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    Chip Aware Thermal Policy
    5.
    发明申请
    Chip Aware Thermal Policy 有权

    公开(公告)号：US20170302782A1

    公开(公告)日：2017-10-19

    申请号：US15097429

    申请日：2016-04-13

    Applicant: MEDIATEK INC.

    Inventor： Wei-Ting Wang ,  Han-Lin Li ,  Hong-Jie Huang

    IPC: H04M1/725

    CPC classification number: H04M1/72569 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296

    Abstract: Methods and apparatus are provided for chip aware thermal policies. In one novel aspect, the thermal performance mapping information is generated. In one embodiment, the process obtains a set of process-dependent power data for each process corner of a semiconductor chip, profiles performance data, and selects an operating thermal policy based on the performance data. The thermal policy, based on the process-dependent power data is a mapping formula, or a combination of a mapping formula and a mapping table. In another novel aspect, chip aware thermal control is based on process-dependent power data of process corners. In one embodiment, the mapping information of process-dependent power data to a corresponding thermal policy is stored in a memory. A thermal policy is applied based on the stored mapping information and an obtained process corner information. The mapping information is applied every time the thermal policy is needed or at boot-up time.

    Thermal control method and thermal control system
    6.
    发明授权
    Thermal control method and thermal control system 有权
    热控制方法和热控系统

    公开(公告)号：US09521246B2

    公开(公告)日：2016-12-13

    申请号：US14670418

    申请日：2015-03-27

    Applicant: MEDIATEK INC.

    Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Wen-Tsan Hsieh ,  Tai-Yu Chen ,  Chia-Feng Yeh ,  Chien-Tse Fang

    IPC: H04M1/725 ,  G06F1/20

    CPC classification number: H04M1/72569 ,  G06F1/206 ,  H04M1/72525 ,  H04M1/72577

    Abstract: The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.

    Abstract translation: 本发明提供一种热控制方法和热控制系统。 热控制方法包括：检测电子设备的部件的温度变化以产生检测结果; 以及根据检测结果确定集成电路的温度阈值作为节流点。 热控制系统包括：检测单元，用于检测电子设备的部件的温度变化以产生检测结果; 以及确定单元，用于根据检测结果将集成电路的温度阈值确定为节流点。

    Adaptive Thermal Slope Control
    10.
    发明申请
    Adaptive Thermal Slope Control 审中-公开
    自适应热斜率控制

    公开(公告)号：US20170068261A1

    公开(公告)日：2017-03-09

    申请号：US15257022

    申请日：2016-09-06

    Applicant: MEDIATEK INC.

    Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Tai-Yu Chen ,  Wen-Tsan Hsieh ,  Hong-Jie Huang ,  Pei-Yu Huang ,  Ming-Hsien Lee

    IPC: G05D23/19 ,  G05B13/04

    CPC classification number: G05D23/1917 ,  G06F1/206

    Abstract: Methods and apparatus are provided for adaptive thermal slope control for dynamic thermal management. In one novel aspect, the device monitors and obtains sampling temperatures, calculates a thermal-slope index, determines whether the calculated thermal-slope index is greater than a predefined slope threshold, adjusts a power budget based on a thermal-slope algorithm, and applies the dynamic thermal management (DTM) adaptively based on the adjusted power budget. In one embodiment, fixed slope algorithm is used. The power budget is adjusted such that an adjusted slope of temperatures stays at a constant. In another embodiment, the time prediction algorithm is used. The power budget is adjusted such that a predicted time to reach a predefined thermal threshold stays a constant. In one embodiment, the time-prediction algorithm is a time-to-target-point (T2TP) algorithm. The T2TP is obtained using a linear equation or a LOG equation.

    Abstract translation: 提供了用于动态热管理的自适应热边坡控制的方法和装置。 在一个新颖的方面，设备监测和获取采样温度，计算热斜率指数，确定计算的热斜率指数是否大于预定义的斜率阈值，基于热斜率算法调整功率预算，并应用 基于调整后的功率预算自动进行动态热管理（DTM）。 在一个实施例中，使用固定斜率算法。 调整功率预算，使得调整的温度斜率保持恒定。 在另一个实施例中，使用时间预测算法。 调整功率预算，使得达到预定义热阈值的预测时间保持不变。 在一个实施例中，时间预测算法是时间到目标点（T2TP）算法。 使用线性方程或LOG方程获得T2TP。

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