公开(公告)号：US20240343029A1

公开(公告)日：2024-10-17

申请号：US18753478

申请日：2024-06-25

Applicant: Mitsui Chemicals Tohcello, Inc.

Inventor： Masao NOGAMI ,  Akimitsu Morimoto

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

CPC classification number: B32B37/10 ,  B32B37/12 ,  H01L21/67092 ,  H01L21/6836

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

公开(公告)号：US12064946B2

公开(公告)日：2024-08-20

申请号：US17439238

申请日：2020-03-26

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao Nogami ,  Akimitsu Morimoto

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

CPC classification number: B32B37/10 ,  B32B37/12 ,  H01L21/67092 ,  H01L21/6836

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

公开(公告)号：US09822284B2

公开(公告)日：2017-11-21

申请号：US14915587

申请日：2014-08-21

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Shinichi Usugi ,  Kouji Igarashi ,  Akimitsu Morimoto

IPC: H01L21/56 ,  H01L21/67 ,  H01L23/29 ,  C09J7/02 ,  C09J201/00 ,  H01L23/00 ,  B32B7/12 ,  B32B27/06 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  B32B3/08 ,  H01L21/683 ,  B32B25/12 ,  B32B25/18 ,  B32B27/18 ,  B32B27/08

CPC classification number: C09J7/0285 ,  B32B3/085 ,  B32B7/12 ,  B32B25/12 ,  B32B25/18 ,  B32B27/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/306 ,  B32B2307/736 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J7/255 ,  C09J7/385 ,  C09J201/00 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/086 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/26 ,  H01L24/96 ,  H01L2221/68381 ,  H01L2224/12105 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.

公开(公告)号：US20240351323A1

公开(公告)日：2024-10-24

申请号：US18753590

申请日：2024-06-25

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao NOGAMI ,  Akimitsu Morimoto

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

CPC classification number: B32B37/10 ,  B32B37/12 ,  H01L21/67092 ,  H01L21/6836

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

公开(公告)号：US10340172B2

公开(公告)日：2019-07-02

申请号：US15741564

申请日：2016-07-01

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Jun Kamada ,  Noboru Kawasaki ,  Shinichi Usugi ,  Makoto Sukegawa ,  Jin Kinoshita ,  Kouji Igarashi ,  Akimitsu Morimoto

IPC: C09J7/30 ,  B32B27/00 ,  B32B27/30 ,  H01L21/67 ,  C09J133/06 ,  C09J133/10 ,  C09J133/12 ,  C09J201/02 ,  H01L21/283 ,  H01L21/304 ,  H01L21/683 ,  H01L21/687

Abstract: This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G′bmin of the storage elastic modulus G′b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G′b250 at 250° C. of 0.005 MPa or above, and a temperature at which G′bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G′cmin of the storage elastic modulus G′c in the range of 25° C. to less than 250° C. of 0.03 MPa.

公开(公告)号：US12103288B2

公开(公告)日：2024-10-01

申请号：US17439188

申请日：2020-03-26

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao Nogami ,  Akimitsu Morimoto

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

CPC classification number: B32B37/10 ,  B32B37/12 ,  H01L21/67092 ,  H01L21/6836

Abstract: Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

公开(公告)号：US11462482B2

公开(公告)日：2022-10-04

申请号：US16631255

申请日：2018-07-09

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Takashi Unezaki ,  Jun Kamada ,  Akimitsu Morimoto ,  Jin Kinoshita

IPC: H01L23/552 ,  H01L23/00 ,  H05K9/00

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.

公开(公告)号：US09966297B2

公开(公告)日：2018-05-08

申请号：US14894879

申请日：2014-05-22

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Akimitsu Morimoto ,  Makoto Kataoka ,  Hideki Fukumoto

IPC: H01L21/30 ,  H01L21/683 ,  B32B27/30 ,  C09J7/02 ,  B32B27/06 ,  C08F222/10 ,  C09J133/10 ,  B32B27/08 ,  H01L21/02 ,  H01L21/78

CPC classification number: H01L21/6836 ,  B32B27/06 ,  B32B27/08 ,  B32B27/30 ,  B32B2457/14 ,  C08F222/1006 ,  C09J7/29 ,  C09J133/10 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  H01L21/02057 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  C08F2220/1858 ,  C08F2220/1808 ,  C08F2220/325 ,  C08F220/14

Abstract: According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A), in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9.