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1.发明申请LOW EXPANSION GLASS SUBSTRATE FOR REFLECTION TYPE MASK AND METHOD FOR PROCESSING SAME 有权用于反射型掩模的低膨胀玻璃基板及其加工方法公开(公告)号：US20110244171A1
公开(公告)日：2011-10-06
申请号：US13163338
申请日：2011-06-17
申请人： Kenji OKAMURA , Masabumi Ito , Hiroshi Kojima
发明人： Kenji OKAMURA , Masabumi Ito , Hiroshi Kojima
CPC分类号： G03F1/24 , B82Y10/00 , B82Y40/00 , Y10T428/24
摘要： The present invention relates to a low expansion glass substrate which serves as a substrate of a reflective mask used in a lithography step of semiconductor production steps, wherein two side surfaces positioned to face each other among side surfaces formed along a periphery of the low expansion glass substrate, each have a flatness of 25 μm or less.
摘要翻译： 本发明涉及用作半导体制造步骤的光刻步骤中使用的反射掩模的基板的低膨胀玻璃基板，其中两个侧表面沿着低膨胀玻璃的周边形成的侧表面彼此相对定位 基板各自具有25μm以下的平坦度。
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2.发明授权Low expansion glass substrate for reflection type mask and method for processing same 有权用于反射型掩模的低膨胀玻璃基板及其加工方法公开(公告)号：US08524422B2
公开(公告)日：2013-09-03
申请号：US13163338
申请日：2011-06-17
申请人： Kenji Okamura , Masabumi Ito , Hiroshi Kojima
发明人： Kenji Okamura , Masabumi Ito , Hiroshi Kojima
CPC分类号： G03F1/24 , B82Y10/00 , B82Y40/00 , Y10T428/24
摘要： The present invention relates to a low expansion glass substrate which serves as a substrate of a reflective mask used in a lithography step of semiconductor production steps, wherein two side surfaces positioned to face each other among side surfaces formed along a periphery of the low expansion glass substrate, each have a flatness of 25 μm or less.
摘要翻译： 本发明涉及用作半导体制造步骤的光刻步骤中使用的反射掩模的基板的低膨胀玻璃基板，其中两个侧表面沿着低膨胀玻璃的周边形成的侧表面彼此相对定位 基材，平均度为25μm以下。
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3.发明申请METHOD FOR REMOVING FOREIGN MATTER FROM GLASS SUBSTRATE SURFACE AND METHOD FOR PROCESSING GLASS SUBSTRATE SURFACE 审中-公开从玻璃基板表面去除外来物质的方法及处理玻璃基板表面的方法公开(公告)号：US20100101940A1
公开(公告)日：2010-04-29
申请号：US12648481
申请日：2009-12-29
申请人： Masabumi Ito , Kenji Okamura , Hiroshi Kojima
发明人： Masabumi Ito , Kenji Okamura , Hiroshi Kojima
IPC分类号： C23F1/00
CPC分类号： C03C15/02 , B82Y10/00 , B82Y40/00 , C03C23/0025 , C03C23/006 , C03C23/0075 , G03F1/24 , G03F1/82 , H01J2237/0812 , H01J2237/3151
摘要： An object of the invention is to provide a method for removing foreign matter from a glass substrate surface to be finish-processed by a method accompanied with beam irradiation or laser light irradiation on the glass substrate surface. The present invention relates to a method for removing foreign matter from a glass substrate surface, which includes subjecting the glass substrate surface to gas cluster ion beam etching at an accelerating voltage of from 5 to 15 keV.
摘要翻译： 本发明的目的是提供一种通过伴随着在玻璃基板表面上的光束照射或激光照射的方法从待处理的玻璃基板表面去除异物的方法。 本发明涉及一种从玻璃基板表面除去异物的方法，其包括以5至15keV的加速电压对玻璃基板表面进行气体簇离子束蚀刻。
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4.发明授权公开(公告)号：US07923178B2
公开(公告)日：2011-04-12
申请号：US12143928
申请日：2008-06-23
申请人： Masabumi Ito , Hiroshi Kojima
发明人： Masabumi Ito , Hiroshi Kojima
摘要： The present invention aims at providing a glass substrate required to have a surface polished with extremely high accuracy as in glass substrates for reflective masks for use in EUVL; and a polishing method for producing the glass substrate. The present invention provides a glass substrate for mask blank, which is a glass substrate comprising SiO2 as a main component and having a polished main surface, wherein concave defects and convex defects on the main surface have a depth of 2 nm or smaller and a height of 2 nm or smaller, respectively, and have a half-value width of 60 nm or smaller, so that the concave defects and/or the convex defects do not cause phase defects when the glass substrate is used to produce a mask for exposure and the mask is used. Also disclosed are a polishing method for producing the glass substrate, and a mask blank and a mask for exposure using the glass substrate.
