公开(公告)号：US20160215172A1

公开(公告)日：2016-07-28

申请号：US15021094

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTOU

IPC: C09J7/00 ,  H01L35/32 ,  C09J9/02

CPC classification number: C09J7/00 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/8116 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  C09J2201/40 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2475/00 ,  C09J2483/00 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34

Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

Abstract translation: 本发明提供一种导热粘合片，其可以容易地层叠在电子设备上，而不会在其间具有粘合剂层，并且可以进一步选择性地在特定方向上散热，以向电子设备的内部提供足够的温差， 制造它们以及使用该装置的电子装置。 本发明包括一种导热粘合片，其包括导热部分和导热性较差的部分，其中高导热部分和低导热部分具有粘合性，并且高导热部分和低导热部分各自 独立地构成导热性粘合片的整个厚度，或者导热性高的导热部或低导热性部中的至少一方构成导热性粘合片的厚度的一部分，以及导热性粘合片的制造方法 ，以及使用导热性粘合片的电子装置。

公开(公告)号：US20240023441A1

公开(公告)日：2024-01-18

申请号：US18034430

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Mutsumi MASUMOTO

IPC: H10N10/01 ,  H10N10/17 ,  H10N10/857

CPC classification number: H10N10/01 ,  H10N10/17 ,  H10N10/857

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).

公开(公告)号：US20160222256A1

公开(公告)日：2016-08-04

申请号：US15021854

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Wataru MORITA ,  Tsuyoshi MUTOU

IPC: C09J9/02 ,  C09J7/02 ,  H01L35/02

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/22 ,  C09J2201/122 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2483/00 ,  H01L35/02 ,  H01L35/32

Abstract: The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a base material comprising a high thermally conductive portion and a low thermally conductive portion; and an adhesive layer, wherein the adhesive layer is laminated on one face of the base material, and the other face of the base material is composed of a face of the low thermally conductive portion opposite to a face in contact with the adhesive layer and a face of the high thermally conductive portion opposite to a face in contact with the adhesive layer, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the base material, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

Abstract translation: 本发明提供一种可以层压在电子设备上以有效散热并选择性地在特定方向上散热以向电子设备内部提供足够的温度差的导热粘合片，其制造方法 ，以及使用该装置的电子装置。 本发明包括一种导热粘合片，其包括包含高导热部分和低导热部分的基底材料; 以及粘合剂层，其中所述粘合剂层层压在所述基材的一个面上，并且所述基材的另一个面由与所述粘合剂层接触的面相对的所述低导热部分的面和 高导热部分与与粘合剂层接触的面相反的表面，或至少高导热部分或低导热部分中的至少一个构成基材厚度的一部分，以及制造 导热性粘合片，以及使用导热性粘合片的电子装置。

公开(公告)号：US20230200240A1

公开(公告)日：2023-06-22

申请号：US18000109

申请日：2021-05-26

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Wataru MORITA ,  Kunihisa KATO

IPC: H10N10/817 ,  H10N10/01 ,  H10N10/17

CPC classification number: H10N10/817 ,  H10N10/01 ,  H10N10/17

Abstract: A thermoelectric conversion module including, a first substrate having a first electrode, a second substrate having a second electrode, a chip of a thermoelectric conversion material made from a thermoelectric semiconductor composition, a first bonding material layer made from a first bonding material and bonding one surface of the chip of the thermoelectric conversion material and the first electrode, and a second bonding material layer made from a second bonding material and bonding another surface of the chip of the thermoelectric conversion material and the second electrode. A melting point of the second bonding material is lower than a melting point of the first bonding material, or the melting point of the second bonding material is lower than a curing temperature of the first bonding material.

公开(公告)号：US20210328124A1

公开(公告)日：2021-10-21

申请号：US17271057

申请日：2019-08-27

Applicant: LINTEC CORPORATION

Inventor： Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTO ,  Yuma KATSUTA

IPC: H01L35/34 ,  H01L35/16

Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.

公开(公告)号：US20230380288A1

公开(公告)日：2023-11-23

申请号：US18034442

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Katsuhiko HORIGOME ,  Mutsumi MASUMOTO

IPC: H10N10/17

CPC classification number: H10N10/17

Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.

公开(公告)号：US20210036203A1

公开(公告)日：2021-02-04

申请号：US16498309

申请日：2018-03-29

Applicant: LINTEC CORPORATION

Inventor： Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTO

IPC: H01L35/32 ,  H01L35/02

Abstract: The present invention provides a thermoelectric conversion device layer having excellent durability and a method of producing the same. Specifically, the present invention provides a thermoelectric conversion device layer including a thermoelectric conversion module including, on one face of a film substrate, a thermoelectric element layer in which a P-type thermoelectric element layer and an N-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series; and further a sealing layer on the face side of the thermoelectric element layer, wherein the sealing layer has a water vapor transmission rate at 40° C. and 90% RH, as prescribed in JIS K7129:2008, of 1,000 g·m−2·day−1 or less; and a method of producing the same.

公开(公告)号：US20210391523A1

公开(公告)日：2021-12-16

申请号：US17282047

申请日：2019-10-02

Applicant: LINTEC CORPORATION

Inventor： Tsuyoshi MUTO ,  Kunihisa KATO ,  Taku NEMOTO ,  Wataru MORITA ,  Yuta SEKI

IPC: H01L35/34 ,  H01L35/32

Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.

公开(公告)号：US20210036202A1

公开(公告)日：2021-02-04

申请号：US16498272

申请日：2017-10-24

Applicant: LINTEC Corporation

Inventor： Yusuke HARA ,  Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTO

IPC: H01L35/32 ,  H01L35/02 ,  H01L35/34

Abstract: The present invention is to provide a thermoelectric conversion module capable of maintaining a thermoelectric performance and revealing excellent insulation properties and a method of producing the same. Provided are a thermoelectric conversion module including a heat dissipation layer via an insulating layer on at least one face of a thermoelectric element layer being one in which a p-type thermoelectric element layer and an n-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series, wherein the insulating layer has an elastic modulus at 23° C. of 0.1 to 500 GPa, and a method of producing the same.

公开(公告)号：US20200066960A1

公开(公告)日：2020-02-27

申请号：US16467745

申请日：2017-12-07

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Wataru MORITA ,  Tsuyoshi MUTOU ,  Yuma KATSUTA ,  Takeshi KONDO

IPC: H01L35/34 ,  H01L35/16 ,  H01L35/26 ,  H01L35/24 ,  B32B27/18 ,  B32B7/02

Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.