公开(公告)号：US20190088637A1

公开(公告)日：2019-03-21

申请号：US15711937

申请日：2017-09-21

Applicant: Micron Technology, Inc.

Inventor： Chandra S. Tiwari ,  Tony M. Lindenberg ,  Jonathan S. Hacker ,  Christopher J. Gambee ,  Kurt J. Bossart

IPC: H01L25/00 ,  H01L23/00 ,  H01L21/02

CPC classification number: H01L25/50 ,  H01L21/02021 ,  H01L21/02076 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/71 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A semiconductor device assembly that includes a first side of a semiconductor device supported on a substrate to permit the processing of a second side of the semiconductor device. A filler material deposited on the semiconductor device supports the semiconductor device on the substrate. The filler material does not adhere to the semiconductor device or the substrate. Alternatively, the filler material may be deposited on the substrate. Instead of a filler material, the substrate may include a topography configured to support the semiconductor device. Adhesive applied between an outer edge of the first side of the semiconductor and the substrate bonds the outer edge of the semiconductor device to the substrate to form a semiconductor device assembly. A second side of the semiconductor device may then be processed and the outer edge of the semiconductor device may be cut off to release the semiconductor device from the assembly.

公开(公告)号：US10403618B2

公开(公告)日：2019-09-03

申请号：US15711937

申请日：2017-09-21

Applicant: Micron Technology, Inc.

Inventor： Chandra S. Tiwari ,  Tony M. Lindenberg ,  Jonathan S. Hacker ,  Christopher J. Gambee ,  Kurt J. Bossart

IPC: H01L25/00 ,  H01L23/00 ,  H01L21/02

Abstract: A semiconductor device assembly that includes a first side of a semiconductor device supported on a substrate to permit the processing of a second side of the semiconductor device. A filler material deposited on the semiconductor device supports the semiconductor device on the substrate. The filler material does not adhere to the semiconductor device or the substrate. Alternatively, the filler material may be deposited on the substrate. Instead of a filler material, the substrate may include a topography configured to support the semiconductor device. Adhesive applied between an outer edge of the first side of the semiconductor and the substrate bonds the outer edge of the semiconductor device to the substrate to form a semiconductor device assembly. A second side of the semiconductor device may then be processed and the outer edge of the semiconductor device may be cut off to release the semiconductor device from the assembly.

公开(公告)号：US11094684B2

公开(公告)日：2021-08-17

申请号：US16514159

申请日：2019-07-17

Applicant: Micron Technology, Inc.

Inventor： Chandra S. Tiwari ,  Tony M. Lindenberg ,  Jonathan S. Hacker ,  Christopher J. Gambee ,  Kurt J. Bossart

IPC: H01L25/00 ,  H01L23/00 ,  H01L21/02 ,  H01L21/683

Abstract: A semiconductor device assembly that includes a first side of a semiconductor device supported on a substrate to permit the processing of a second side of the semiconductor device. A filler material deposited on the semiconductor device supports the semiconductor device on the substrate. The filler material does not adhere to the semiconductor device or the substrate. Alternatively, the filler material may be deposited on the substrate. Instead of a filler material, the substrate may include a topography configured to support the semiconductor device. Adhesive applied between an outer edge of the first side of the semiconductor and the substrate bonds the outer edge of the semiconductor device to the substrate to form a semiconductor device assembly. A second side of the semiconductor device may then be processed and the outer edge of the semiconductor device may be cut off to release the semiconductor device from the assembly.

公开(公告)号：US10852344B2

公开(公告)日：2020-12-01

申请号：US15839559

申请日：2017-12-12

Applicant: Micron Technology, Inc.

Inventor： Tony M. Lindenberg ,  Kurt J. Bossart ,  Jonathan S. Hacker ,  Chandra S. Tiwari

IPC: G01R31/28 ,  H01L21/67 ,  G01R1/073 ,  H01L21/68

Abstract: A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3DI structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

公开(公告)号：US20190178933A1

公开(公告)日：2019-06-13

申请号：US15839559

申请日：2017-12-12

Applicant: Micron Technology, Inc.

Inventor： Tony M. Lindenberg ,  Kurt J. Bossart ,  Jonathan S. Hacker ,  Chandra S. Tiwari

IPC: G01R31/28 ,  H01L21/67 ,  H01L21/68 ,  G01R1/073

Abstract: A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3DI structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

公开(公告)号：US20210041495A1

公开(公告)日：2021-02-11

申请号：US17083193

申请日：2020-10-28

Applicant: Micron Technology, Inc.

