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公开(公告)号:US11856830B2
公开(公告)日:2023-12-26
申请号:US17130730
申请日:2020-12-22
Applicant: LG Display Co., Ltd.
Inventor: Jungeun Lee , Chulho Kim , Namkook Kim , Sungwoo Choi , Hwankeon Lee , Youngkyun Moon , Jihun Lee
IPC: H01L27/32 , H10K59/131 , H10K50/824 , H10K71/00 , G09G3/20 , G09G3/3225 , H10K59/122 , H10K59/12
CPC classification number: H10K59/1315 , H10K50/824 , H10K71/00 , G09G3/2003 , G09G3/3225 , G09G2310/08 , G09G2330/00 , H10K59/1201 , H10K59/122
Abstract: The present disclosure relates to a display device and a method of manufacturing the same, the display device including: a substrate including a pixel area and a non-pixel area adjacent to the pixel area; a power line formed on the substrate; at least one insulation layer covering the power line; a connection electrode formed on the at least one insulation layer, and connected to the power line through a contact hole; an overcoat layer placed above the connection electrode in the pixel area; and a first electrode placed above the overcoat layer, wherein the connection electrode has at least an area formed in the non-pixel area, and the first electrode extends to the non-pixel area and is connected to the connection electrode.
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公开(公告)号:US10818868B2
公开(公告)日:2020-10-27
申请号:US16201383
申请日:2018-11-27
Applicant: LG DISPLAY CO., LTD.
Inventor: Jungeun Lee , Chulho Kim , Taejoon Song , Kyu-Hwang Lee
Abstract: An OLED panel for a lighting device is provided. The OLED panel for a lighting device may include a substrate; a first auxiliary wiring pattern disposed on the substrate; a first electrode disposed on a substrate on which the first auxiliary wiring pattern is disposed; a passivation layer disposed on the first electrode within an area where the first auxiliary wiring pattern is disposed; a second auxiliary wiring pattern disposed on the passivation layer to form a plurality of areas partitioned from each other; an OLED light emitting structure disposed in the plurality of areas partitioned by the second auxiliary wiring pattern; a second electrode disposed on the OLED light emitting structure and the second auxiliary wiring pattern; and, an encapsulating layer disposed on the second electrode. The OLED panel for a lighting device may form the respective OLED light emitting structures in an island shape, thereby improving luminance uniformity.
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公开(公告)号:US10802308B2
公开(公告)日:2020-10-13
申请号:US15723760
申请日:2017-10-03
Applicant: LG DISPLAY CO., LTD.
Inventor: Kyuhwang Lee , Yunho Kook , Chulho Kim
IPC: B05C11/06 , B05B12/34 , G02F1/1333 , B05D1/02 , H01L21/67 , G02F1/13 , G03F7/30 , B05D3/04 , B05D1/40 , H01L51/00 , D21H25/16 , B32B17/10 , B32B37/00 , H01L51/56 , B05B12/18 , B05B12/32 , B05B1/14 , B05B13/02 , B21B45/02 , C25D17/00
Abstract: A roll to roll fabrication apparatus includes an injection plate for injecting a chemical treatment liquid on a film transferred from a supplying roll to a collecting roll; and liquid blocking rolls disposed between the supplying roll and the collecting roll, and configured to prevent the chemical treatment liquid injected from the injection plate from being introduced to another process region.
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公开(公告)号:US11899863B2
公开(公告)日:2024-02-13
申请号:US17116595
申请日:2020-12-09
Applicant: LG Display Co., Ltd.
Inventor: Jihun Lee , Chulho Kim , Namkook Kim , Jungeun Lee , Sungwoo Choi , Hwankeon Lee , Youngkyun Moon
CPC classification number: G06F3/0412 , G06F3/0446 , H10K50/844 , H10K59/12 , H10K59/38 , H10K59/40 , H10K71/00 , G06F2203/04103 , G06F2203/04111 , H10K59/1201
Abstract: An organic light emitting diode display device including a touch sensor and a manufacturing method of the same are discussed. The display device includes a substrate having light emitting areas defined therein; light emitting elements provided on the light emitting areas on the substrate; a first encapsulation film covering the light emitting elements; color filters provided on the first encapsulation film to respectively correspond to the light emitting areas; bridge electrodes provided between the plurality of color filters on the first encapsulation film; a bank insulating film provided on the first encapsulation film to cover the bridge electrodes and surround the color filters; touch electrodes provided by being overlapped with the bridge electrodes on the bank insulating film; and a planarization film covering the color filters and the bank insulating film and exposing the touch electrodes.
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公开(公告)号:US20190165306A1
公开(公告)日:2019-05-30
申请号:US16201383
申请日:2018-11-27
Applicant: LG DISPLAY CO., LTD.
Inventor: Jungeun Lee , Chulho Kim , Taejoon Song , Kyu-Hwang Lee
Abstract: An OLED panel for a lighting device is provided. The OLED panel for a lighting device may include a substrate; a first auxiliary wiring pattern disposed on the substrate; a first electrode disposed on a substrate on which the first auxiliary wiring pattern is disposed; a passivation layer disposed on the first electrode within an area where the first auxiliary wiring pattern is disposed; a second auxiliary wiring pattern disposed on the passivation layer to form a plurality of areas partitioned from each other; an OLED light emitting structure disposed in the plurality of areas partitioned by the second auxiliary wiring pattern; a second electrode disposed on the OLED light emitting structure and the second auxiliary wiring pattern; and, an encapsulating layer disposed on the second electrode. The OLED panel for a lighting device may form the respective OLED light emitting structures in an island shape, thereby improving luminance uniformity.
