公开(公告)号：US20230290765A1

公开(公告)日：2023-09-14

申请号：US18064971

申请日：2022-12-13

Applicant: Microchip Technology Incorporated

Inventor： Justin Sato ,  Bomy Chen ,  Julius Kovats ,  Anu Ramamurthy

IPC: H01L25/18 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L25/0652 ,  H01L23/49811 ,  H01L24/40 ,  H01L24/16 ,  H01L24/73 ,  H01L24/48 ,  H01L24/37 ,  H01L24/84 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/37147 ,  H01L2224/40235 ,  H01L2224/48245 ,  H01L2224/73255 ,  H01L2224/40105 ,  H01L2224/40137 ,  H01L2224/40499 ,  H01L2924/0105 ,  H01L2224/84201 ,  H01L2224/95 ,  H01L2224/84007 ,  H01L23/49827 ,  H01L23/481

Abstract: An apparatus having a substrate having first and second substrate contacts; a chip having a front-side chip contact and first and second back-side chip contacts, the front-side chip contact electrically connected to the first substrate contact; a chiplet having a chiplet contact electrically connected the first back-side chip contact; and a lead electrically connected to the second back-side chip contact and electrically connected to the second substrate contact.

公开(公告)号：US20250123125A1

公开(公告)日：2025-04-17

申请号：US18413114

申请日：2024-01-16

Applicant: Microchip Technology Incorporated

Inventor： Anu Ramamurthy ,  Kevin Mark Smith ,  Bomy Chen

IPC: G01D5/20 ,  G01B7/30

Abstract: An inductive sensor device includes at least one die mounted in or on a substrate, a redistribution layer (RDL) region formed over the at least one die and including multiple RDL metal layers, and at least one inductive coil formed in the RDL region and including at least one conductive coil element formed in at least one RDL metal layer of the multiple RDL metal layers, wherein the at least one die includes sensor circuitry connected to the at least one inductive coil to perform sensor measurements.

公开(公告)号：US12040282B2

公开(公告)日：2024-07-16

申请号：US17667275

申请日：2022-02-08

Applicant: Microchip Technology Incorporated

Inventor： Justin Sato ,  Bomy Chen ,  Anu Ramamurthy ,  Julius Kovats

IPC: H01L23/538 ,  H01L25/00 ,  H01L25/10 ,  H01L23/498 ,  H01R12/73

CPC classification number: H01L23/5385 ,  H01L25/105 ,  H01L25/50 ,  H01L23/49811 ,  H01L2225/1023 ,  H01L2225/107 ,  H01R12/737

Abstract: An electronic device includes a first interposer, a first integrated circuit (IC) device affixed to the first interposer, a second interposer, and a second IC device affixed to the second interposer. he second interposer is bonded to the first interposer. The first interposer includes first interposer circuitry and a first connection element electrically connected to the first interposer circuitry. The second interposer includes second interposer circuitry and a second connection element electrically connected to the second interposer circuitry. The second connection element is bonded to the first connection element to define a connection element pair. The connection element pair provides an electrical connection between the first interposer circuitry and the second interposer circuitry.