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1.
公开(公告)号:US20220068956A1
公开(公告)日:2022-03-03
申请号:US17008130
申请日:2020-08-31
Applicant: Micron Technology, Inc.
Inventor: Darwin A. Clampitt , Shawn D. Lyonsmith , Matthew J. King , Lisa M. Clampitt , John Hopkins , Kevin Y. Titus , Indra V. Chary , Martin Jared Barclay , Anilkumar Chandolu , Pavithra Natarajan , Roger W. Lindsay
IPC: H01L27/11582 , H01L23/528 , H01L23/522 , H01L27/11565
Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first deck located over a substrate, and a second deck located over the first deck, and pillars extending through the first and second decks. The first deck includes first memory cells, first control gates associated with the first memory cells, and first conductive paths coupled to the first control gates. The second conductive paths include second conductive pads located on a first level of the apparatus over the substrate. The second deck includes second memory cells, second control gates associated with the second memory cells, and second conductive paths coupled to the second control gates. The second conductive paths include second conductive pads located on a second level of the apparatus. The first and second conductive pads having lengths in a direction perpendicular to a direction from the first deck to the second deck.
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2.
公开(公告)号:US20230117100A1
公开(公告)日:2023-04-20
申请号:US18083991
申请日:2022-12-19
Applicant: Micron Technology, Inc.
Inventor: Darwin A. Clampitt , Shawn D. Lyonsmith , Matthew J. King , Lise M. Clampitt , John Hopkins , Kevin Y. Titus , Indra V. Chary , Martin Jared Barclay , Anilkumar Chandolu , Pavithra Natarajan , Roger W. Lindsay
IPC: H10B43/27 , H01L23/528 , H10B43/10 , H01L23/522 , H01L21/02 , H10B51/20 , H01L21/67
Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first deck located over a substrate, and a second deck located over the first deck, and pillars extending through the first and second decks. The first deck includes first memory cells, first control gates associated with the first memory cells, and first conductive paths coupled to the first control gates. The second conductive paths include second conductive pads located on a first level of the apparatus over the substrate. The second deck includes second memory cells, second control gates associated with the second memory cells, and second conductive paths coupled to the second control gates. The second conductive paths include second conductive pads located on a second level of the apparatus. The first and second conductive pads having lengths in a direction perpendicular to a direction from the first deck to the second deck.
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3.
公开(公告)号:US11532638B2
公开(公告)日:2022-12-20
申请号:US17008130
申请日:2020-08-31
Applicant: Micron Technology, Inc.
Inventor: Darwin A. Clampitt , Shawn D. Lyonsmith , Matthew J. King , Lisa M. Clampitt , John Hopkins , Kevin Y. Titus , Indra V. Chary , Martin Jared Barclay , Anilkumar Chandolu , Pavithra Natarajan , Roger W. Lindsay
IPC: H01L27/11582 , H01L23/528 , H01L27/11565 , H01L23/522 , H01L27/11597 , H01L21/02 , H01L21/67 , G11C16/04
Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first deck located over a substrate, and a second deck located over the first deck, and pillars extending through the first and second decks. The first deck includes first memory cells, first control gates associated with the first memory cells, and first conductive paths coupled to the first control gates. The second conductive paths include second conductive pads located on a first level of the apparatus over the substrate. The second deck includes second memory cells, second control gates associated with the second memory cells, and second conductive paths coupled to the second control gates. The second conductive paths include second conductive pads located on a second level of the apparatus. The first and second conductive pads having lengths in a direction perpendicular to a direction from the first deck to the second deck.
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