摘要翻译： 本发明的目的在于提供一种玻璃基板，其具有以非常高的精度抛光的表面，如在用于EUVL的反射掩模的玻璃基板中; 以及用于制造玻璃基板的抛光方法。 本发明提供了一种用于掩模坯料的玻璃基板，其是以SiO 2为主要成分并具有抛光主表面的玻璃基板，其中主表面上的凹陷缺陷和凸起缺陷具有2nm或更小的深度， 分别为2nm以下，并且半值宽度为60nm以下，使得当使用玻璃基板制造用于曝光的掩模时，凹陷缺陷和/或凸起缺陷不会引起相位缺陷，并且 使用面具。 还公开了用于制造玻璃基板的抛光方法，以及掩模坯料和使用玻璃基板进行曝光的掩模。
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公开(公告)号：US20070259605A1
公开(公告)日：2007-11-08
申请号：US11779441
申请日：2007-07-18
申请人： Koji OTSUKA , Masabumi Ito , Hiroshi Kojima
发明人： Koji OTSUKA , Masabumi Ito , Hiroshi Kojima
CPC分类号： C03C15/02 , C03C19/00 , C03C2204/08
摘要： A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate.
摘要翻译： 提供了一种用于抛光玻璃基板的方法，该玻璃基板能够研磨通过机械抛光形成的具有大波纹度的玻璃基板以具有优异的平面度的表面。 一种用于抛光玻璃基板的方法，包括测量机械抛光的玻璃基板的表面轮廓以识别玻璃基板中存在的波纹宽度的步骤，以及使用在FWHM中具有光束尺寸的光束进行干蚀刻的步骤 （全宽半高）值至多为上述大小的波纹，以研磨玻璃基板的表面。
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6.发明授权Processing method of glass substrate, and highly flat and highly smooth glass substrate 有权玻璃基板的加工方法，以及高度平坦且高度平滑的玻璃基板公开(公告)号：US08137574B2
公开(公告)日：2012-03-20
申请号：US12233884
申请日：2008-09-19
申请人： Koji Otsuka , Hiroshi Kojima , Masabumi Ito
发明人： Koji Otsuka , Hiroshi Kojima , Masabumi Ito
CPC分类号： C03C15/02 , B24B7/242 , B24B37/08 , C03C3/06 , C03C19/00 , C03C23/005 , C03C23/006 , C03C2201/42 , C03C2204/08 , Y10T428/24355
摘要： The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.
摘要翻译： 本发明提供一种以高生产率制造高度平坦且高度光滑的玻璃基板的加工方法。 通过处理玻璃基板，通过加工玻璃基板，以高生产率获得高度平坦且高度平滑的玻璃基板，其包括在处理之前测量玻璃基板的表面形状的步骤，通过改变处理来处理基板的表面的步骤 （第一处理步骤），以及对经过第一处理步骤（第二处理步骤）的玻璃基板的表面进行精抛光的步骤。 此时，根据从处理前的玻璃基板的表面的凹凸形状确定的处理量来确定第一处理工序中的基板的表面内的每个部位的处理条件， 通过使用相似的基板分别测量的第二处理步骤的处理量的平面分布。
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公开(公告)号：US08070557B2
公开(公告)日：2011-12-06
申请号：US12631004
申请日：2009-12-04
申请人： Hiroshi Kojima , Masabumi Ito
发明人： Hiroshi Kojima , Masabumi Ito
IPC分类号： B24B1/00
摘要： An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a method of polishing a glass substrate which comprises polishing a major surface of the glass substrate while feeding a polishing slurry between the glass substrate and a pad surface of a polishing pad, wherein the polishing load of the polishing pad is from 1 to 60 g/cm2. The pad surface of the polishing pact is preferably dressing-processed.