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公开(公告)号:US11152446B2
公开(公告)日:2021-10-19
申请号:US16203285
申请日:2018-11-28
Applicant: LG Display Co., Ltd.
Inventor: Kyu-Hwang Lee , Taejoon Song , Chulho Kim , Jongmin Kim
Abstract: The present application relates to an OLED panel for a lighting device and a method of manufacturing the same. An OLED panel for a lighting device includes: a substrate; a auxiliary wiring pattern having a plurality of wiring lines disposed on the substrate; a first electrode disposed on the substrate where the auxiliary wiring pattern is disposed, and having a planarized upper surface; a passivation layer disposed on the first electrode and disposed at least in an area above the auxiliary wiring pattern; an OLED emission structure disposed on the first electrode; and a second electrode disposed on the OLED emission structure. In the OLED panel for a lighting device, luminance uniformity may be improved through a dual auxiliary wiring pattern, and the upper surface of the first electrode is planarized. Accordingly, the area of the passivation layer is reduced, and thus a light-emitting area may be increased.
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公开(公告)号:US10971572B2
公开(公告)日:2021-04-06
申请号:US16209055
申请日:2018-12-04
Applicant: LG Display Co., Ltd.
Inventor: Kyu-Hwang Lee , Taejoon Song , Chulho Kim , Jungeun Lee , Shin-Bok Lee , Taeok Kim
Abstract: A flexible OLED panel for a lighting device according to the present invention includes a substrate which is made of a polymer material and has a first light extracting pattern provided on a lower surface thereof; an auxiliary wiring pattern which is arranged on the substrate; a first electrode which is arranged on the substrate on which the auxiliary wiring pattern is arranged; a passivation layer which is arranged on the first electrode, at least on an area on which the auxiliary wiring pattern is arranged; an OLED light emitting structure which is arranged on the first electrode on which the passivation layer is arranged; a second electrode which is arranged on the OLED light emitting structure; and an encapsulation layer which is arranged on the second electrode.
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公开(公告)号:US10770674B2
公开(公告)日:2020-09-08
申请号:US16197301
申请日:2018-11-20
Applicant: LG DISPLAY CO., LTD.
Inventor: Kyu-Hwang Lee , Taejoon Song , Chulho Kim , Hwankeon Lee
IPC: H01L51/52 , G09G3/3225 , H01L27/32 , H01L51/00
Abstract: Disclosed herein is an OLED lighting apparatus which can achieve both improvement in reliability and reduction in manufacturing cost. In the OLED lighting apparatus, an encapsulation layer is disposed over the active area and the non-active area on a buffer layer, such that a pad disposed in the non-active area of the buffer layer can be stably secured by the encapsulation layer bonded thereto. Accordingly, upon tape automated bonding between an FPCB substrate with a COF tape attached thereto and a via electrode, the COF tape does not directly contact the pad but contacts the via electrode connected to the pad, particularly a connection terminal of the via electrode disposed on an upper surface of the encapsulation layer, thereby establishing electrical connection between the FPCB substrate and the via electrode. In this way, the connection terminal of the via electrode is electrically connected to the FPCB substrate via the COF tape, whereby a signal from the outside can be applied to the pad connected to the via electrode.
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公开(公告)号:US12150336B2
公开(公告)日:2024-11-19
申请号:US17115553
申请日:2020-12-08
Applicant: LG Display Co., Ltd.
Inventor: Jungeun Lee , Chulho Kim , Namkook Kim , Sungwoo Choi , Hwankeon Lee , Youngkyun Moon , Jihun Lee
IPC: H10K50/858 , H10K59/122 , H10K59/38
Abstract: The present disclosure relates to a display device. More particularly, the present disclosure relates to a display device capable of enhancing efficiency of light emitted from a light-emitting element. A display device according to an embodiment includes a substrate on which areas of pixels composed of multiple subpixels are arranged, a circuit element layer in which circuit elements constituting the multiple subpixels are provided, a light-emitting element layer in which light-emitting elements constituting the multiple subpixels are provided, and a lens placed corresponding to the light-emitting element.
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公开(公告)号:US20190165297A1
公开(公告)日:2019-05-30
申请号:US16197301
申请日:2018-11-20
Applicant: LG DISPLAY CO., LTD.
Inventor: Kyu-Hwang Lee , Taejoon Song , Chulho Kim , Hwankeon Lee
IPC: H01L51/52 , H01L27/32 , G09G3/3225
Abstract: Disclosed herein is an OLED lighting apparatus which can achieve both improvement in reliability and reduction in manufacturing cost. In the OLED lighting apparatus, an encapsulation layer is disposed over the active area and the non-active area on a buffer layer, such that a pad disposed in the non-active area of the buffer layer can be stably secured by the encapsulation layer bonded thereto. Accordingly, upon tape automated bonding between an FPCB substrate with a COF tape attached thereto and a via electrode, the COF tape does not directly contact the pad but contacts the via electrode connected to the pad, particularly a connection terminal of the via electrode disposed on an upper surface of the encapsulation layer, thereby establishing electrical connection between the FPCB substrate and the via electrode. In this way, the connection terminal of the via electrode is electrically connected to the FPCB substrate via the COF tape, whereby a signal from the outside can be applied to the pad connected to the via electrode.
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