公开(公告)号：US11742229B2

公开(公告)日：2023-08-29

申请号：US17553658

申请日：2021-12-16

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L21/67259 ,  H01J37/32724 ,  H01L21/67161 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/681 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68771 ,  H01L22/20 ,  H01J2237/2446 ,  H01J2237/24578 ,  H01J2237/334 ,  H01J2237/3321 ,  H01L21/6831

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US20230395410A1

公开(公告)日：2023-12-07

申请号：US18448871

申请日：2023-08-11

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66

CPC classification number: H01L21/67259 ,  H01L21/67201 ,  H01L21/68764 ,  H01L21/68 ,  H01L21/67742 ,  H01L21/67161 ,  H01J37/32724 ,  H01L22/20 ,  H01L21/67248 ,  H01L21/68742 ,  H01L21/68771 ,  H01L21/67748 ,  H01L21/67253 ,  H01L21/681 ,  H01J2237/334 ,  H01L21/6831

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US20220108902A1

公开(公告)日：2022-04-07

申请号：US17553658

申请日：2021-12-16

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US12168301B2

公开(公告)日：2024-12-17

申请号：US17435020

申请日：2020-02-27

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard Blank ,  Aravind Alwan ,  Behnam Behziz ,  Peter Thaulad ,  Mark E. Emerson

IPC: B25J11/00 ,  B25J9/16 ,  B25J21/00

Abstract: A robot calibration system includes a calibration fixture configured to be mounted on a substrate processing chamber. The calibration fixture includes at least one camera arranged to capture an image including an outer edge of a test substrate and an edge ring surrounding the test substrate. A controller is configured to receive the captured image, analyze the captured image to measure a distance between the outer edge of the test substrate and the edge ring, calculate a center of the test substrate based on the measured distance, and calibrate a robot configured to transfer substrate to and from the substrate processing chamber based on the calculated center of the test substrate.

公开(公告)号：US20200273731A1

公开(公告)日：2020-08-27

申请号：US16870847

申请日：2020-05-08

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US20190172738A1

公开(公告)日：2019-06-06

申请号：US16000734

申请日：2018-06-05

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US09831110B2

公开(公告)日：2017-11-28

申请号：US14813948

申请日：2015-07-30

Applicant: Lam Research Corporation

Inventor： Gustavo G. Francken ,  Brandon Senn ,  Peter Thaulad ,  Zhuozhi Chen ,  Richard K. Lyons ,  Christian DiPietro ,  Christopher M. Bartlett

IPC: H01L21/68 ,  G06T7/00 ,  G06T7/73 ,  H01L21/67

CPC classification number: H01L21/681 ,  G06T7/0004 ,  G06T7/73 ,  G06T2207/30148 ,  H01L21/67201 ,  H01L21/682 ,  Y10S901/02 ,  Y10S901/47

Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

公开(公告)号：US11239100B2

公开(公告)日：2022-02-01

申请号：US16870847

申请日：2020-05-08

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US10651065B2

公开(公告)日：2020-05-12

申请号：US16000734

申请日：2018-06-05

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US20170032510A1

公开(公告)日：2017-02-02

申请号：US14813948

申请日：2015-07-30

Applicant: Lam Research Corporation

Inventor： Gustavo G. Francken ,  Brandon Senn ,  Peter Thaulad ,  Zhuozhi Chen ,  Richard K. Lyons ,  Christian DiPietro ,  Christopher M. Bartlett

IPC: G06T7/00 ,  H01L21/68

CPC classification number: H01L21/681 ,  G06T7/0004 ,  G06T7/73 ,  G06T2207/30148 ,  H01L21/67201 ,  H01L21/682 ,  Y10S901/02 ,  Y10S901/47

Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

Abstract translation: 晶片对准系统包括捕获位于基座上的晶片的图像的图像捕获装置。 图像分析模块分析图像以检测晶片的边缘和形成在晶片的边缘中的凹口，并基于凹口的位置计算对应于晶片边缘的第一和第二边缘位置。 偏移计算模块，其基于第一位置和第二边缘位置计算晶片的角度偏移。 系统控制模块基于角度偏移来控制晶片从基座到处理单元的传送。