle size of at most 50 nm, an acid and water, and having the pH adjusted to be within a range of from 0.5 to 4, so that the surface roughness Rms will be at most 0.15 nm as measured by an atomic force microscope.

    摘要翻译: 为了提供具有非常高的表面平滑度和表面精度所需的玻璃基板的抛光方法,例如用于例如玻璃基板的玻璃基板。 用于极紫外光刻的反光罩。 以包含SiO 2作为主要成分的玻璃基板的表面用包含平均一次粒径为至多50nm的胶体二氧化硅,酸和水的抛光浆料抛光,并具有 pH调节在0.5〜4的范围内,使用原子力显微镜测定的表面粗糙度Rms为0.15nm以下。

    Glass substrate for mask blank and method of polishing for producing the same
    7.
    发明授权
    Glass substrate for mask blank and method of polishing for producing the same 有权
    面罩坯料用玻璃基板及其制造方法

    公开(公告)号:US07923178B2

    公开(公告)日:2011-04-12

    申请号:US12143928

    申请日:2008-06-23

    摘要: The present invention aims at providing a glass substrate required to have a surface polished with extremely high accuracy as in glass substrates for reflective masks for use in EUVL; and a polishing method for producing the glass substrate. The present invention provides a glass substrate for mask blank, which is a glass substrate comprising SiO2 as a main component and having a polished main surface, wherein concave defects and convex defects on the main surface have a depth of 2 nm or smaller and a height of 2 nm or smaller, respectively, and have a half-value width of 60 nm or smaller, so that the concave defects and/or the convex defects do not cause phase defects when the glass substrate is used to produce a mask for exposure and the mask is used. Also disclosed are a polishing method for producing the glass substrate, and a mask blank and a mask for exposure using the glass substrate.

    摘要翻译: 本发明的目的在于提供一种玻璃基板,其具有以非常高的精度抛光的表面,如在用于EUVL的反射掩模的玻璃基板中; 以及用于制造玻璃基板的抛光方法。 本发明提供了一种用于掩模坯料的玻璃基板,其是以SiO 2为主要成分并具有抛光主表面的玻璃基板,其中主表面上的凹陷缺陷和凸起缺陷具有2nm或更小的深度, 分别为2nm以下,并且半值宽度为60nm以下,使得当使用玻璃基板制造用于曝光的掩模时,凹陷缺陷和/或凸起缺陷不会引起相位缺陷,并且 使用面具。 还公开了用于制造玻璃基板的抛光方法,以及掩模坯料和使用玻璃基板进行曝光的掩模。

    PROCESS FOR POLISHING GLASS SUBSTRATE
    8.
    发明申请
    PROCESS FOR POLISHING GLASS SUBSTRATE 有权
    抛光玻璃基板的工艺

    公开(公告)号:US20070259605A1

    公开(公告)日:2007-11-08

    申请号:US11779441

    申请日:2007-07-18

    IPC分类号: B24B49/00 B24B7/30

    摘要: A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate.

    摘要翻译: 提供了一种用于抛光玻璃基板的方法,该玻璃基板能够研磨通过机械抛光形成的具有大波纹度的玻璃基板以具有优异的平面度的表面。 一种用于抛光玻璃基板的方法,包括测量机械抛光的玻璃基板的表面轮廓以识别玻璃基板中存在的波纹宽度的步骤,以及使用在FWHM中具有光束尺寸的光束进行干蚀刻的步骤 (全宽半高)值至多为上述大小的波纹,以研磨玻璃基板的表面。

    Processing method of glass substrate, and highly flat and highly smooth glass substrate
    9.
    发明授权
    Processing method of glass substrate, and highly flat and highly smooth glass substrate 有权
    玻璃基板的加工方法,以及高度平坦且高度平滑的玻璃基板

    公开(公告)号:US08137574B2

    公开(公告)日:2012-03-20

    申请号:US12233884

    申请日:2008-09-19

    IPC分类号: B44C1/22 C03C15/00

    摘要: The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.

    摘要翻译: 本发明提供一种以高生产率制造高度平坦且高度光滑的玻璃基板的加工方法。 通过处理玻璃基板,通过加工玻璃基板,以高生产率获得高度平坦且高度平滑的玻璃基板,其包括在处理之前测量玻璃基板的表面形状的步骤,通过改变处理来处理基板的表面的步骤 (第一处理步骤),以及对经过第一处理步骤(第二处理步骤)的玻璃基板的表面进行精抛光的步骤。 此时,根据从处理前的玻璃基板的表面的凹凸形状确定的处理量来确定第一处理工序中的基板的表面内的每个部位的处理条件, 通过使用相似的基板分别测量的第二处理步骤的处理量的平面分布。

    Method of polishing glass substrate
    10.
    发明授权
    Method of polishing glass substrate 有权
    抛光玻璃基板的方法

    公开(公告)号:US08070557B2

    公开(公告)日:2011-12-06

    申请号:US12631004

    申请日:2009-12-04

    IPC分类号: B24B1/00

    摘要: An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a method of polishing a glass substrate which comprises polishing a major surface of the glass substrate while feeding a polishing slurry between the glass substrate and a pad surface of a polishing pad, wherein the polishing load of the polishing pad is from 1 to 60 g/cm2. The pad surface of the polishing pact is preferably dressing-processed.

    摘要翻译: 本发明的目的是提供一种用于减少用于EUVL等的反射掩模中的玻璃基板的凹陷缺陷的抛光方法。 本发明涉及一种抛光玻璃基板的方法,其中包括在玻璃基板和抛光垫的焊盘表面之间馈送抛光浆料的同时抛光玻璃基板的主表面,其中抛光垫的抛光载荷为1 至60g / cm 2。 抛光体的焊盘表面优选进行修整处理。