摘要翻译： 本发明的目的是提供一种用于减少用于EUVL等的反射掩模中的玻璃基板的凹陷缺陷的抛光方法。 本发明涉及一种抛光玻璃基板的方法，其中包括在玻璃基板和抛光垫的焊盘表面之间馈送抛光浆料的同时抛光玻璃基板的主表面，其中抛光垫的抛光载荷为1 至60g / cm 2。 抛光体的焊盘表面优选进行修整处理。
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8.发明申请PROCESSING METHOD OF GLASS SUBSTRATE, AND HIGHLY FLAT AND HIGHLY SMOOTH GLASS SUBSTRATE 有权玻璃基板的加工方法，以及高平板和高平板玻璃基板公开(公告)号：US20090017257A1
公开(公告)日：2009-01-15
申请号：US12233884
申请日：2008-09-19
申请人： Koji OTSUKA , Hiroshi Kojima , Masabumi Ito
发明人： Koji OTSUKA , Hiroshi Kojima , Masabumi Ito
CPC分类号： C03C15/02 , B24B7/242 , B24B37/08 , C03C3/06 , C03C19/00 , C03C23/005 , C03C23/006 , C03C2201/42 , C03C2204/08 , Y10T428/24355
摘要： The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.
摘要翻译： 本发明提供一种以高生产率制造高度平坦且高度光滑的玻璃基板的加工方法。 通过处理玻璃基板，通过加工玻璃基板，以高生产率获得高度平坦且高度平滑的玻璃基板，其包括在处理之前测量玻璃基板的表面形状的步骤，通过改变处理来处理基板的表面的步骤 （第一处理步骤），以及对经过第一处理步骤（第二处理步骤）的玻璃基板的表面进行精抛光的步骤。 此时，根据从处理前的玻璃基板的表面的凹凸形状确定的处理量来确定第一处理工序中的基板的表面内的每个部位的处理条件， 通过使用相似的基板分别测量的第二处理步骤的处理量的平面分布。
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公开(公告)号：US20070066066A1
公开(公告)日：2007-03-22
申请号：US11522413
申请日：2006-09-18
申请人： Hiroshi Kojima , Hitoshi Mishiro , Masabumi Ito
发明人： Hiroshi Kojima , Hitoshi Mishiro , Masabumi Ito
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： C09G1/02
摘要： To provide a polishing method for a glass substrate required to have extremely high surface smoothness and surface precision, like a glass substrate to be used for e.g. a reflective mask for extreme ultra violet lithography. A surface of a glass substrate containing SiO2 as the main component, is polished with a polishing slurry comprising colloidal silica having an average primary particle size of at most 50 nm, an acid and water, and having the pH adjusted to be within a range of from 0.5 to 4, so that the surface roughness Rms will be at most 0.15 nm as measured by an atomic force microscope.
摘要翻译： 为了提供具有非常高的表面平滑度和表面精度所需的玻璃基板的抛光方法，例如用于例如玻璃基板的玻璃基板。 用于极紫外光刻的反光罩。 以包含SiO 2作为主要成分的玻璃基板的表面用包含平均一次粒径为至多50nm的胶体二氧化硅，酸和水的抛光浆料抛光，并具有 pH调节在0.5〜4的范围内，使用原子力显微镜测定的表面粗糙度Rms为0.15nm以下。
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公开(公告)号：US07771603B2
公开(公告)日：2010-08-10
申请号：US11779441
申请日：2007-07-18
申请人： Koji Otsuka , Masabumi Ito , Hiroshi Kojima
发明人： Koji Otsuka , Masabumi Ito , Hiroshi Kojima
IPC分类号： C03C15/00
CPC分类号： C03C15/02 , C03C19/00 , C03C2204/08
摘要： A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided.A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate.
摘要翻译： 提供了一种用于抛光玻璃基板的方法，该玻璃基板能够研磨通过机械抛光形成的具有大波纹度的玻璃基板以具有优异的平面度的表面。 一种用于抛光玻璃基板的方法，包括测量机械抛光的玻璃基板的表面轮廓以识别玻璃基板中存在的波纹宽度的步骤，以及使用在FWHM中具有光束尺寸的光束进行干蚀刻的步骤 （全宽半高）值至多为上述大小的波纹，以研磨玻璃基板的表面。
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