利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.027 秒)

    Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same
    5.
    发明授权
    Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same 失效
    发光二极管基板模块及其制造方法，以及背光单元及其制造方法

    公开(公告)号：US08132953B2

    公开(公告)日：2012-03-13

    申请号：US12244393

    申请日：2008-10-02

    申请人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

    发明人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

    IPC分类号： F21V7/04

    CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133612 ,  H05K1/0274 ,  H05K1/053 ,  H05K1/092 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80

    摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

    摘要翻译： 提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。 根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。 通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

    LIGHT EMITTING DIODE SUBSTRATE MODULE AND METHOD OF MANUFACTURING THE SAME, AND BACKLIGHT UNIT AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT EMITTING DIODE SUBSTRATE MODULE AND METHOD OF MANUFACTURING THE SAME, AND BACKLIGHT UNIT AND METHOD OF MANUFACTURING THE SAME 失效
    发光二极管基板模块及其制造方法及背光单元及其制造方法

    公开(公告)号：US20090161343A1

    公开(公告)日：2009-06-25

    申请号：US12244393

    申请日：2008-10-02

    申请人： Jung Kyu PARK ,  Seong Ah Joo ,  Seung Hwan Choi

    发明人： Jung Kyu PARK ,  Seong Ah Joo ,  Seung Hwan Choi

    IPC分类号： G09F13/08 ,  H01L33/00 ,  F21V7/00 ,  H01J9/00 ,  B05D5/00

    CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133612 ,  H05K1/0274 ,  H05K1/053 ,  H05K1/092 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80

    摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

    摘要翻译： 提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。 根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。 通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

    LED light source module and display apparatus including the same
    9.
    发明授权
    LED light source module and display apparatus including the same 有权
    LED光源模块和包括其的显示装置

    公开(公告)号：US08602626B2

    公开(公告)日：2013-12-10

    申请号：US13328564

    申请日：2011-12-16

    申请人： Won Joon Lee ,  Kun Yoo Ko ,  Jin Mo Kim ,  Seung Hwan Choi

    发明人： Won Joon Lee ,  Kun Yoo Ko ,  Jin Mo Kim ,  Seung Hwan Choi

    IPC分类号： F21V8/00

    CPC分类号： G02B6/0073 ,  G02B6/0068 ,  G02B6/0083

    摘要： An LED light source module is provided. The LED light source module includes a circuit board having a first circuit pattern and a second circuit pattern; and a plurality of rectangular LED packages mounted on the circuit board so as to be connected to each of the first and second circuit patterns, and arranged in a row such that each of the LED packages is tilted in a predetermined direction, while long sides of adjacent LED packages facing each other. In addition, a display device having the LED light source module is provided.

    摘要翻译： 提供LED光源模块。 LED光源模块包括具有第一电路图案和第二电路图案的电路板; 以及安装在所述电路板上的多个矩形LED封装件，以连接到所述第一和第二电路图案中的每一个，并且被布置成使得每个所述LED封装件沿预定方向倾斜， 相邻的LED封装彼此面对。 另外，提供具有LED光源模块的显示装置。

    HIGH POWER LIGHT EMITTING DIODE PACKAGE AND METHOD OF PRODUCING THE SAME
    10.
    发明申请
    HIGH POWER LIGHT EMITTING DIODE PACKAGE AND METHOD OF PRODUCING THE SAME 有权
    大功率发光二极管封装及其制造方法

    公开(公告)号：US20090311811A1

    公开(公告)日：2009-12-17

    申请号：US12548565

    申请日：2009-08-27

    申请人： Kyung Seob OH ,  Kae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

    发明人： Kyung Seob OH ,  Kae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

    IPC分类号： H01L21/56

    CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

    摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。