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1.发明授权公开(公告)号：US10989747B2
公开(公告)日：2021-04-27
申请号：US16573994
申请日：2019-09-17
Applicant: Lam Research Corporation
Inventor： Mark E. Emerson , Steven T. Mayer , Lawrence Ossowski
Abstract: A device for measuring electrical properties of electrical contacts within an electroplating apparatus has a disc-shaped structure like that of a wafer. Multiple conductive pads are formed to collectively circumscribe an outer periphery of the disc-shaped structure. Adjacently positioned ones of the conductive pads are electrically isolated from each other. The device includes a current source that supplies electric current at a first terminal and sinks electric current at a second terminal. The device includes measurement circuitry, having first and second input terminals, that determines a value of an electrical parameter based on signals present at the first and second input terminals. The device includes switching circuitry for connecting selected ones of the conductive pads to the first and second terminals of the current source and to the first and second input terminals of the measurement circuitry at a given time. The device also includes an onboard power supply.
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2.发明申请公开(公告)号：US20200011914A1
公开(公告)日：2020-01-09
申请号：US16573994
申请日：2019-09-17
Applicant: Lam Research Corporation
Inventor： Mark E. Emerson , Steven T. Mayer , Lawrence Ossowski
IPC: G01R31/00
Abstract: A device for measuring electrical properties of electrical contacts within an electroplating apparatus has a disc-shaped structure like that of a wafer. Multiple conductive pads are formed to collectively circumscribe an outer periphery of the disc-shaped structure. Adjacently positioned ones of the conductive pads are electrically isolated from each other.The device includes a current source that supplies electric current at a first terminal and sinks electric current at a second terminal. The device includes measurement circuitry, having first and second input terminals, that determines a value of an electrical parameter based on signals present at the first and second input terminals. The device includes switching circuitry for connecting selected ones of the conductive pads to the first and second terminals of the current source and to the first and second input terminals of the measurement circuitry at a given time. The device also includes an onboard power supply.
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3.发明授权公开(公告)号：US12050112B2
公开(公告)日：2024-07-30
申请号：US17877170
申请日：2022-07-29
Applicant: LAM RESEARCH CORPORATION
Inventor： Mark E. Emerson , Nick Ray Linebarger, Jr.
Abstract: A substrate processing system includes a laser triangulation sensor configured to transmit and receive light through a window of an exterior wall of a substrate processing chamber. A controller is configured to: position the laser triangulation sensor such that the laser triangulation sensor transmits light onto a measurement feature arranged between a first surface of a substrate support and a second surface of a gas distribution device, where the second surface faces the first surface; and while the laser triangulation sensor transmits light onto the measurement feature, determine a first distance between the first and second surfaces based on a difference between: a second distance between the laser triangulation sensor and the first surface measured using the laser triangulation sensor; and a third distance between the laser triangulation sensor and the second surface measured using the laser triangulation sensor.
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Patent Agency Ranking
公开(公告)号：US20220254666A1
公开(公告)日：2022-08-11
申请号：US17629752
申请日：2020-07-21
Applicant: Lam Research Corporation
Inventor： Hossein Sadeghi , Richard M. Blank , Peter S. Thaulad , Mark E. Emerson , Arulselvam Simon Jeyapalan , Marco Piccigallo
IPC: H01L21/67 , H01L21/687 , B25J9/16
Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a wafer support of a wafer station of a semiconductor processing tool are disclosed; such techniques and systems may use an autocalibration wafer that may include a plurality of sensors, including a plurality of edge-located imaging sensors that may be used to image fiducials associated with two different structures located in a selected wafer station.
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公开(公告)号：US12168301B2
公开(公告)日：2024-12-17
申请号：US17435020
申请日：2020-02-27
Applicant: LAM RESEARCH CORPORATION
Inventor： Richard Blank , Aravind Alwan , Behnam Behziz , Peter Thaulad , Mark E. Emerson
Abstract: A robot calibration system includes a calibration fixture configured to be mounted on a substrate processing chamber. The calibration fixture includes at least one camera arranged to capture an image including an outer edge of a test substrate and an edge ring surrounding the test substrate. A controller is configured to receive the captured image, analyze the captured image to measure a distance between the outer edge of the test substrate and the edge ring, calculate a center of the test substrate based on the measured distance, and calibrate a robot configured to transfer substrate to and from the substrate processing chamber based on the calculated center of the test substrate.
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6.发明授权公开(公告)号：US11408734B2
公开(公告)日：2022-08-09
申请号：US16238891
申请日：2019-01-03
Applicant: LAM RESEARCH CORPORATION
Inventor： Mark E. Emerson , Nick Ray Linebarger, Jr.
Abstract: A substrate processing system includes a laser triangulation sensor configured to transmit and receive light through a window of an exterior wall of a substrate processing chamber. A controller is configured to: position the laser triangulation sensor such that the laser triangulation sensor transmits light onto a measurement feature arranged between a first surface of a substrate support and a second surface of a gas distribution device, where the second surface faces the first surface; and while the laser triangulation sensor transmits light onto the measurement feature, determine a first distance between the first and second surfaces based on a difference between: a second distance between the laser triangulation sensor and the first surface measured using the laser triangulation sensor; and a third distance between the laser triangulation sensor and the second surface measured using the laser triangulation sensor.
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7.发明授权公开(公告)号：US10436829B2
公开(公告)日：2019-10-08
申请号：US15490503
申请日：2017-04-18
Applicant: Lam Research Corporation
Inventor： Mark E. Emerson , Steven T. Mayer , Lawrence Ossowski
IPC: G01N27/04 , G01R31/26 , G01R31/28 , G01R31/00 , G01R31/44 , C25D17/00 , C25D17/06 , C25D21/12 , H01L21/66
Abstract: A device for measuring electrical properties of electrical contacts within an electroplating apparatus has a disc-shaped structure like that of a wafer. Multiple conductive pads are formed to collectively circumscribe an outer periphery of the disc-shaped structure. Adjacently positioned ones of the conductive pads are electrically isolated from each other. The device includes a current source that supplies electric current at a first terminal and sinks electric current at a second terminal. The device includes measurement circuitry, having first and second input terminals, that determines a value of an electrical parameter based on signals present at the first and second input terminals. The device includes switching circuitry for connecting selected ones of the conductive pads to the first and second terminals of the current source and to the first and second input terminals of the measurement circuitry at a given time. The device also includes an onboard power supply.
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8.发明申请公开(公告)号：US20170307554A1
公开(公告)日：2017-10-26
申请号：US15490503
申请日：2017-04-18
Applicant: Lam Research Corporation
Inventor： Mark E. Emerson , Steven T. Mayer , Lawrence Ossowski
IPC: G01N27/04
CPC classification number: G01R31/00 , C25D17/001 , C25D17/005 , C25D17/06 , C25D21/12 , G01R31/44 , H01L22/14
Abstract: A device for measuring electrical properties of electrical contacts within an electroplating apparatus has a disc-shaped structure like that of a wafer. Multiple conductive pads are formed to collectively circumscribe an outer periphery of the disc-shaped structure. Adjacently positioned ones of the conductive pads are electrically isolated from each other. The device includes a current source that supplies electric current at a first terminal and sinks electric current at a second terminal. The device includes measurement circuitry, having first and second input terminals, that determines a value of an electrical parameter based on signals present at the first and second input terminals. The device includes switching circuitry for connecting selected ones of the conductive pads to the first and second terminals of the current source and to the first and second input terminals of the measurement circuitry at a given time. The device also includes an onboard power supply.
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