Inventor： Tony M. Lindenberg ,  Kurt J. Bossart ,  Jonathan S. Hacker ,  Chandra S. Tiwari

IPC: G01R31/28 ,  H01L21/67 ,  G01R1/073 ,  H01L21/68

Abstract: A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3D interconnect (3DI) structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

公开(公告)号：US20190341378A1

公开(公告)日：2019-11-07

申请号：US16514159

申请日：2019-07-17

Applicant: Micron Technology, Inc.

Inventor： Chandra S. Tiwari ,  Tony M. Lindenberg ,  Jonathan S. Hacker ,  Christopher J. Gambee ,  Kurt J. Bossart

IPC: H01L25/00 ,  H01L23/00 ,  H01L21/02 ,  H01L21/683

Abstract: A semiconductor device assembly that includes a first side of a semiconductor device supported on a substrate to permit the processing of a second side of the semiconductor device. A filler material deposited on the semiconductor device supports the semiconductor device on the substrate. The filler material does not adhere to the semiconductor device or the substrate. Alternatively, the filler material may be deposited on the substrate. Instead of a filler material, the substrate may include a topography configured to support the semiconductor device. Adhesive applied between an outer edge of the first side of the semiconductor and the substrate bonds the outer edge of the semiconductor device to the substrate to form a semiconductor device assembly. A second side of the semiconductor device may then be processed and the outer edge of the semiconductor device may be cut off to release the semiconductor device from the assembly.

公开(公告)号：US20170256501A1

公开(公告)日：2017-09-07

申请号：US15062452

申请日：2016-03-07

Applicant: Micron Technology, Inc.

Inventor： Yang Chao ,  Joseph L. Hess ,  Keith E. Ypma ,  Kurt J. Bossart

IPC: H01L23/544 ,  G06T11/20 ,  H01L21/66 ,  H01L25/065 ,  H01L21/67 ,  H01L21/68 ,  H01L25/00 ,  G06T7/00 ,  H01L23/48

CPC classification number: H01L23/544 ,  G03F7/70633 ,  G06T7/001 ,  G06T7/11 ,  G06T7/73 ,  G06T11/20 ,  G06T2207/30148 ,  G06T2207/30204 ,  H01L21/67259 ,  H01L21/681 ,  H01L22/12 ,  H01L22/20 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541

Abstract: A method of determining a lateral misregistration between levels of a semiconductor structure comprises imaging at least one first alignment mark in a first level of the structure and at least one second alignment mark in a second level of the structure. A digital image of the first and second alignment marks is formed, each of which are defined by a set of points having an x-value and a y-value. The x-values and y-values of points defining the first alignment mark and points defining the second alignment mark are averaged to determine a center of the first alignment mark and a center of the second alignment mark. An x-coordinate and a y-coordinate of the center of the first alignment mark is subtracted from the respective x-coordinate and y-coordinate of the center of the second alignment mark to determine a lateral misregistration between the first level and the second level. Related methods of forming a semiconductor wafer, semiconductor assembles and metrology tools for use in implementing the methods are disclosed.

公开(公告)号：US09754895B1

公开(公告)日：2017-09-05

申请号：US15062452

申请日：2016-03-07

Applicant: Micron Technology, Inc.

Inventor： Yang Chao ,  Joseph L. Hess ,  Keith E. Ypma ,  Kurt J. Bossart

IPC: G02F1/1333 ,  H01J9/20 ,  H01L23/544 ,  G06T7/00 ,  G06T11/20 ,  H01L21/66 ,  H01L23/48 ,  H01L21/67 ,  H01L21/68 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  G03F7/70633 ,  G06T7/001 ,  G06T7/11 ,  G06T7/73 ,  G06T11/20 ,  G06T2207/30148 ,  G06T2207/30204 ,  H01L21/67259 ,  H01L21/681 ,  H01L22/12 ,  H01L22/20 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541

Abstract: A method of determining a lateral misregistration between levels of a semiconductor structure comprises imaging at least one first alignment mark in a first level of the structure and at least one second alignment mark in a second level of the structure. A digital image of the first and second alignment marks is formed, each of which are defined by a set of points having an x-value and a y-value. The x-values and y-values of points defining the first alignment mark and points defining the second alignment mark are averaged to determine a center of the first alignment mark and a center of the second alignment mark. An x-coordinate and a y-coordinate of the center of the first alignment mark is subtracted from the respective x-coordinate and y-coordinate of the center of the second alignment mark to determine a lateral misregistration between the first level and the second level. Related methods of forming a semiconductor wafer, semiconductor assembles and metrology tools for use in implementing the methods are disclosed.