公开(公告)号：US20150069450A1

公开(公告)日：2015-03-12

申请号：US14248319

申请日：2014-04-08

Applicant: Lextar Electronics Corporation

Inventor： Chia-Ming SUNG ,  Yu-Chun LEE

IPC: H01L33/62 ,  H01L33/36 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L24/14 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present disclosure provides a light emitting module including a substrate, a light emitting diode, a first adhesive glue, and a second adhesive glue. The substrate has a first electrode and a second electrode. The light emitting diode is disposed on the substrate and has a third electrode and a fourth electrode. The first adhesive glue is located between the first electrode and the second electrode so as to enable the first electrode to be electrically connected to the second electrode. The second adhesive glue is located between the third electrode and the fourth electrode, so as to enable the third electrode to be electrically connected to the fourth electrode. The first adhesive glue includes a first conductive body and a first insulation body surrounding the first conductive body. The second adhesive glue includes a second conductive body and a second insulation body surrounding the second conductive body.

Abstract translation: 本公开提供了一种发光模块，其包括基板，发光二极管，第一粘合胶和第二粘合胶。 基板具有第一电极和第二电极。 发光二极管设置在基板上，具有第三电极和第四电极。 第一胶粘剂位于第一电极和第二电极之间，以使得第一电极能够电连接到第二电极。 第二胶粘剂位于第三电极和第四电极之间，以使得第三电极能够电连接到第四电极。 第一胶粘剂包括第一导电体和围绕第一导电体的第一绝缘体。 第二胶粘剂包括第二导电体和围绕第二导电体的第二绝缘体。

公开(公告)号：US20150076542A1

公开(公告)日：2015-03-19

申请号：US14197648

申请日：2014-03-05

Applicant: Lextar Electronics Corporation

Inventor： Chia-Ming SUNG ,  Liang-Ta LIN ,  Ching-Yao LIN ,  Sheng-Pei LIN

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L33/507

Abstract: The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces adjoined between the upper surface and lower surfaces. A transparent thermoplastic layer encloses at least one portion of the light emitting diode chip. The fluorescent glue disposed over to cover the base board, the light emitting diode chip, and the transparent thermoplastic layer.

Abstract translation: 本公开提供了一种发光模块，其包括基板，发光二极管芯片，透明热塑性层和荧光胶。 基板包括芯片接合区域。 发光二极管芯片接合在芯片接合区上。 发光二极管芯片包括上表面，与上表面相对的下表面以及与上表面和下表面相邻的多个侧表面。 透明热塑性层包围至少一部分发光二极管芯片。 设置在覆盖基板，发光二极管芯片和透明热塑性层的荧光胶。

公开(公告)号：US20140217440A1

公开(公告)日：2014-08-07

申请号：US13902955

申请日：2013-05-27

Applicant: Lextar Electronics Corporation

Inventor： Chia-Ming SUNG

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A light-emitting module includes a first conductive lead frame, a second conductive lead frame physically separated from the first conductive lead frame, a protective plastic layer, a reflective plastic layer, and a light-emitting die. The protective plastic layer surrounds the first and second conductive lead frames, and an accommodating space s defined by the protective plastic layer, and the first and second conductive lead frames. Inner surfaces of the first and second conductive lead frames are exposed through the accommodating space. The accommodating space further includes a die-mounting region. The reflective plastic layer is formed on the inner surfaces within the accommodating space. The light-emitting die is located on the die-mounting region and is electrically connected to the first and second conductive lead frames. The light-emitting die protrudes from the reflective plastic layer.

Abstract translation: 发光模块包括第一导电引线框架，与第一导电引线框架物理分离的第二导电引线框架，保护塑料层，反射塑料层和发光管芯。 保护性塑料层围绕第一和第二导电引线框架，以及由保护性塑料层限定的容纳空间，以及第一和第二导电引线框架。 第一和第二导电引线框架的内表面通过容纳空间露出。 容纳空间还包括管芯安装区域。 反射塑料层形成在容纳空间内的内表面上。 发光管芯位于管芯安装区域上并与第一和第二导电引线框架电连接。 发光模具从反射塑料层突出。